Formula of low-melting-point SMT soldering paste and preparation method for formula

A solder paste, low melting point technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of limited tin and bismuth solder paste soldering performance, easy oxidation of powder, flux precipitation, etc., to achieve good solubility and stability High consistency, high quality, and the effect of improving the life of the stencil

Active Publication Date: 2018-10-16
烟台艾邦电子材料有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the tin-bismuth alloy used in low-melting point solder paste is easy to oxidize. The finer the tin powder, the larger the surface area, the more serious the oxidation tendency, which seriously limits the soldering performance of tin-bismuth solder paste, especially the solder ball in reflow soldering. The emergence of normalization has had a serious impact on the reliability of the circuit board
Tin-bismuth low-temperature solder paste has high requirements for storage due to the disadvantage of easy oxidation of the p

Method used

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  • Formula of low-melting-point SMT soldering paste and preparation method for formula
  • Formula of low-melting-point SMT soldering paste and preparation method for formula

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Embodiment 1

[0034] A preparation method of low melting point SMT solder paste, the steps are:

[0035] (1) Preparation of paste flux: first, 17.5 parts of low boiling point alcohol solvent ethylene glycol, 17.5 parts of high boiling point diethylene glycol monohexyl ether solvent, fully hydrogenated rosin (Eastman AX-E), water white hydrogenated rosin (Japan Arakawa Chemical KE-604 Rosin) 45 parts of hydrogenated rosin methyl ester in total, 5 parts of organic acid (succinic acid, malonic acid), 3 parts of antioxidant (Swiss Ciba Chemical 1010 antioxidant), halogen activator (Ethylenediamine hydrochloride) 0.5 parts, halogen-free active agent (salicylic acid amide) 2.5 parts, viscosity regulator vaseline 3 parts, Pingpingjia O1 part, high-efficiency thixotropic agent (6650 produced in Japan) 4 parts, acidity adjustment 0.5 parts of triethanolamine, 0.5 parts of amine organic amine salts, all the liquid solvents are put into the stainless steel reaction kettle of the emulsifier, and then t...

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Abstract

The invention discloses a formula of low-melting-point SMT soldering paste. The formula comprises the following two components in proportion by weight: 9-14% of paste soldering flux and 86-91% of spherical soldering powder. Dual planetary mixers sufficiently stir the two components uniformly, and then vacuum-pumping is performed to prepare the low-melting-point SMT soldering paste. Through a scientific formula design and an optimized production process, stable active ingredients and anti-oxidization components are added, so that the problem that a great number of tin balls are generated in reflux welding caused by easy oxidization is successfully solved, and the quality guarantee period of the low-melting-point SMT soldering paste is prolonged.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a formula of low melting point SMT solder paste and a preparation method thereof. Background technique [0002] The electronic information industry is an important industry of the national economy. With the continuous intelligence of electronic products and the digitization of various products, higher and higher requirements are put forward for circuit board design, research and development, and production. The soldering of circuit boards has two major processes, wave soldering and reflow soldering. SMT reflow soldering involves printing machines, placement machines, reflow soldering, AOI, X-RAY inspection and other processes. The most important soldering material in SMT reflow soldering process is solder Paste, the requirements of the printing machine for solder paste are: good fluidity, good anti-cold collapse effect, good tinning without blocking the stencil, long ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/3612B23K35/40
Inventor 秦超董存民张振江
Owner 烟台艾邦电子材料有限公司
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