High heat-resistance liquid modified bimaleimide resin and preparation method thereof

A bismaleimide resin and bismaleimide technology are applied in the field of high heat-resistant liquid modified bismaleimide resin and its preparation, which can solve the problem of being unusable and not taking into account heat resistance. and other problems, to achieve the effect of easy control, excellent heat resistance, simple and reliable process

Active Publication Date: 2016-02-03
SHAANXI TIANCE NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the glass transition temperature of this resin curing system can only reach 261 ° C, without taking into account the improvement of heat resistance, and cannot be used in fields that require a glass transition temperature higher than 280 ° C or higher heat resistance levels

Method used

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  • High heat-resistance liquid modified bimaleimide resin and preparation method thereof
  • High heat-resistance liquid modified bimaleimide resin and preparation method thereof
  • High heat-resistance liquid modified bimaleimide resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] In a 500ml glass bottle equipped with a thermometer, an addition funnel and a mechanical stirring device, add 80g of 3-aminobenzocyclobutene, raise the temperature to 135°C, and add 160g of 4,4'-bismaleoyl within 1 hour imine diphenylmethane, and continue to insulate the reaction for 2 hours to obtain a uniform and transparent brown-red prepolymer.

[0055] Cool down to 80°C within 30 minutes, add 36g of bisphenol A diallyl ether and 12g of divinylbenzene, and keep the temperature for 15 minutes.

[0056] After the system is cooled to room temperature, add 24 g of 2-methylimidazole / cobalt acetylacetonate butanone solution with a solute ratio of 10%, stir evenly, and evaporate the mixed solution on a rotary evaporator at 40°C to obtain a liquid brownish red Transparent resin.

[0057] The viscosity of the resin at 30°C is 289cP when tested by a rotational viscometer, showing excellent fluidity and excellent processing performance.

[0058] The curing activity of the ob...

Embodiment 2

[0061] In a 500ml glass bottle equipped with a thermometer, an addition funnel and a mechanical stirring device, add 80g of 3-aminobenzocyclobutene, raise the temperature to 135°C, and add 160g of 4,4'-bismaleoyl within 1 hour imine diphenyl ether, and continue to keep warm for 2 hours to obtain a uniform and transparent brown-red prepolymer.

[0062] Cool down to 80°C within 30 minutes, add 36g of bisphenol A diallyl ether and 12g of divinylbenzene, and keep the temperature for 15 minutes.

[0063] After the system is cooled to room temperature, add 24g of acetone solution of 2-methylimidazole / iron acetylacetonate with a solute ratio of 10%, stir evenly, and evaporate the mixed solution on a rotary evaporator at 30°C to remove the solvent to obtain a liquid brownish-red transparent resin.

Embodiment 3

[0065] In a 500ml glass bottle equipped with a thermometer, an addition funnel and a mechanical stirring device, add 80g of 3-aminobenzocyclobutene, raise the temperature to 135°C, and add 140g of 4,4'-bismaleoyl within 1 hour imine diphenyl ether, and continue to keep warm for 2 hours to obtain a uniform and transparent brown-red prepolymer.

[0066] Cool down to 80°C within 30 minutes, add 36g of bisphenol A diallyl ether and 12g of divinylbenzene, and keep the temperature for 15 minutes.

[0067] After the system is cooled to room temperature, add 22 g of 2-ethyl-4-methylimidazole / nickel acetylacetonate in acetone solution with a solute ratio of 10%, stir evenly, and evaporate the mixed solution on a rotary evaporator at 35°C to remove the solvent, namely A liquid brown-red transparent resin was obtained.

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Abstract

The invention relates to high heat-resistance liquid modified bimaleimide resin and a preparation method thereof. In the current bismaleimide resin modification method, defects that melting temperature is high, a winding moulding technology cannot be satisfied, and heat resistance enhancement is not considered are existed in the current bimaleimide resin modification methods, 3-aminobenzocyclobutene and a bimaleimide monomer are subjected to a Michael addition fuse polymerization to form a performed polymer, an active diluent is added after cooling the performed polymer for insulation, a solution with a dissolved catalyst is added after cooling the material, then the solution is uniformly mixed, and then the solution with the dissolved catalyst can be removed through vacuum steaming to obtain the high heat-resistance liquid modified bimaleimide resin. The provided resin system presents a flow liquid state under normal temperature, is an unusual type in a bimaleimide resin field, presents good processing technology, is suitable for moulding of a plurality of composite materials, especially suitable for RTM (Resin Transfer Molding) and winding, can be taken as base resin of a high-grade copper-clad plate, and also can be used for advanced composite materials or high temperature-resistance adhesives in the fields of aviation spaceflight and traffic transport.

Description

technical field [0001] The invention belongs to the technical field of bismaleimide resins, and in particular relates to a liquid-modified bismaleimide resin with high heat resistance and a preparation method thereof. Background technique [0002] Bismaleimide can be considered as a high-performance thermosetting resin derived from polyimide, which combines the ease of processing of resins such as epoxy and the high strength, high heat resistance, and electrical insulation of polyimide As well as weather resistance, it has become one of the most promising composite resin matrices in the aerospace field, and has or will make great progress in the fields of microelectronics and military industry. [0003] However, Shuangma resin also has some shortcomings, which hinder its wide application in some fields. There are three main reasons: high resin softening point, high curing temperature, and high brittleness of the cured product. For more than half a century, domestic and fore...

Claims

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Application Information

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IPC IPC(8): C08G73/12
Inventor 赵宗严江汛张鸿翔
Owner SHAANXI TIANCE NEW MATERIAL TECH
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