Method for preparing AlN powder

Abstract

The invention discloses a method for preparing AlN powder. The method includes first dissolving an aluminum source and a nitrogen source completely in a solvent according to the Al:N molar ratio of 1:1-1:35, mixing evenly, drying the solvent by evaporating, roasting an obtained solid mixture at 500-1000 DEG C for 1-9h in a roasting atmosphere, and then decarburizing the mixture at 200-750 DEG C for 1 to 5h in an air atmosphere to obtain the high-purity AlN powder. The aluminum source is aluminum chloride hydrate, aluminum lactate, aluminum glycinate, aluminum stearate and the like; the nitrogen source is guanidine hydrochloride, guanidine acetate, chitosan, 1,10-phenanthroline; the solvent is any one of deionized water, methanol, ethanol, ethyl acetate, acetone, diethyl ether, benzene andtoluene; the roasting atmosphere is one or two of nitrogen, ammonia, argon and helium. Compared with the conventional AlN preparation method, the method has the advantages of wide reactant range, environmentally-friendly process, simple operation, high product purity and low cost.

Description

technical field

[0001] The invention belongs to the technical field of material preparation, and in particular relates to a method for preparing AlN powder. Background technique

[0002] Aluminum nitride (AlN) is a group III-V covalent compound, which belongs to the diamond-like nitride of the hexagonal wurtzite crystal structure. Its room temperature strength is high (it is Al 2 o 3 More than 5 times of that), the thermal expansion coefficient is small, which can greatly improve the thermal conductivity of plastics and silicone rubber, and is a good heat-shock resistant material; it has strong resistance to molten metal erosion, and is an ideal crucible for melting and casting pure iron, aluminum or aluminum alloys Material; has excellent electrical insulation, resistivity as high as 426Ω·cm, and good dielectric properties. It is an ideal heat dissipation material and packaging material for large-scale integrated circuits, semiconductor module circuits and high-power devi...

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