Electromagnetic shielding composite material and manufacturing method thereof
A composite material, electromagnetic shielding technology, applied in the fields of magnetic/electric field shielding, electrical components, etc., to achieve the effect of flexible preparation process, good performance, and excellent electromagnetic shielding efficiency
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Embodiment 1
[0041] A novel electromagnetic shielding composite material with a two-layer structure is prepared according to the manufacturing method of the present invention, that is, a conductive metal layer is directly plated on an amorphous substrate, and the conductive metal is copper, and the prepared material contains both soft magnetic materials and non-magnetic materials. The crystal also contains conductive material copper.
[0042] The thickness of the amorphous material used is 20um, which is common in the market.
[0043] The electroplating solution components of copper electroplating used: CuSO4.5H2O—210g / l; H2SO4—65g / l; Cl - --60ppm; HSR light agent—2ml / l; HSR leveling agent—7ml / l.
[0044] The plating solution is filtered by three stages of electroplating, that is, it is first filtered through a filter, then filtered through a cotton filter element with a pore size of 10 μm, and finally filtered through an activated carbon filter element; the plating solution is stirred in...
Embodiment 2
[0049] A novel electromagnetic shielding composite material with a three-layer structure is prepared according to the manufacturing method of the present invention, that is, electroplating a conductive metal layer on the amorphous substrate and then chemically plating a layer of soft magnetic coating on the conductive metal layer, electroplating the conductive metal to select the metal Copper, electroless plating chooses metal nickel.
[0050] The thickness of the amorphous material used is 20um, which is common in the market.
[0051] The electroplating solution composition of copper electroplating used: CuSO 4。 5H 2 O—210g / l; H 2 SO 4 —65g / l; Cl - --60ppm; HSR light agent—2ml / l; HSR leveling agent—7ml / l.
[0052] Electroless nickel plating solution components: nickel oxalate 30g / L, ethylenediamine 100ml / L, sodium hydroxide 46g / L, sodium borohydride 0.8g / l, thiourea 0.5mg / l, sodium saccharin 2g / l
[0053] The electroplating copper plating solution adopts three-stage fil...
Embodiment 3
[0061] A novel electromagnetic shielding composite material with a three-layer structure is prepared according to the manufacturing method of the present invention, that is, a layer of conductive metal layer is first sputtered on the nanocrystalline substrate, and then a layer of soft magnetic coating is electroplated on the conductive metal layer. Aluminum is selected as the conductive metal, and nickel is selected as the soft magnetic plating for electroplating.
[0062] The thickness of the nanocrystalline material used is 10um.
[0063] Magnetron sputtering is selected for sputtering, metal aluminum is selected as the target material, and the aluminum plate is fixed on the target position. Ultrasonic cleaning of the nanocrystalline material, after the cleaning is completed, start loading-vacuumize-argon ion bombardment-ion source bombardment (arc bombardment)-sputter coating-vacuumize-fill nitrogen cooling-deflate-unloading ends.
[0064] The main parameters during sputte...
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Abstract
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