The invention relates to a thick-film hybrid integrated circuit surface enveloping process which comprises the steps that: a thick-film hybrid integrated circuit is soaked into enveloping liquid by a fixture under the conditions of room temperature and 40 percents to 60 percents humidity, is taken out by the fixture and put into a curing furnace to be dried; the enveloping liquid comprises epoxy-phenolic resin, ethanol and acetone, and the proportion of the weight portions is as follows: epoxy-phenolic resin 100, ethanol 15 to 18, and acetone 15 to 18. The fixture comprises a support (1), a slider (2), a group of fixtures (3) and two limit blocks (4). The thick-film hybrid integrated circuit surface enveloping process has the advantages that: the product for which the enveloping process is adopted has good high temperature and low temperature resistance; a black protective layer is formed on the surface of the product after the product is cured, and the product has excellent insulation, damp-proof, current leakage resistant, anti-shock, dust-proof, anti-corrosive, anti-aging, corona-resistant and other properties, so that the high performance of the thick-film integrated circuit is displayed, and the service life of components which are laminated on the surface can be effectively improved. Because the fixture is adopted, the time can be saved, so that the working efficiency is improved.