Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Epoxy resin-based LED packaging material preparation method

A technology of LED encapsulation and epoxy resin, applied in the field of preparation of light-emitting semiconductor encapsulation materials, can solve the problems of low impact toughness, prone to yellowing, brittleness and the like

Inactive Publication Date: 2019-06-21
FOSHAN GAOMING DISTRICT ZHUAHE NEW MATERIAL TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is aimed at the current common epoxy resin-based packaging materials, which are prone to yellowing under the conditions of ultraviolet light and high temperature, large internal stress after curing, brittle quality, low impact toughness and poor heat dissipation performance. , provides a preparation method of epoxy resin-based LED encapsulation material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin-based LED packaging material preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Put rice husk, biogas slurry and glycine in a mass ratio of 1:5:1 and put them into a fermenter, seal the mouth of the tank and place it at a temperature of 35-45°C for 9-11 days of sealed fermentation. Filtration and separation to obtain fermentation filter residue, put the fermentation filter residue into a carbonization furnace, and carbonize at a temperature of 400-450°C for 1-2 hours under the protection of nitrogen to obtain carbonized fermentation filter residue; mix the above-mentioned carbonized fermentation filter residue and hydrogen-containing silicone oil in an equal mass ratio Then put it into the calcination furnace, feed argon gas into the calcination furnace until all the air in the furnace is replaced, heat up to 1600-1800°C, keep the heat for sintering for 5-7 hours, take out the sintered product, and use 20% hydrofluoric acid Rinse for 15 to 20 minutes to obtain porous silicon carbide whiskers; mix porous silicon carbide fibers and a sodium silicate s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of preparation of light emitting semiconductor packaging materials, particularly to an epoxy resin-based LED packaging material preparation method, which comprises: mixing rice husk as a raw material and biogas slurry, carrying out sealed fermentation, blending the obtained material and a sodium silicate solution to obtain a modified filler, and carrying out a mixed reaction on the modified filler and an epoxy resin to finally prepare the epoxy resin-based LED packaging material. According to the present invention, rice husk is preliminarily degraded through microbial fermentation to obtain porous silicon carbide crystal whiskers, the silicon carbide and sodium silicate are blended, ortho-silicic acid is subjected to heat induced hydrolysis at ahigh temperature to produce nano-silica, the nano-silica is deposited in situ on the inner pores and the surface of the porous silicon carbide to obtain a self-made modified filler, and the silanol and the hydroxyl group are subjected to a dehydration condensation reaction at a high temperature, such that the occurrence of yellowing, mechanical property reducing and other adverse phenomena of thepackaging material due to long-term working time and excessive heat dissipation can be avoided, and the method has wide application prospect.

Description

technical field [0001] The invention relates to the technical field of preparation of light-emitting semiconductor packaging materials, in particular to a preparation method of epoxy resin-based LED packaging materials. Background technique [0002] A semiconductor light-emitting diode (LED for short) is a solid semiconductor light-emitting device. Compared with traditional lighting equipment, LED has the characteristics of environmental protection, energy saving, long life, etc., and has simple structure, low luminous voltage, especially low power, high luminous efficiency, and power consumption is only about 20% of traditional lighting sources. Up to 100,000 hours, which is dozens of times that of ordinary lamps. At the same time, the structure does not contain fragile parts such as glass and filaments. It is strong and unbreakable, and can reduce the pollution of waste to the environment. LED has been recognized as the most valuable new light source in the 21st century, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/12C08K7/26
Inventor 胡次兵张晶张建初
Owner FOSHAN GAOMING DISTRICT ZHUAHE NEW MATERIAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com