Method for improving interface of copper-aluminum composite material

A technology of copper-aluminum composite materials and composite materials, which is applied in the field of preparation and processing of non-ferrous metal composite materials, can solve the problems of reducing interface bonding strength and conductivity, and achieve the effect of improving bonding and conductivity

Inactive Publication Date: 2018-06-29
GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for improving the interface of copper-aluminum composite materials to solve the problem that brittle intermetallic compounds are formed at the interface during the preparation and processing of copper-aluminum composite materials to reduce the interface bonding strength and conductivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Preparation of copper-clad aluminum flat strip with a thickness of 5mm.

[0017] Pure copper tube and aluminum-magnesium alloy rod are used as raw materials. The outer diameter of the copper tube is Φ89mm, the inner diameter is Φ86mm, and the aluminum rod is turned according to the inner diameter of the copper tube. Clean the surface of the copper tube and the aluminum rod, brush the inner surface of the copper tube and the outer surface of the aluminum rod with a wire brush roller; then brush the ethanol suspension of graphene on the outer surface of the aluminum rod until the surface of the aluminum rod is black ; Pass the dried aluminum rod through the copper tube and set it to form a rolling billet.

[0018] After the billet is heated to 420°C, it is rolled, and the reduction in each pass is 15%, and the rough rolling is to 20mm. The obtained 20 mm thick strip was subjected to multi-pass cold rolling with the pass reduction being 15%, and the annealing temperature ...

Embodiment 2

[0021] Preparation of flexible copper-clad aluminum wire with a size of Φ0.5mm.

[0022] Copper foil and aluminum rods are used as raw materials. Copper foil thickness 0.5mm, aluminum rod diameter Φ10mm. First grow graphene film on the surface of copper foil, the process is: put the cleaned copper foil in the reaction chamber, evacuate to below 10mTorr, heat up to 1000°C; 2 :CH 4 =500sccm: 500sccm ratio was grown at 1000° C. for 60 minutes to obtain a copper foil deposited with a graphene film. The copper foil is wrapped on the surface of the aluminum rod, and the graphene layer is at the interface. The copper foil joints are sealed by a cladding welding machine.

[0023] Copper-clad aluminum rods are drawn on a drawing machine. Before drawing, the copper-clad aluminum rod needs to be headed, that is, the thicker end of the copper-clad aluminum rod is rolled into a thin end, and the thin end can pass through the drawing die on the drawing machine and be drawn by The draw...

Embodiment 3

[0026] Preparation of copper-clad aluminum rods with a size of Φ20mm.

[0027] C7025 copper tube and aluminum rod are used as raw materials. The outer diameter of the copper tube is Φ49mm, the inner diameter is Φ40mm, and the head of the copper tube is taped with a taper of 57°. According to the inner diameter of the copper tube and the size of the inner cone, the aluminum rod is turned, and the head of the aluminum rod is turned into a cone. Clean the surface of the copper tube and the aluminum rod, brush the inner surface of the copper tube and the outer surface of the aluminum rod with a steel wire brush roller; electroplate a composite layer of graphene and copper on the surface of the aluminum rod, the process is: potassium pyrophosphate 180g / L, copper sulfate 40g / L, dipotassium hydrogen phosphate 25g / L, ammonium nitrate 8g / L, graphene powder 0.6g / L, pH=7.5, D=1.0A / dm2. The electroplated aluminum rod is passed through the copper pipe, and the extruded billet is formed b...

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Abstract

The invention discloses a method for improving the interface of a copper-aluminum composite material, comprising the following steps: coating the interface of copper and aluminum with graphene or depositing graphene on the interface of copper and aluminum in advance; and then, compositing copper, aluminum and graphene, wherein coating or depositing is carried out by means of painting, electroplating or chemical vapor deposition, the compositing method is a rolling compositing method, an extruding compositing method or a drawing compositing method, and the graphene is in the form of powder or thin film. By adding graphene to the interface of copper and aluminum through the method, interface bonding is ensured, and the bonding performance and electrical conductivity of the interface are improved while the generation of brittle intermetallic compounds with poor conductivity on the interface is prevented.

Description

technical field [0001] The invention relates to a method for improving the interface of copper-aluminum composite materials, which belongs to the field of preparation and processing of non-ferrous metal composite materials. Background technique [0002] Copper-aluminum composite material is a light conductive material made by cladding copper on the surface of aluminum by using composite technology. The material not only has the advantages of high electrical and thermal conductivity of copper, low contact resistance and beautiful appearance, but also has the advantages of low density and low price of aluminum. Copper-aluminum composite materials mainly include copper-clad aluminum wire, copper-clad aluminum flat row, copper-clad aluminum thin strip, etc., which can replace pure copper and copper alloy for power transmission, medium and high frequency signal transmission, electromagnetic shielding and other occasions. [0003] At present, the preparation methods of copper-alu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B1/02H01B1/04
CPCH01B13/0026H01B1/02H01B1/04
Inventor 冯雪米绪军黄国杰李艳锋解浩峰彭丽军尹向前高宝东杨振孙宜媊崔晓东王利民
Owner GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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