Preparation method of compact high thermal conductivity ceramic substrate

Abstract

The invention discloses a preparation method of a compact high thermal conductivity ceramic substrate, and belongs to the technical field of ceramic substrates preparation. After carbon dioxide is introduced in a sodium aluminate solution, superfine aluminium hydroxide crystal grains are formed, mullite powder is doped to achieve bonding and toughening effects to avoid cracking deformation causedwhen an alumina ceramic substrate is subjected to sinter molding, and the alumina ceramic substrate is more compact. Polyester resin with high thermal deformation energy is used as a copper clad carrier, and through high stress bonding of the resin and the ceramic substrate, reliable bonding is generated; copper obtained through reduction of cuprous oxide in a hot melt coating and atoms of the ceramic substrate diffuse mutually to form a bonding layer through diffuse bonding, so that a composite plate is formed through tight bonding of the copper surface and the ceramic substrate, and an ablated metal thermal conductive layer is formed; and copper in a micro perforation of a green tape forms a thermal conductive net in the ceramic substrate, so that the thermal conductivity of the ceramicsubstrate is enhanced, and the application prospect is wide.

Description

technical field [0001] The invention discloses a preparation method of a compact high thermal conductivity ceramic substrate, belonging to the technical field of ceramic substrate preparation. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. [0003] For the preparation of alumina ceramic substrates, most of the existing technologies use tape-casting technology to prepare green bodies, and then t...

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Problems solved by technology

[0006] The technical problem mainly solved by the present invention is that common ceramic substrates are prone to cracks, and high-temperature liquid-phase sintering will cause large deformation of ceramics during the sintering process, especially when tape-casting is used to prepare thinner substrate materials. The first defect is more obvious, which makes the volume density of the ceramic substrate small. In addition, the ceramic substrate has a defect of poor heat dissipation performance as a circuit packaging board, and a preparation method for a dense high thermal conductivity ceramic substrate is provided.