Surface treatment composite additive capable of improving corrosion resistance of copper foil

Abstract

The invention belongs to the technical field of electrolytic copper foil processing and particularly relates to a surface treatment composite additive capable of improving the corrosion resistance of copper foil. Every liter of the aqueous solution of the composite additive contains 1.0-10 g of polyethylene glycol, 0.1-5.0 g of rare-earth salt, 0.1-15 g of sodium dodecyl benzene sulfonate and 0.2-3.0 g of chitosan. The prepared composite additive is good in control performance and high in stability. The composite additive is used during galvanization, and thus the crystal morphology of a coating can be changed. The coating on the surface of the produced copper foil is smooth and uniform, crystals are fine and compact, the hydrochloric acid degradation resistant rate of the copper foil is lower than 3%, and good corrosion resistance is achieved. In addition, the production process is simple and environmentally friendly, the cost is low, waste foil obtained after surface treatment can also be recycled, and the index of the copper foil is not influenced.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil processing, and in particular relates to a surface treatment composite additive for improving the corrosion resistance of copper foil. Background technique [0002] Copper foil is one of the important electronic materials in my country's information industry. It is an important material for the manufacture of copper clad laminates (CCL for short) and printed circuit boards (also known as printed circuit boards, printed circuit boards, or PCB for short). It is a high-quality copper foil produced with industrial grade electrolytic copper as the main raw material through special production equipment and technology by calendering or electrolysis. It plays a key conductive role in supporting and interconnecting components in electronic products. The functional main material used to manufacture conductive circuits on printed circuit boards is the largest and most important metal foil us...

AI Technical Summary

Problems solved by technology

[0004] With the development of PCB technology, many environments, conditions, and methods are different from the past. The advancement of technology has brought a series of new requirements for material applications. The corrosion resistance of copper foil surface can no longer meet the requirements of high-density thin-line and miniaturization of printed boards. requirements

The corrosion resistance of copper foil is achieved by forming galvanized or galvanized alloy on the surface of copper foil. General galvanized, galvanized nickel, zinc-tin and other alloy processes have the effect of corrosion resistance, but because the crystallization of the alloy layer is not fine and uniform , the corrosion resistance cannot reach the ideal effect, resulting in edge corrosion when the copper foil circuit board etches high-definition lines, and in severe cases, the problem of line drop on the board will occur

[0005] In recent years, in order to improve the corrosion resistance of copper foil, some copper foil manufacturers have developed ternary and quaternary alloy corrosion-resistant processes of zinc, nickel, cobalt, tin, iron, molybdenum, arsenic, tungsten and other metals to make copper foil resistant to corrosion. The corrosivity has been greatly improved, but the process is complicated, the range of process parameters is narrow, and there are problems such as unsuitable operation, high cost, difficult recovery of plating solution and wastewater treatment, and environmental protection.

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