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Photovoltaic encapsulation material EVA adhesive film resisting potential induced attenuation

A potential-induced attenuation, packaging material technology, applied in photovoltaic power generation, films/sheets without carriers, circuits, etc., can solve problems such as difficult to meet the service life of components, can not solve the problem of ion migration from the root, and eliminate passivation Phenomenon, stable and lasting excellent anti-PID performance, the effect of increasing molecular volume resistivity

Active Publication Date: 2018-05-15
福斯特(滁州)新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

CN103525321B provides a kind of anti-PID photovoltaic EVA film, but this invention also has disadvantages: (1) the content of hydrophobic agent added in the adhesive film is certain, when the module is used under the condition of high temperature and high humidity, the hydrophobic agent will eventually absorb water It is difficult to meet the expected service life of the component for 20 to 30 years; (2) While polyolefin ionomer locks sodium ions, new Ca may be released in the system 2+ , Zn 2+ , Li + or K + , cannot fundamentally solve the problem of ion migration in photovoltaic module systems

Method used

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  • Photovoltaic encapsulation material EVA adhesive film resisting potential induced attenuation

Examples

Experimental program
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Effect test

Embodiment 1

[0035] This embodiment provides a packaging material with anti-PID performance.

[0036] In this example, matrix resin: in terms of mass fraction, get 90% ethylene-vinyl acetate copolymer (vinyl acetate (VA) mass content is 20%, U.S. DuPont Company), 10% high melting point polyethylene (melting point 80 ℃). Based on 100 parts of the above-mentioned matrix resin by mass, add 0.8 parts of tert-butyl peroxyisopropyl carbonate, 0.8 parts of triethylene glycol dimethacrylate, 0.1 parts of 2-hydroxy-4-n-octyloxydiphenyl Methanone, 0.2 parts of silane coupling agent, 0.1 part of bis-2,2,6,6-tetramethylpiperidinol sebacate. The above-mentioned ethylene-vinyl acetate, the complex compound for absorbing sodium ions and other additives are pre-mixed, melt-extruded, cast into a film, cooled, cut and rolled, and the EVA glue is obtained. film, denoted as E-1.

Embodiment 2

[0038] In this example, matrix resin: in terms of mass fraction, get 90% ethylene-vinyl acetate copolymer (vinyl acetate (VA) mass content is 20%, U.S. DuPont Company), 10% high melting point polyethylene (melting point 80 ℃). Based on 100 parts of the above-mentioned matrix resin, add 1 part of symmetrical tetramethyl six-membered cucurbit ring, 0.8 part of tert-butyl peroxyisopropyl carbonate, 0.8 part of triethylene glycol dimethacrylate, 0.1 part of 2 -Hydroxy-4-n-octyloxybenzophenone, 0.2 part of silane coupling agent, 0.1 part of bis-2,2,6,6-tetramethylpiperidinol sebacate. The above-mentioned ethylene-vinyl acetate, the complex compound for absorbing sodium ions and other additives are pre-mixed, melt-extruded, cast into a film, cooled, cut and rolled, and the EVA glue is obtained. Film, denoted as E-2.

Embodiment 3

[0040] In this example, matrix resin: in terms of mass fraction, get 90% ethylene-vinyl acetate copolymer (vinyl acetate (VA) mass content is 20%, U.S. DuPont Company), 10% high melting point polyethylene (melting point 80 ℃). Based on 100 parts of the above-mentioned matrix resin by mass, add 1 part of calcium silicate, 0.8 part of tert-butyl peroxyisopropyl carbonate, 0.8 part of triethylene glycol dimethacrylate, 0.1 part of 2-hydroxy-4- N-octyloxybenzophenone, 0.2 part of silane coupling agent, 0.1 part of bis-2,2,6,6-tetramethylpiperidinol sebacate. The above-mentioned ethylene-vinyl acetate, the complex compound for absorbing sodium ions and other additives are pre-mixed, melt-extruded, cast into a film, cooled, cut and rolled, and the EVA glue is obtained. Film, denoted as E-3.

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Abstract

The invention discloses a photovoltaic encapsulation material EVA adhesive film resisting potential induced attenuation. EVA with the VA content being 8 to 21wt percent and low-density polyethylene orvinyl copolymer with the melting rang being 70 to 130 DEG C are mixed into matrix resin; then the matrix resin, complex absorbing sodium ion and other assistants are subjected to premixing, melt extrusion, casting and film formation, cooling, slitting and rolling processes, so that the adhesive film is formed. The ion mobility is reduced through proper reducing of the VA content, the improvementof the volume resistivity of the EVA adhesive film and the reducing of the content of acetic acid in a photovoltaic system from the source. The volume resistivity of the EVA adhesive film is improvedthrough the adding of the high-melting polyethylene or vinyl copolymer, and meanwhile water vapor transmittance is reduced. Environment of sodium ion on the surface of a battery is reduced through theadding of the complex absorbing sodium ion, passivation phenomenon caused in a battery piece antireflection layer is weakened or even eliminated, and the potential induced attenuation resistance of the adhesive film is improved.

Description

technical field [0001] The invention belongs to the field of encapsulating EVA (Ethylene Vinyl Acetate, ethylene-vinyl acetate) adhesive films for photovoltaic modules, and in particular relates to a preparation method for enhancing the anti-PID (Potential Induced Degradation, Potential Induced Degradation) of EVA, a photovoltaic encapsulation material. Background technique [0002] Solar energy is an inexhaustible renewable energy with excellent characteristics such as cleanness, high efficiency, green environmental protection and no pollution. Using the photovoltaic effect to convert solar energy into electrical energy will benefit human life and economic development, etc. , The long-term reliable and stable operation of solar modules has long-term strategic significance for sustainable development. [0003] However, the long-term reliable and stable operation of crystalline silicon solar cell modules faces a serious challenge, that is, the PID effect (potential-induced de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J4/02C09J4/06C09J11/06C09J11/08H01L31/048
CPCC08K3/34C08K5/3477C09J4/06C09J7/00C09J11/06C09J11/08C09J2203/322C09J2301/408C09J2423/04H01L31/0481Y02E10/50
Inventor 魏梦娟桑燕侯宏兵唐国栋周光大林建华
Owner 福斯特(滁州)新材料有限公司
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