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A dynamic polymer with non-covalent crosslinking structure and its application

A technology of cross-linking structures and polymers, applied in the field of intelligent polymers

Active Publication Date: 2021-03-19
厦门天策材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existence of such situations makes it difficult to fully reflect the characteristics of the dynamic reversible covalent bond itself under normal conditions. It is necessary to develop a new type of dynamic polymer so that the dynamic reversible covalent bond in the system can simultaneously satisfy the reversible reaction. Fast speed, mild reaction conditions, and controllable reversible reaction conditions to solve the above-mentioned problems in the prior art

Method used

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  • A dynamic polymer with non-covalent crosslinking structure and its application
  • A dynamic polymer with non-covalent crosslinking structure and its application
  • A dynamic polymer with non-covalent crosslinking structure and its application

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preparation example Construction

[0157] In the preparation process of dynamic polymers, after the compounds used as raw materials participate in the reaction with each other, the raw material components can be polymerized with organoboric silicon ester bonds or ordinary covalent bonds as link points to obtain dynamic polymers with higher molecular weight . Among them, the functional groups contained in the raw material components can be fully reacted or partially reacted, and it is not required that all the organoboronic acid groups and / or organoborate groups and the silanol and / or silanol precursors completely react with each other to form Organoborosilicate linkages, as long as the organoborosilicate linkages formed are sufficient to maintain the dynamic polymer structure.

[0158] In the present invention, since the preparation process of the dynamic polymer using the above two implementations is simple, easy to operate and highly controllable, it is a preferred implementation of the present invention.

...

Embodiment 1

[0265] A dynamic polymer with a linear structure is prepared by using a small-molecule organic boron compound (I) containing a bifunctional group and a small-molecule silicon-containing compound (II) containing a bifunctional group.

[0266]

[0267] Take a certain amount of organoboron compound (a) (using methyllithium, vinyllithium and trimethyl borate to react to make methylvinylboronic acid; using AIBN as initiator and triethylamine as catalyst, using methylethylene boronic acid and 1,6-hexanedithiol by thiol-ene click reaction) dissolved in tetrahydrofuran solvent to prepare a 0.8mol / L solution; weigh a certain amount of silicon-containing compound (b) (using dimethyl Allyl chlorosilane, 1,10-decanedithiol as raw materials, AIBN as initiator, triethylamine as catalyst, prepared by thiol-ene click reaction) dissolved in tetrahydrofuran solvent to prepare 0.8mol / L Solution: Take 20ml of tetrahydrofuran solution dissolved with organoboron compound and pour it into a dry a...

Embodiment 2

[0269] A dynamic polymer with a linear structure is prepared by using a macromolecular organoboron compound (I) containing a bifunctional group and a macromolecular silicon-containing compound (II) containing a bifunctional group.

[0270]

[0271] Weigh 7.5g of boric acid-terminated polyether (a) in a dry and clean beaker (using 1-hydroxyborole-3-ene as a raw material, and prepare 3-bromo-3-ene by addition reaction with hydrobromic acid 1-Hydroxyborolane, and then it and polyetheramine with potassium carbonate as a catalyst, prepared by hydrocarbylation reaction), 60ml of deionized water was added therein, placed at 50°C and continuously stirred to dissolve, After the dissolution is complete, a small amount of 1mol / L NaOH solution is added dropwise therein; 5.2g of silane-terminated polyether (b) is weighed (using double-hydroxyl-terminated polyethylene glycol as a raw material, which is reacted with acrylic acid through esterification After the intermediate product is obt...

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Abstract

The invention discloses a dynamic polymer having a non-covalent crosslinking structure. The dynamic polymer contains organic boric acid silicon ester bonds on polymer chain backbone; wherein the organic boric acid silicon ester bonds are existed as polymeric chain contacts of the dynamic polymer, and are the necessary condition for forming or maintaining a dynamic polymer structure. The dynamic polymer has energy dissipation performance by means of the organic boric acid silicon ester bonds having strong dynamic reversibility, embodies functional characteristics of stimulation responsiveness and self-repairability, and has a wide application prospect in the fields of sport protection, a functional coating, and a bionic material.

Description

technical field [0001] The invention relates to the field of intelligent polymers, in particular to a dynamic polymer with a non-covalent crosslinking structure composed of dynamic reversible covalent bonds. Background technique [0002] Dynamic chemistry is an interdisciplinary subject developed by combining supramolecular chemistry and dynamic covalent chemistry in covalent chemistry. Traditional molecular chemistry focuses on stable covalent interactions, while dynamic chemistry focuses on some relatively weak non-covalent interactions and reversible covalent bonds. Among them, supramolecular chemistry is based on non-covalent intermolecular interactions. Compared with traditional covalent bonds, these non-covalent interactions have weaker bond energy and are greatly affected by thermodynamics. The formed supramolecular structure To some extent, it is not a kinetically stable system. For dynamic covalent chemistry, it has some characteristics similar to supramolecular c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G79/08C08G73/06C08G75/045C08G18/38C08G18/50C08G18/66C08G18/76D06M15/687C08L85/04C08L75/08C08L81/02C09D185/04C09J185/04C09J175/08
CPCC08G18/3893C08G18/5024C08G18/6696C08G18/7671C08G73/06C08G75/045C08G79/08C08L75/08C08L81/02C08L85/04C09D185/04C09J175/08C09J185/04D06M15/687
Inventor 不公告发明人
Owner 厦门天策材料科技有限公司