High-enthalpy phase-change silicone pad and preparation method thereof

Abstract

The invention discloses a high-enthalpy phase-change silicone pad and a preparation method thereof. The silicone pad includes, by mass, vinyl silicone oil 10-25%, paraffin phase-change microcapsules 50-85%, a crosslinker 0.5-5%, a flame retardant 5-15%, a binder 0.5-4%, a diluent 2-6%, a platinum catalyst 0.01-0.04%, and an inhibitor 0.005-0.02%; all the components add to 100% by mass. The silicone pad has a wide phase change range of 25-70 DEG C, is high in phase-change enthalpy of 100-140 J / g, has excellent flexibility and adhesion force, and certain flame-retarding level and insulation effect. The phase-change material has great sealability, can resist cold and hot impact, and is long in service life.

Description

technical field [0001] The invention relates to the field of thermal management materials, in particular to a high-enthalpy phase-change silica gel gasket and a preparation method thereof. Background technique [0002] At present, with the development of microelectronics integration technology, 3C products such as computers, communications and consumer electronics are also showing a trend of thinning and miniaturization. The densification of semiconductor chips and electronic components puts forward higher requirements for heat dissipation efficiency. Traditional heat dissipation materials, such as heat-conducting silicone pads, heat-conducting silicone grease, etc., have high thermal conductivity, but need to conduct heat out in time with heat pipes or metal sheets, which not only has a complex structure, but also has poor peak heat dissipation and temperature uniformity effects; In addition, thermal conductive silicone grease also has the risk of increasing interface ther...

AI Technical Summary

Problems solved by technology

They all adopt the method of dipping or coating to prepare the phase change film, which requires the viscosity of the system to be small, the amount of microcapsules added is limited to a certain extent, and the latent heat of phase change is less than 110J / g; Or copper foil as a support material to achieve a certain strength for easy application, but these phase change films are lacking in flame retardancy or insulation.

[0007] To sum up, traditional heat dissipation materials such as thermally conductive silicone pads and thermally conductive grease, and existing phase change energy storage materials have many deficiencies in the thermal management of 3C products such as computers, communications and consumer electronics, and cannot meet the application needs of high-end markets.