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Microcrystalline ceramic glass composite material, NTC chip using the same and preparation method thereof

A technology of composite materials and microcrystalline ceramics, which is applied in the direction of using electromagnetic means, using directly heat-sensitive electric/magnetic elements, and using electric devices, etc., can solve the problems of easy corrosion, high brittleness, terminal electrodes and glass glaze Low sintering temperature and other problems, to achieve the effects of enhanced mechanical vibration and impact resistance, improved strength and toughness, and wide temperature measurement range

Active Publication Date: 2021-07-16
SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the glass frit packaging in the existing technology has the following disadvantages: the sintering temperature is 220°C to 280°C, the sintering temperature is low, and it is easy to soften and melt during the wave soldering process, resulting in the failure of the NTC chip; the brittleness is large. Cracks and damages are prone to occur during use and use, resulting in failure of the NTC chip; the thermal conductivity is not high, which reduces the response speed and accuracy of the temperature measurement of the NTC chip; the acid and alkali resistance is poor, and it is prone to corrosion in a corrosive environment; It contains high levels of harmful elements such as lead, which cannot meet the regulatory requirements for the control of harmful substances in electronic products and automotive products; the thickness of the coating layer is large, so that the NTC thermal chip needs to be isolated from thicker glass to detect objects, so its response time is slow. Unable to meet the needs of rapid response
[0006] The NTC chip prepared by the existing NTC chip preparation process has the following deficiencies: the cold isostatic pressing green body, high temperature sintering, cutting, coating electrodes, and glass glaze encapsulation processes are often used, which need to go through multiple sintering and recycling processes. Fire technology, long production cycle, large equipment investment; due to the low sintering temperature of terminal electrodes and glass glaze (less than 400 ° C), the use environment and temperature measurement range of NTC chips are limited; NTC chips, terminal electrodes and glass The glazes are sintered and formed separately, and the bonding between them is poor, resulting in poor reliability and long-term working stability of the NTC chip

Method used

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  • Microcrystalline ceramic glass composite material, NTC chip using the same and preparation method thereof
  • Microcrystalline ceramic glass composite material, NTC chip using the same and preparation method thereof
  • Microcrystalline ceramic glass composite material, NTC chip using the same and preparation method thereof

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preparation example Construction

[0076] The preparation process of the NTC chip of the present invention is as follows:

[0077] Weigh glass powder, nano-titanium dioxide, ceria-stabilized zirconia nano-powder, Al 2 o 3 , solvents, adhesives, plasticizers and dispersants, put them into a non-contact planetary stirring vacuum defoaming all-in-one machine, carry out low-speed dispersion stirring, high-speed dispersion stirring and vacuum defoaming in a vacuum environment to disperse and stir evenly, and obtain microcrystalline ceramic glass composite paste;

[0078] Preparation of NTC chip: Print the obtained microcrystalline ceramic glass composite material slurry on the NTC chip green body containing electrodes, and then put it into a sintering furnace for sintering to obtain an NTC chip

Embodiment 1

[0081] 1. Preparation of Glass Powder

[0082] Batching according to the weight ratio of the following ingredients: B 2 o 3 20%, Al 2 SiO 5 4%, SiO 2 17%, Bi 2 o 3 46%, ZnO8%, CeO 2 0.5%, K 2 O 0.7%, Li 2 O 1% and CaO 2%, after preparing the materials, add absolute ethanol, put them into a planetary ball mill for ball milling, and then vacuum dry;

[0083] Calcination: The dried powder is crushed, then placed in a sintering furnace for calcination at 1000°C for 2 hours, and then crushed and ground after cooling in the furnace to obtain glass powder.

[0084] 2. Preparation of microceramic glass composites

[0085] Preparation of microcrystalline ceramic glass composite material slurry: weigh ingredients according to weight ratio: take 45% of glass powder, 3% of nano-titanium dioxide, 22% of ceria-stabilized zirconia nano-powder, Al 2 o 3 12%, 10% solvent, 6% adhesive, 1.8% plasticizer and 0.2% dispersant, put them into a non-contact planetary stirring vacuum ...

Embodiment 2

[0088] 1. Preparation of Glass Powder

[0089] Batching according to the weight ratio of the following ingredients: B 2 o 3 22%, Al 2 SiO 5 5%, SiO 2 15%, Bi 2 o 3 48%, ZnO6%, CeO 2 1%, K 2 O 1%, Li 2 O 1.3% and CaO 0.6%, after preparing the materials, add absolute ethanol, put them into a planetary ball mill for ball milling, and then vacuum dry;

[0090] Calcination: The dried powder is crushed, then placed in a sintering furnace for calcination at 1000°C for 2 hours, and then crushed and ground after cooling in the furnace to obtain glass powder.

[0091] 2. Preparation of microceramic glass composites

[0092] Preparation of microcrystalline ceramic glass composite material slurry: ingredients by weight: 36% of glass powder, 5% of nano-titanium dioxide, 18% of ceria-stabilized zirconia nano-powder, Al 2 o 3 15%, solvent 17%, adhesive 6%, plasticizer 2.5% and dispersant 0.5%, put it into a non-contact planetary stirring vacuum defoaming machine, and carry ...

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Abstract

The application discloses a microceramic glass composite material containing glass powder, wherein the glass powder contains B 2 o 3 and Al 2 SiO 5 ; According to the weight ratio, the Na element in the glass powder is less than 0.03%. The application also discloses an NTC chip prepared by using the microcrystalline ceramic glass composite material and a preparation method thereof. The microcrystalline ceramic glass film layer of the NTC chip of the present application is an environmentally friendly material and does not contain harmful substances; the NTC chip of the present application has high strength, high toughness, high corrosion resistance, mechanical vibration and impact resistance.

Description

technical field [0001] The invention relates to the technical field of thermosensitive chip products, in particular to a microcrystalline ceramic glass composite material, an NTC chip using the material and a preparation method thereof. Background technique [0002] NTC (negative temperature coefficient) thermistor is a thermally sensitive semiconductor resistor composed of polycrystalline ceramics of mixed oxides. Its resistance value decreases with the increase of temperature. It has the advantages of low price, high quality and stable performance. It is widely used Used to prepare temperature sensors to measure temperature. [0003] In recent years, NTC temperature sensors have been more and more widely used in new energy vehicle battery packs, motors, electronic control, and thermal management systems. As the core component of the temperature sensor, the NTC thermal chip puts forward new requirements for the NTC thermal chip. In the harsh environment of continuous high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C10/00C03C12/00G01K7/22
CPCC03C10/00C03C12/00G01K7/22
Inventor 王田军刘斌黄小华杜野罗平吴菲
Owner SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD