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A method for electroless copper plating of multi-walled carbon nanotubes

A technology of multi-walled carbon nanotubes and electroless copper plating, which is applied in liquid chemical plating, transportation, packaging, coating, etc., and can solve problems such as substrate wetting and bonding, large aspect ratio of CNTs, and agglomeration that affect the coating effect , to achieve the effect of improving the agglomeration phenomenon, enhancing the strengthening effect and improving the bonding strength

Active Publication Date: 2019-07-16
KUNMING UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In order to solve the nanotube electroless copper plating modification method in the prior art, only the outer surface of CNTs is plated, and the aspect ratio of CNTs is large, causing kinks and agglomeration, thereby affecting the coating effect and the wetting and bonding with the substrate. The invention provides a method for electroless copper plating on inner and outer tube walls of multi-walled carbon nanotubes

Method used

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  • A method for electroless copper plating of multi-walled carbon nanotubes
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  • A method for electroless copper plating of multi-walled carbon nanotubes

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Embodiment 1

[0032] Embodiment 1: a kind of method for electroless copper plating on inner and outer tube walls of multi-walled carbon nanotubes, the specific steps include:

[0033] (1) Chopped: Add 2g of multi-walled carbon nanotubes to 1L of ethanol solvent (the solid-to-liquid ratio g:L of multi-walled carbon nanotubes to ethanol solvent is 2:1), add dispersant dimethylformamide 0.5 g / L, treated for 10 hours under ultrasonic conditions with an ultrasonic frequency of 10khz and a power of 80w, filtered, washed, and vacuum-dried at 80°C for 10h; the length of the original MWCNTs is micron-scale and the ports are in a closed state, and most MWCNTs interact with each other Intertwined and intertwined to form agglomerates, with defects and kinks on the surface, the morphology of MWCNTs after high-energy ultrasonic vibration chopping is as follows: figure 1 shown, from figure 1 It can be seen that the bending and kinks of CNTs begin to break, and the fracture is open in an irregular state (...

Embodiment 2

[0039] Embodiment 2: a method for electroless copper plating on inner and outer tube walls of multi-walled carbon nanotubes, the specific steps include:

[0040] (1) Chopped: Add 5g of multi-walled carbon nanotubes to 1L of methanol solvent (the solid-to-liquid ratio g:L of multi-walled carbon nanotubes to ethanol solvent is 5:1), add the dispersant N-methylpyrroline 0.8g / L, treated for 12 hours under ultrasonic frequency of 20khz, power of 130w, filtered, washed, and vacuum dried at 80°C for 10h;

[0041] (2) Purification: Add the chopped multi-walled carbon nanotubes in step (1) to the methyl ethyl ketone solvent according to the solid-to-liquid ratio g:L of 5:1, and disperse them under ultrasonic conditions with an ultrasonic frequency of 20khz and a power of 130w Treat for 2 hours, filter, wash, and vacuum dry at 80°C for 10 hours; add the dispersed multi-walled carbon nanotubes to the concentrated acid solution according to the solid-to-liquid ratio g:L of 5:1 (concentrat...

Embodiment 3

[0046] Embodiment 3: a method for electroless copper plating on inner and outer tube walls of multi-walled carbon nanotubes, the specific steps include:

[0047] (1) Chopped: Add 8g of multi-walled carbon nanotubes to 1L of ethylene glycol solvent (the solid-to-liquid ratio g:L of multi-walled carbon nanotubes to ethanol solvent is 8:1), add dispersant dimethyl formazan Amide 0.5g / L, gelatin 1.0g / L, treated under ultrasonic frequency of 30khz, power of 160w for 13 hours, filtered, washed, vacuum dried at 80°C for 10h;

[0048] (2) Purification: Add the multi-walled carbon nanotubes chopped in step (1) to the cyclohexanone solvent according to the solid-to-liquid ratio g:L of 8:1, under the ultrasonic conditions of 30khz ultrasonic frequency and 160w power Disperse for 4 hours, filter, wash, and vacuum dry at 80°C for 10 hours; add the dispersed multi-walled carbon nanotubes to the concentrated acid solution according to the solid-to-liquid ratio g:L of 8:1 (concentrated acid s...

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Abstract

The invention discloses a method for electroless copper plating of multi-walled carbon nanotubes, which belongs to the technical field of carbon nanotube modification; the invention uses long-time high-energy ultrasonic oscillation to short-cut multi-walled carbon nanotubes to reduce the aspect ratio and open ports; After purification, sensitization, activation, and secondary activation modification, the copper layer is continuously plated on the inner and outer walls of the multi-walled carbon nanotubes with small aspect ratio by using an electroless plating method. The method of the invention is efficient and controllable, effectively reduces the aspect ratio of multi-walled carbon nanotubes, and simultaneously coats the inner and outer walls of multi-walled carbon nanotubes with a copper layer; the plated copper layer has high purity, uniform and continuous coverage, and solves the problem The problem of agglomeration of tubes in the copper matrix, poor wettability, and low interfacial bonding strength provides a better reinforcement for the preparation of high-strength, high-conductivity carbon nanotube-reinforced copper-based composites.

Description

technical field [0001] The invention relates to a method for electroless copper plating of multi-walled carbon nanotubes, belonging to the technical field of carbon nanotube modification. Background technique [0002] Carbon nanotubes (CNTs) have excellent electrical and mechanical properties, and are known as the most ideal reinforcement phase for composite materials, and have broad application prospects in the field of composite materials. Using CNTs to strengthen the copper matrix to prepare composite materials can theoretically greatly improve the mechanical strength of the copper matrix and improve its electrical conductivity. However, due to the nano effect of CNTs itself and its large aspect ratio, it is easy to kink and agglomerate, and it is extremely difficult to disperse and combine in the copper matrix of the composite material, resulting in a decline in the performance of the composite material. [0003] In order to give full play to the high tensile strength a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40C23C18/18B22F1/02
CPCC23C18/1662C23C18/1889C23C18/405B22F1/17
Inventor 蔡晓兰周蕾王子阳彭刚
Owner KUNMING UNIV OF SCI & TECH
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