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Cyanide-free alkaline copper electroplating solution and electroplating technology

A cyanide-free alkaline copper plating and electroplating process technology, which is applied in the field of electrochemical copper plating, can solve the problems that electroplating cannot be achieved, zinc alloy die-castings do not have an excellent and effective cyanide-free copper plating process, and the bonding force is not strong. Good force, fast deposition speed, and stable plating solution

Inactive Publication Date: 2016-05-04
CHONGQING LIDAO SURFACE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these processes cannot completely replace the cyanide copper plating process due to their own shortcomings, especially for the problem of direct bottom copper plating on zinc alloy die castings, there is still no better process that can be compared with the cyanide copper plating process. Compare
[0004] The biggest problem to be solved by the cyanide-free copper plating process to replace the cyanide copper plating process is to solve the problem that the matrix metals such as iron and zinc are easily replaced by copper ions in the plating solution, thereby forming a loose replacement layer. The combination with the substrate is not strong, and the purpose of electroplating cannot be achieved
Most of the cyanide-free copper plating processes researched and developed at present have only overcome the replacement phenomenon to a certain extent. There is no good and effective cyanide-free copper plating process for copper plating on zinc alloy die castings.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] (1) Fine polishing: Use a grinder to finely polish the iron-based workpiece until the surface roughness Ra is less than or equal to 0.1.

[0017] (2) Chemical degreasing: Use LD-1146 chemical degreasing agent to treat the workpiece polished in step (1), the operating temperature is 70°C, and the processing time is 10 minutes.

[0018] (3) Electrolytic degreasing: LD-1160 is used as the electrolyte, the workpiece after chemical degreasing is used as the cathode, the pure iron plate is used as the anode, and the current density is 5A / dm 2 , the operating temperature is maintained at 60°C, and the cathode degreasing time is 5 minutes.

[0019] (4) pickling activation: the workpiece after electrolytic degreasing was immersed in 20% hydrochloric acid solution for pickling and activation for 1 min, and dried for use.

[0020] (5) Plating: The composition of cyanide-free alkaline copper plating solution is copper sulfate 5 / L, sodium acetate 25g / L, 5,5 dimethylhydantoin 100g / L...

Embodiment 2

[0028] Steps (1)-(4) are the same as steps (1)-(4) in Example 1.

[0029] (5) Plating: The cyanide-free alkaline copper plating solution is composed of copper sulfate 27g / L, sodium acetate 50g / L, 5,5 dimethylhydantoin 5g / L, sodium gluconate 2g / L, chloride Sodium 30g / L, succinic acid 25g / L, tetraethylenepentamine 2g / L, thiazole 0.1g / L.

[0030] Select a 5L standard experimental electroplating tank, mix the plating solution according to the above ratio and pour it into the electroplating tank, use the pretreated substrate to be plated as the cathode, and the pure copper plate as the anode, the area ratio of the cathode and anode plates is 1:2.5, and the current Density 4.0A / dm 2 , the operating temperature is 55°C, the pH of the solution is adjusted to 9.5 with 30% sulfuric acid or 40% potassium hydroxide, the air is kept stirring during the plating process, and the plating time is 30min.

[0031] (6) Test methods and test results of plating solution and coating performance

...

Embodiment 3

[0037] Steps (1)-(4) are the same as steps (1)-(4) in Example 1.

[0038] (5) Plating: The composition of cyanide-free alkaline copper plating solution is copper sulfate 50g / L, sodium acetate 2g / L, 5,5 dimethylhydantoin 52g / L, sodium gluconate 100g / L, chloride Sodium 1g / L, succinic acid 1g / L, tetraethylenepentamine 40g / L, thiazole 0.05g / L.

[0039]Select a 5L standard experimental electroplating tank, mix the plating solution according to the above ratio and pour it into the electroplating tank, use the pretreated substrate to be plated as the cathode, and the pure copper plate as the anode, the area ratio of the cathode and anode plates is 1:2.5, and the current Density 0.2A / dm 2 , the operating temperature is 60°C, the pH of the solution is adjusted to 9.0 with 30% sulfuric acid or 40% potassium hydroxide, the air is kept stirring during the plating process, and the plating time is 60min.

[0040] (6) Test methods and test results of plating solution and coating performanc...

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Abstract

The invention discloses a cyanide-free alkaline copper electroplating solution and an electroplating technology and belongs to an environment-friendly high-performance copper electroplating technology. The technological process is as follows: fine polishing and grinding, chemical degreasing, electrolytic degreasing, pickling and activation as well as electroplating. On the premise that the good binding force between plating and a matrix is guaranteed, the covering power and the throwing power of the copper plating obtained through electroplating with the technology are superior to those of copper plating obtained through electroplating with a cyanide copper electroplating technology, the porosity and the toughness of the plating can reach the level of the cyanide copper electroplating technology, and the electroplating solution and the electroplating technology are suitable for direct copper electroplating of aluminium alloy and zinc alloy die-casting matrixes as well as copper electroplating of steel and copper matrixes. Meanwhile, the copper electroplating solution is good in stability and high in current efficiency, wastewater treatment is simple, and the plating is uniform, compact, soft and shining, has no hydrophobicity, requires no film removal and can be directly used for subsequent electroplating of other metals.

Description

technical field [0001] The invention belongs to the technical field of electrochemical copper plating, in particular to a cyanide-free alkaline copper plating electroplating solution and an electroplating process. Background technique [0002] Copper is a soft, plastic, slightly reddish metal with good electrical and thermal conductivity and good ductility. Copper plating is generally used as a decorative intermediate coating to protect base metals such as zinc and iron. There are many copper plating solutions for obtaining copper plating, and the commonly used ones are only cyanide copper solution, acid sulfate copper solution and pyrophosphate copper solution. Iron and steel parts and zinc alloy parts cannot be directly plated with copper in acidic sulfate bath and pyrophosphate bath, because if these parts are directly immersed in these baths, there will be a substitution reaction before the current is turned on, resulting in A layer of loose replacement coating affects ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/36
CPCC25D3/38C25D5/36
Inventor 胡国辉王东风刘军肖春燕包海生陶熊新
Owner CHONGQING LIDAO SURFACE TECH
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