Preparation method for superfine copper nano particles

Abstract

The invention provides a method for preparing superfine copper nano particles by utilizing immiscible liquid-liquid two-phase interface reaction. The method comprises the following steps of firstly, dissolving a copper salt into a non-polar solvent to prepare a copper-containing source solution or dissolving a copper salt into a non-polar solvent and then emulsifying witha polar solvent to prepare a copper-containing source solution, and dissolving a reducing agent into the polar solvent to prepare a reducing solution; forming an immiscible two-phase system by the reducing solution and the copper-containing source solution, thereby obtaining a stable liquid-liquid interface; and at certain temperature, reacting at the liquid-liquid interface to generate the superfine copper nano particles. The method can be used for preparing the superfine copper nano particles with particle diameters smaller than 10 nanometers, and the superfine copper nano particles have fewer impurities, pure components, good crystallization quality, and uniform sizes and morphology, can be stably dispersed into the immiscible two-phase system obtained by reaction without surface modifying and coating, and can standfor a long time in normal-temperature air without being oxidized. The method is simple, is low in energy consumption, is low in cost, is easy to control, and is high in practicability, and can be used for continuously preparing and gathering the superfine copper nano particles. Preferably, water and oleic acid are adopted as a solvent, so that the preparation method is enabled to be non-toxic and environmentally-friendly.

Description

technical field [0001] The invention relates to a method for preparing nanometer materials, in particular to a method for preparing ultrafine copper nanoparticles by utilizing immiscible solution-liquid two-phase interface reaction. Background technique [0002] Copper nanoparticles have unique catalytic, biological, optical and electrical properties due to size effects, surface effects and quantum scale effects, and are widely used in electronics manufacturing, chemical analysis, biotechnology, anti-corrosion and anti-fouling and other fields. There are many methods for preparing copper nanoparticles commonly used, such as chemical reduction method, electrochemical reduction method, gas phase reaction method, evaporation or sputtering method, mechanical nodule or pulverization method, laser ablation or high-energy radiation synthesis method, etc. However, there are still many difficulties in the preparation and application of copper nanoparticles. One is that it is difficu...

AI Technical Summary

Problems solved by technology

However, the coating method will also increase the cost and change the properties of nanoparticles, especially the long-chain organic coatings are difficult to remove in subsequent processes, so they cannot be used in some applications

[0003] So far, there is no reliable preparation method for the preparation of ultrafine copper nanoparticles with a particle size below 10nm reported in the literature