Preparation method of diamond surface coated Ni-W-P metal plating layer

A technology of surface coating and metallization, which is applied in the field of preparation of Ni-W-P metallization coating on the surface of diamond, can solve the problem that the matrix material has no obvious effect on diamond holding force, and achieve shortening of processing time, effective heat energy, and promotion of speed effect

Inactive Publication Date: 2018-11-30
WUHU CHANGLING DIAMOND TOOL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Because the metallized layer formed by electroplating, chemical plating, etc., such as Ni-W-P coating, forms a coating on the surface of diamond, it cannot produce metallurgical bonding with diamond. The bonding force is provided by the mechanical holding of the coating, which is effective in improving the holding force of the matrix material to diamond. not obvious

Method used

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  • Preparation method of diamond surface coated Ni-W-P metal plating layer
  • Preparation method of diamond surface coated Ni-W-P metal plating layer

Examples

Experimental program
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Effect test

Embodiment 1

[0020] A preparation method of a diamond surface coated Ni-W-P metallized coating, comprising the steps of:

[0021] S1. Soak diamond particles with an average particle size of 200 μm in a degreasing solution at a temperature of 75° C. for 10 minutes for degreasing. The degreasing solution includes sodium hydroxide 5 g / L, sodium carbonate 20 g / L, sodium phosphate 5 g / L, Sodium sulfite 20g / L, sodium dodecylsulfonate 1g / L; take it out, rinse it with water, put it in a micro-etching solution at a temperature of 70°C for 2 minutes for roughening, and the micro-etching solution includes potassium persulfate 150g / L, copper sulfate pentahydrate 15g / L, concentrated sulfuric acid 5mL / L, take it out, rinse it with water, and then put it in the sensitization-activation solution and stir for 5min for sensitization and activation. The sensitization-activation solution includes palladium chloride 1g / L, tin chloride 5g / L, concentrated hydrochloric acid 50ml / L, sodium chloride 100g / L, take it...

Embodiment 2

[0026] A preparation method of a diamond surface coated Ni-W-P metallized coating, comprising the steps of:

[0027] S1. Soak diamond particles with an average particle size of 500 μm in a degreasing solution at a temperature of 85°C for 8 minutes for degreasing. The degreasing solution includes 15 g / L of sodium hydroxide, 10 g / L of sodium carbonate, and 15 g / L of sodium phosphate , Sodium Sulfite 10g / L, Sodium Dodecyl Sulfonate 5g / L; Take it out, rinse it with water, put it in a micro-etching solution at a temperature of 60°C for 5 minutes for roughening, and the micro-etching solution includes persulfuric acid Potassium 100g / L, copper sulfate pentahydrate 25g / L, concentrated sulfuric acid 1mL / L, take it out, wash it with water, and then put it in the sensitization-activation solution and stir for 10min for sensitization and activation. The sensitization-activation solution includes chloride Palladium 0.5g / L, tin chloride 10g / L, concentrated hydrochloric acid 30ml / L, sodium c...

Embodiment 3

[0031] A preparation method of a diamond surface coated Ni-W-P metallized coating, comprising the steps of:

[0032] S1. After degreasing, roughening, sensitizing, activating and reducing diamond particles with an average particle size of 50 μm, they are added to the chemical plating solution for chemical plating. The chemical plating solution includes: nickel sulfate hexahydrate 15g / L, Sodium hypophosphite 15g / L, sodium tungstate 10g / L, sodium citrate 60g / L, lactic acid 7mL / L, ammonium sulfate 25g / L, o-benzoylsulfonimide 0.8g / L, succinic acid 10g / L, potassium iodide 15mg / L, during the plating process, adjust the temperature of the plating solution to 70°C, the pH value to 9, the stirring rate to 200r / min, and the plating time to 80min. After the plating is completed, let stand, wash, and vacuum dry , to obtain diamond particles coated with Ni-W-P chemical coating on the surface;

[0033] S2, the ZrOCl 2 The stable ZrO was prepared after hydrolysis 2 Sol, with ZrO 2 The s...

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Abstract

The invention discloses a preparation method of a diamond surface coated Ni-W-P metal plating layer. Diamond particles with Ni-W-P chemical plating layers are plated with sol and gel; ZrO2 is coated on diamond surface layers; ZrO2 is used as a microwave absorbing agent; and when microwaves are used for heating, the microwave absorbing agent can be quickly heated, so that the heat can be effectively transferred between the Ni-W-P chemical plating layers and the diamond particles to accelerate chemical reactions between the Ni-W-P chemical plating layers and basal bodies of the diamond particles, diamond and metal layers are in metallurgical bonding, and the bonding force of the metal layers to the diamond is prominently improved.

Description

technical field [0001] The invention relates to the technical field of diamond surface treatment, in particular to a method for preparing a diamond surface coated Ni-W-P metallization coating. Background technique [0002] Due to the high surface energy of diamond, it is difficult to infiltrate with commonly used carcass powder and solder. The combination of diamond and matrix is ​​mainly by impregnation or coating, and the connection strength is low. During use, diamond particles are easy to fall off prematurely, reducing tool life. Use efficiency and diamond utilization. [0003] In order to reduce the surface energy of diamond, people use various methods to modify the diamond surface so that the diamond can react with various metals to connect. The most important modification method is to metallize the diamond surface, mainly including electroless plating and electroplating. , Vacuum evaporation, plasma sputtering, magnetron sputtering, chemical vapor deposition, physica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50C23C18/18C23C18/12
CPCC23C18/1216C23C18/1295C23C18/1893C23C18/50
Inventor 胡昌悌
Owner WUHU CHANGLING DIAMOND TOOL CO LTD
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