Low-shrinkage heat-conducting flame-retardant double-component condensed type organosilicone pouring sealant, and preparation method and application thereof

Abstract

The invention belongs to the technical field of encapsulating materials, and discloses a low-shrinkage heat-conducting flame-retardant double-component condensed type organosilicone pouring sealant, and a preparation method and application thereof. The organosilicone pouring sealant consists of a component A and a component B, of which the weight ratio of (10:1) to (5:1), wherein the component A consists of the following raw materials in parts by weight: 100 parts of a base adhesive, 30 to 80 parts of a plasticizer A, 0.01 to 3 parts of a coloring material and 0.1 to 1 part of a curing accelerant; and the component B consists of the following raw materials in parts by weight: 80 to 300 parts of a crosslinking agent, 10 to 60 parts of a coupling agent, 0.5 to 1.5 parts of a catalyst and 100to 500 parts of a plasticizer B. The base adhesive consists of the following raw materials in parts by weight: 100 parts of liquid silicone rubber, 3 to 10 parts of reinforcing filler, 20 to 80 partsof heat-conducting filler, 20 to 100 parts of flame-retardant filler, 3 to 10 parts of a surface treating agent and 3 to 20 parts of functional filler.

Description

technical field [0001] The invention belongs to the technical field of potting materials, and in particular relates to a low-shrinkage, heat-conducting, flame-retardant, two-component condensation type silicone potting glue, a preparation method and application thereof. Background technique [0002] Silicone polymer materials have unique weather resistance, aging resistance, excellent high and low temperature resistance, good hydrophobicity, mechanical properties, electrical insulation and other properties due to the special silicon-oxygen bond main chain structure, so they are widely used in Potting protection of electronic and electrical components. [0003] RTV liquid silicone rubber can be divided into one-component and two-component according to the packaging method, and can be divided into condensation type and addition type according to the vulcanization mechanism. The silicone potting adhesives used for electronic components at home and abroad are mostly single-comp...

AI Technical Summary

Problems solved by technology

The Chinese patent application with the publication number CN 105112005A and titled "High Strength Flame Retardant Heat Conduction Condensation Power Supply Sealant and Its Preparation Method" introduces a two-component condensation type silicone potting compound for power supply sealing, which mainly solves the problem of Potting adhesive bonding, thermal conductivity, flame retardant properties, the thermal conductivity in the example is only 0.4W m -1 ·K -1 , can not export heat well, and does not involve methods to reduce shrinkage

At the same time, in the above technical solutions for preparing two-component condensation type silicone potting glue, conventional plasticizers: dimethyl silicone oil are used, which makes the molecular chains of silicone rubber slide, so that the elongation and expansion coefficient Increase, but the expansion coefficient increases the stress of the potting compound during use, and the potting compound will peel off from the electronic components, which cannot meet the potting requirements

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