Fire-retardant resin-based copper clad laminate and preparation method thereof

A flame retardant resin, copper plate technology, used in chemical instruments and methods, flat products, other household appliances, etc., can solve the problems of low humidity and heat resistance, high dielectric constant, low shrinkage rate of the plate, and achieve excellent flexibility, Uniform smoothness, high density effect

Inactive Publication Date: 2018-02-23
苏州巨峰新材料科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The introduction of phosphorus-containing compounds into the resin matrix for preparing copper-clad laminates has become the main technical route for halogen-free flame-retardant copper-clad laminates. The resulting panels have low heat and humidity resistance
Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric prop

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fire-retardant resin-based copper clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] (1) Disperse nano-silica foam in toluene, then add vinyl propionate, tert-butyl diazoacetate and tert-butyl nitrite; stir at 80°C for 15 minutes; then add tetramethylethylenediamine After dispersing evenly, add dibutylzinc dilaurate, reflux for 7 hours, and finally add acetone to obtain a modified silica foam system with a solid content of 25%;

[0049] (2) At 25°C, mix pinacolborane, tetrahydrofuran and 2,3-epoxycyclopentylcyclopentyl ether, stir for 35 minutes, add 2-aminoacetophenone, and continue stirring for 20 minutes; then add Pyridinium m-nitrobenzenesulfonate, glyceryl monostearate, and continued to stir for 20 minutes to obtain a monofunctional epoxy system;

[0050] (3) Add graphene oxide to diglycidyl phthalate, stir at 125°C for 20 minutes, then add 1,8-octanedithiol, and stir at 130°C for 50 minutes to obtain a bifunctional epoxy system;

[0051] (4) Add the modified silica foam system to the bifunctional epoxy system, stir at 130°C for 50 minutes, then a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a fire-retardant resin-based copper clad laminate and a preparation method thereof. The method comprises: adding a modified silica foam system into a bifunctional epoxy system, stirring for 50 min at a temperature of 130 DEG C, adding a monofunctional epoxy system and nanometer titanium dioxide crystal whisker at a room temperature, and stirring for 30 min to obtain a glueliquid; adjusting the solid content of the glue liquid to 55-60% with PMA, and impregnating with a reinforcing material to obtain a prepreg; heating and drying the prepreg to obtain a semi-curing sheet; and placing the semi-curing sheet between two copper foil sheets, and carrying out hot pressing molding so as to obtain the fire-retardant resin-based copper clad laminate, wherein the obtained fire-retardant resin-based copper clad laminate has excellent flame retardancy and excellent heat resistance, such that the development application of fire-retardant resin-based copper clad laminates can be met.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a flame-retardant resin-based copper-clad laminate and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] The printed circuit board is formed by the copper clad laminate after the circuit is made. The copper clad laminate is obtained by hot pressing the glass cloth and the resin layer and the conductor layer attached to the glass cloth. Therefore, the main performance of the PCB board, especially the signal transmission performance, only needs CCL decision, while the performance of CCL has a great relationship with the resin matrix. With the development of light, thin, small, high-density, and multi-functional electronic products, the assembly density and integration of components are getting higher and higher, the frequency o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L63/00C08K13/06C08K9/04C08K7/26C08K7/08C08K3/04C08J5/24B29C65/02B29B15/12B32B15/092B29L7/00
CPCC08J5/24B29C65/02B29C66/45B29C66/74281B29L2007/002B32B15/092B32B2307/204B32B2307/306B32B2307/3065B32B2457/08C08J2363/00C08K3/04C08K7/08C08K7/26C08K9/04C08K13/06C08K2201/011
Inventor 郑炳洙徐伟红夏宇朴龙星梁国正
Owner 苏州巨峰新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap