A space-limited solvent-assisted growth method for preparing organic-inorganic compound semiconductor single crystal thin films
An inorganic composite and single crystal thin film technology, which is applied in the direction of single crystal growth, crystal growth, semiconductor devices, etc., can solve the problems of difficult transportation in the grain boundary area, easy damage to the film and substrate, and unfavorable crystallization quality of the film. To avoid the short circuit problem of the device, improve the flatness, improve the effect of reducing the roughness
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Embodiment 1
[0054] Embodiment 1: a spatially confined solvent-assisted growth method for preparing an organic-inorganic composite semiconductor single crystal thin film, comprising the following steps:
[0055] (1) CH prepared by conventional spin coating method 3 NH 3 PbI 3 The composite semiconductor polycrystalline film is placed in a closed container filled with cyclohexane saturated steam for 0.5 hours, so that the whole film can evenly absorb the solvent vapor;
[0056] (2) Closely attach the polished silicon wafer with clean surface to the surface of the film, and then wrap and seal them with PTFE film;
[0057] (3) place the above-mentioned sealed sample in the autoclave, then fill the autoclave with dimethyl silicone oil, and seal;
[0058] (4) A constant high pressure of 200MPa is applied on the autoclave, and then the temperature of the autoclave is raised to 120°C and kept constant for 48 hours;
[0059] (5) After the above process is finished, under the condition that the...
Embodiment 2
[0072]Example 2: A space-limited solvent-assisted growth method for preparing organic-inorganic composite semiconductor single crystal thin films, the operation steps are the same as those in Example 1, the difference is: the solvent cyclohexane used is replaced by isopropanol, more The time of adsorbing the solvent vapor by the crystal film is 1 hour, the polished cover sheet is changed to polished quartz sheet, the heat and pressure transfer medium is ethylene glycol, the hot-pressing pressure is 200MPa, the hot-pressing temperature is 200°C, and the hot-pressing treatment time is For 10 hours, the cooling rate was 0.06°C / min.
Embodiment 3
[0073] Example 3: A space-limited solvent-assisted growth method for preparing organic-inorganic compound semiconductor single crystal thin films, the operation steps are the same as those in Example 1, the difference is that the compound semiconductor is replaced by CH 3 NH 3 PbI 3-X Cl X , the solvent cyclohexane used was replaced by DMF, the polycrystalline film adsorbed solvent vapor for 0.1 hour, the polishing cover was changed to a single gallium arsenide wafer, the flexible film used to coat the sample was gold foil, and the heat and pressure transfer medium was For the fluoride solution, the heat treatment pressure is 150MPa, the hot pressing temperature is 100°C, the heat treatment time is 50 hours, and the cooling rate is 0.2°C / min.
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