Surface treatment composite additive capable of improving corrosion resistance of copper foil

A compound additive and surface treatment technology, applied in the field of electrolytic copper foil processing, can solve the problems of edge corrosion, complex process, unenvironmental protection, etc., and achieve the effects of fine and tight crystallization, flat and uniform coating, and simple production process

Inactive Publication Date: 2017-01-18
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development of PCB technology, many environments, conditions, and methods are different from the past. The advancement of technology has brought a series of new requirements for material applications. The corrosion resistance of copper foil surface can no longer meet the requirements of high-density thin-line and miniaturization of printed boards. requirements
The corrosion resistance of copper foil is achieved by forming galvanized or galvanized alloy on the surface of copper foil. General galvanized, galvanized nickel, zinc-tin and other alloy processes have the effect of corrosion resistance, but because the crystallization of the alloy layer is not fine and uniform , the corrosion resistance cannot reach the ideal effect, r

Method used

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  • Surface treatment composite additive capable of improving corrosion resistance of copper foil
  • Surface treatment composite additive capable of improving corrosion resistance of copper foil
  • Surface treatment composite additive capable of improving corrosion resistance of copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A surface treatment composite additive for improving the corrosion resistance of copper foil, containing: 1.2g polyethylene glycol, 0.4g cerium nitrate, 6.0g sodium dodecylbenzenesulfonate and 0.6g chitosan in every liter of the aqueous solution of the composite additive sugar.

[0024] The existing copper foil production process is used to produce 18μm copper foil for surface treatment. The copper foil surface treatment process used is: roughening-curing-galvanizing-anti-oxidation-coating silane coupling agent-drying. Use the compound additive that present embodiment makes in the galvanizing process, contain in the galvanizing solution: Zn 2+ 2-4g / L, Ni 2+ 0.3-0.9g / L, potassium pyrophosphate 200-300g / L, pH 8-10, temperature 30-40℃, current density 1.5-3A / dm 2 .

[0025] The surface-treated copper foil was pressed against the FR-4 base material to test the copper foil's anti-peel strength, hydrochloric acid degradation resistance, side corrosion and other properties....

Embodiment 2

[0027] A surface treatment composite additive for improving the corrosion resistance of copper foil, containing: 2.0g polyethylene glycol, 0.6g cerium chloride, 13g sodium dodecylbenzenesulfonate and 0.8g chitosan in every liter of the aqueous solution of the composite additive sugar.

[0028] The existing copper foil production process is used to produce 18μm copper foil for surface treatment. The copper foil surface treatment process used is: roughening-curing-galvanizing-anti-oxidation-coating silane coupling agent-drying. Use the compound additive that present embodiment makes in the galvanizing process, contain in the galvanizing solution: Zn 2+ 2-4g / L, Ni 2+ 0.3-0.9g / L, potassium pyrophosphate 200-300g / L, pH 8-10, temperature 30-40℃, current density 1.5-3A / dm 2 .

[0029] The surface-treated copper foil was pressed against the FR-4 base material to test the copper foil's anti-peel strength, hydrochloric acid degradation resistance, side corrosion and other properties....

Embodiment 3

[0031] A surface treatment composite additive for improving the corrosion resistance of copper foil, containing 4.0g of polyethylene glycol, 0.6g of lanthanum nitrate, 4.0g of sodium dodecylbenzenesulfonate and 1.0g of chitosan in each liter of the aqueous solution of the composite additive sugar.

[0032] The existing copper foil production process is used to produce 18μm copper foil for surface treatment. The copper foil surface treatment process used is: roughening-curing-galvanizing-anti-oxidation-coating silane coupling agent-drying. Use the compound additive that present embodiment makes in the galvanizing process, contain in the galvanizing solution: Zn 2+ 2-4g / L, Ni 2+ 0.3-0.9g / L, potassium pyrophosphate 200-300g / L, pH 8-10, temperature 30-40℃, current density 1.5-3A / dm 2 .

[0033] The surface-treated copper foil was pressed against the FR-4 base material to test the copper foil's anti-peel strength, hydrochloric acid degradation resistance, side corrosion and othe...

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Abstract

The invention belongs to the technical field of electrolytic copper foil processing and particularly relates to a surface treatment composite additive capable of improving the corrosion resistance of copper foil. Every liter of the aqueous solution of the composite additive contains 1.0-10 g of polyethylene glycol, 0.1-5.0 g of rare-earth salt, 0.1-15 g of sodium dodecyl benzene sulfonate and 0.2-3.0 g of chitosan. The prepared composite additive is good in control performance and high in stability. The composite additive is used during galvanization, and thus the crystal morphology of a coating can be changed. The coating on the surface of the produced copper foil is smooth and uniform, crystals are fine and compact, the hydrochloric acid degradation resistant rate of the copper foil is lower than 3%, and good corrosion resistance is achieved. In addition, the production process is simple and environmentally friendly, the cost is low, waste foil obtained after surface treatment can also be recycled, and the index of the copper foil is not influenced.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil processing, and in particular relates to a surface treatment composite additive for improving the corrosion resistance of copper foil. Background technique [0002] Copper foil is one of the important electronic materials in my country's information industry. It is an important material for the manufacture of copper clad laminates (CCL for short) and printed circuit boards (also known as printed circuit boards, printed circuit boards, or PCB for short). It is a high-quality copper foil produced with industrial grade electrolytic copper as the main raw material through special production equipment and technology by calendering or electrolysis. It plays a key conductive role in supporting and interconnecting components in electronic products. The functional main material used to manufacture conductive circuits on printed circuit boards is the largest and most important metal foil us...

Claims

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Application Information

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IPC IPC(8): C25D3/22
CPCC25D3/22
Inventor 谢锋徐策王其伶王维河杨祥魁朱义刚刘心刚徐好强王学江薛伟孙云飞宋佶昌冯秋兴
Owner SHANDONG JINBAO ELECTRONICS
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