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Electromagnetic shielding composite material and manufacturing method thereof

A composite material, electromagnetic shielding technology, applied in the fields of magnetic/electric field shielding, electrical components, etc., to achieve the effect of flexible preparation process, good performance, and excellent electromagnetic shielding efficiency

Pending Publication Date: 2017-07-04
SHANGHAI LINEPRINTING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, traditional electromagnetic shielding materials generally have a good shielding effect on electromagnetic waves in a certain frequency band. For example, ordinary soft magnetic materials can be used in low-frequency fields, and ordinary high-conductivity materials can be used in high-frequency fields. A material that takes into account both high and low frequencies

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  • Electromagnetic shielding composite material and manufacturing method thereof

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Effect test

Embodiment 1

[0041] A novel electromagnetic shielding composite material with a two-layer structure is prepared according to the manufacturing method of the present invention, that is, a conductive metal layer is directly plated on an amorphous substrate, and the conductive metal is copper, and the prepared material contains both soft magnetic materials and non-magnetic materials. The crystal also contains conductive material copper.

[0042] The thickness of the amorphous material used is 20um, which is common in the market.

[0043] The electroplating solution components of copper electroplating used: CuSO4.5H2O—210g / l; H2SO4—65g / l; Cl - --60ppm; HSR light agent—2ml / l; HSR leveling agent—7ml / l.

[0044] The plating solution is filtered by three stages of electroplating, that is, it is first filtered through a filter, then filtered through a cotton filter element with a pore size of 10 μm, and finally filtered through an activated carbon filter element; the plating solution is stirred in...

Embodiment 2

[0049] A novel electromagnetic shielding composite material with a three-layer structure is prepared according to the manufacturing method of the present invention, that is, electroplating a conductive metal layer on the amorphous substrate and then chemically plating a layer of soft magnetic coating on the conductive metal layer, electroplating the conductive metal to select the metal Copper, electroless plating chooses metal nickel.

[0050] The thickness of the amorphous material used is 20um, which is common in the market.

[0051] The electroplating solution composition of copper electroplating used: CuSO 4。 5H 2 O—210g / l; H 2 SO 4 —65g / l; Cl - --60ppm; HSR light agent—2ml / l; HSR leveling agent—7ml / l.

[0052] Electroless nickel plating solution components: nickel oxalate 30g / L, ethylenediamine 100ml / L, sodium hydroxide 46g / L, sodium borohydride 0.8g / l, thiourea 0.5mg / l, sodium saccharin 2g / l

[0053] The electroplating copper plating solution adopts three-stage fil...

Embodiment 3

[0061] A novel electromagnetic shielding composite material with a three-layer structure is prepared according to the manufacturing method of the present invention, that is, a layer of conductive metal layer is first sputtered on the nanocrystalline substrate, and then a layer of soft magnetic coating is electroplated on the conductive metal layer. Aluminum is selected as the conductive metal, and nickel is selected as the soft magnetic plating for electroplating.

[0062] The thickness of the nanocrystalline material used is 10um.

[0063] Magnetron sputtering is selected for sputtering, metal aluminum is selected as the target material, and the aluminum plate is fixed on the target position. Ultrasonic cleaning of the nanocrystalline material, after the cleaning is completed, start loading-vacuumize-argon ion bombardment-ion source bombardment (arc bombardment)-sputter coating-vacuumize-fill nitrogen cooling-deflate-unloading ends.

[0064] The main parameters during sputte...

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Abstract

The invention provides an electromagnetic shielding composite material and a manufacturing method thereof. The electromagnetic shielding composite material is of a layered structure and comprises an amorphous / nanocrystal substrate layer and one or more than two metal thin film layers, wherein the metal thin film layers are deposited on a surface of the amorphous / nanocrystal substrate layer, electrical conductivity and soft magnetism are alternative among layers of the electromagnetic shielding composite material, the total thickness of the electromagnetic shielding composite material is 10-110 micrometers, the thickness of a metal accumulation layer is 0.02-70 micrometers, and the metal accumulation layer is formed by one or more of an electrodeposition method, a chemical deposition method and a sputtering deposition method. The electromagnetic shielding composite material provided by the invention can be simultaneously compatible with influences of a low-frequency electromagnetic wave and a high-frequency electromagnetic wave, and has a good shielding effect on the electromagnetic wave in a wide frequency band.

Description

technical field [0001] The invention relates to the field of magnetic materials, in particular to an electromagnetic shielding composite material and a manufacturing method thereof. Background technique [0002] With the development of economy and society, more and more electronic products appear in our daily life, bringing infinite convenience and fun to our life. However, while we enjoy these high-tech products, we also need to Bearing the troubles brought by electronic equipment, electromagnetic waves of various frequency bands and intensities have brought a great negative impact on our lives. Not only will electronic equipment affect each other, but it will also affect our health. Therefore, strict electromagnetic compatibility control requirements have been imposed on the delivery of electronic equipment internationally. In this way, the use of electromagnetic shielding materials to shield electromagnetic waves has become a necessary material for electronic equipment m...

Claims

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Application Information

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IPC IPC(8): H05K9/00
CPCH05K9/0088
Inventor 陈印中李家洪杨恺
Owner SHANGHAI LINEPRINTING MATERIALS CO LTD