Cyanide-free alkaline copper electroplating solution and electroplating technology
A cyanide-free alkaline copper plating and electroplating process technology, which is applied in the field of electrochemical copper plating, can solve the problems that electroplating cannot be achieved, zinc alloy die-castings do not have an excellent and effective cyanide-free copper plating process, and the bonding force is not strong. Good force, fast deposition speed, and stable plating solution
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Embodiment 1
[0016] (1) Fine polishing: Use a grinder to finely polish the iron-based workpiece until the surface roughness Ra is less than or equal to 0.1.
[0017] (2) Chemical degreasing: Use LD-1146 chemical degreasing agent to treat the workpiece polished in step (1), the operating temperature is 70°C, and the processing time is 10 minutes.
[0018] (3) Electrolytic degreasing: LD-1160 is used as the electrolyte, the workpiece after chemical degreasing is used as the cathode, the pure iron plate is used as the anode, and the current density is 5A / dm 2 , the operating temperature is maintained at 60°C, and the cathode degreasing time is 5 minutes.
[0019] (4) pickling activation: the workpiece after electrolytic degreasing was immersed in 20% hydrochloric acid solution for pickling and activation for 1 min, and dried for use.
[0020] (5) Plating: The composition of cyanide-free alkaline copper plating solution is copper sulfate 5 / L, sodium acetate 25g / L, 5,5 dimethylhydantoin 100g / L...
Embodiment 2
[0028] Steps (1)-(4) are the same as steps (1)-(4) in Example 1.
[0029] (5) Plating: The cyanide-free alkaline copper plating solution is composed of copper sulfate 27g / L, sodium acetate 50g / L, 5,5 dimethylhydantoin 5g / L, sodium gluconate 2g / L, chloride Sodium 30g / L, succinic acid 25g / L, tetraethylenepentamine 2g / L, thiazole 0.1g / L.
[0030] Select a 5L standard experimental electroplating tank, mix the plating solution according to the above ratio and pour it into the electroplating tank, use the pretreated substrate to be plated as the cathode, and the pure copper plate as the anode, the area ratio of the cathode and anode plates is 1:2.5, and the current Density 4.0A / dm 2 , the operating temperature is 55°C, the pH of the solution is adjusted to 9.5 with 30% sulfuric acid or 40% potassium hydroxide, the air is kept stirring during the plating process, and the plating time is 30min.
[0031] (6) Test methods and test results of plating solution and coating performance
...
Embodiment 3
[0037] Steps (1)-(4) are the same as steps (1)-(4) in Example 1.
[0038] (5) Plating: The composition of cyanide-free alkaline copper plating solution is copper sulfate 50g / L, sodium acetate 2g / L, 5,5 dimethylhydantoin 52g / L, sodium gluconate 100g / L, chloride Sodium 1g / L, succinic acid 1g / L, tetraethylenepentamine 40g / L, thiazole 0.05g / L.
[0039]Select a 5L standard experimental electroplating tank, mix the plating solution according to the above ratio and pour it into the electroplating tank, use the pretreated substrate to be plated as the cathode, and the pure copper plate as the anode, the area ratio of the cathode and anode plates is 1:2.5, and the current Density 0.2A / dm 2 , the operating temperature is 60°C, the pH of the solution is adjusted to 9.0 with 30% sulfuric acid or 40% potassium hydroxide, the air is kept stirring during the plating process, and the plating time is 60min.
[0040] (6) Test methods and test results of plating solution and coating performanc...
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