Packaging adhesive for perovskite and application method

An application method and encapsulation adhesive technology, which can be applied in adhesive types, photovoltaic power generation, electrical components, etc., can solve perovskite damage, photoelectric performance degradation, narrow temperature application range below 20°C or above 40°C, etc. problems, to avoid damage, increase device stability, and prolong device life

Inactive Publication Date: 2019-07-23
TIANJIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The currently disclosed perovskite device packaging methods include: (1) filling and packaging with epoxy, silicone, polyurethane or ultraviolet light-curing glue, but the working temperature of this kind of packaging glue is higher than 120°C, which is close to calcium The decomposition temperature of the titanium ore material is likely to cause damage to the perovskite, resulting in a decrease in the photoelectric performance; (2) AB glue packaging composed of acrylic acid, epoxy, polyurethane, etc., although the AB packaging glue can be packaged at room temperature, the glue ...

Method used

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  • Packaging adhesive for perovskite and application method
  • Packaging adhesive for perovskite and application method
  • Packaging adhesive for perovskite and application method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The polystyrene (PS) plastic cover is a polymer encapsulant formed by mixing polystyrene and cyclohexane. It is suitable for organic-inorganic hybrid perovskite CH with mica crystals as the substrate of perovskite devices. 3 NH 3 PbBr 3 Encapsulate.

[0047] Step 1. Take 10ml cyclohexane solution (purity> 99%) into a 50ml beaker, weigh 1g of polystyrene into cyclohexane, stir the mixed solution at room temperature for 30 minutes, so that the polystyrene is fully dissolved in cyclohexane to form a polymer encapsulation glue

[0048] Step 2. Cut the polystyrene plastic bottom plate to 25*25*0.2mm and the upper cover plate to 20*20*0.2mm, and clean it. Use a micropipette to extract 4ml of polymer encapsulated glue and drop it on a 25*25*0.2mm polystyrene plastic bottom plate, smear the entire surface evenly, and it will contain organic-inorganic hybrid perovskite CH 3 NH 3 PbBr 3 The lower surface of the mica substrate with an area of ​​12*12*0.1mm is covered on the bottom plate...

Embodiment 2

[0052] The polystyrene (PS) plastic cover is a polymer encapsulant formed by mixing polystyrene and cyclohexane. It is suitable for organic-inorganic hybrid perovskite CH with mica crystals as the substrate of perovskite devices. 3 NH 3 PbCl 3 Encapsulate.

[0053] Step 1. Take 10ml cyclohexane solution (purity> 99%) into a 50ml beaker, weigh 1g of polystyrene and add it to cyclohexane, stir the mixed solution at room temperature for half an hour, so that the polystyrene is fully dissolved in cyclohexane to form a polymer encapsulant

[0054] Step 2. Cut the polystyrene plastic bottom plate to 25*25*0.2mm and the upper cover plate to 20*20*0.2mm, and clean it. Use a micropipette to extract 4ml of polymer encapsulated glue and drop it on a 25*25*0.2mm polystyrene plastic bottom plate, smear the entire surface evenly, and it will contain organic-inorganic hybrid perovskite CH 3 NH 3 PbCl 3 The lower surface of a mica substrate with a surface area of ​​12*12*0.1mm is covered on the bot...

Embodiment 3

[0057] The polystyrene (PS) plastic cover is a polymer encapsulant formed by mixing polystyrene and cyclohexane. It is suitable for organic-inorganic hybrid perovskite CH with mica crystals as the substrate of perovskite devices. 3 NH 3 PbI 3 Encapsulate.

[0058] Step 1. Take 10ml cyclohexane solution (purity> 99%) into a 50ml beaker, weigh 1g of polystyrene and add it to cyclohexane, stir the mixed solution at room temperature for half an hour, so that the polystyrene is fully dissolved in cyclohexane to form a polymer encapsulant

[0059] Step 2. Cut the polystyrene plastic bottom plate to 25*25*0.2mm and the upper cover plate to 20*20*0.2mm, and clean it. Use a micropipette to extract 2ml polymer encapsulated glue droplets on a 25*25*0.2mm polystyrene plastic bottom plate, and smear the entire surface evenly. The area containing the organic-inorganic hybrid perovskite CH3NH3PbI3 will be 12*12* The lower surface of the 0.1mm mica substrate is covered on the bottom plate and the ...

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Abstract

The invention relates to a packaging adhesive for perovskite and an application method. The packaging adhesive is composed of a polymer plastic and a non-polar solvent; 0.1-0.5g polymer plastic is added into 1ml non-polar solvent; the polymer plastic is polyethylene, polypropylene, polyvinyl chloride, polystyrene or acrylonitrile-butadiene-styrene polymer; the non-polar solvent comprises one or more of cyclohexane, hexane and kerosene. In the novel polymer packaging adhesive composed of the polymer plastic and the non-polar solvent, the polymer plastic is used as a packaging layer, so that theperovskite device can be effectively protected. The packaging adhesive and the application method have the advantages of low packaging cost, simple process flow, packaging under room temperature, andthe like. The perovskite device packaged according to the invention can be prevented from being damaged by high temperature, acid, alkali, aqueous solution, and the like, and the stability of photoelectric property of the device can be promoted.

Description

Technical field [0001] The invention relates to a packaging glue and an application method for a perovskite photocell and a photodetector, and belongs to the technical field of optoelectronic devices. Background technique [0002] Organic-inorganic hybrid perovskite crystals (CH 3 NH 3 PbX 3 , X = Cl, Br, I; hereafter referred to as MAPbX 3 , MA=CH 3 NH 3 - ) Is a cost-effective optoelectronic semiconductor material. Because hybrid perovskite crystals have high light absorption efficiency, long carrier lifetime and diffusion length, and low defect density, they are a new generation of solar energy conversion materials and have been reported for the first time since 2009 by the Miyasaka research group at Toyin Yokohama University, Japan After the hybrid perovskite solar cell has a photoelectric conversion efficiency of 3.8%, its highest conversion efficiency has rapidly increased to 22.1% in just a few years. At present, hybrid perovskite cells not only achieve the photoelectric ...

Claims

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Application Information

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IPC IPC(8): C09J125/06H01L51/44H01L51/48
CPCC09J125/06H10K71/00H10K30/88Y02E10/549
Inventor 王迪张海欣张明静吴国政薛豪
Owner TIANJIN UNIVERSITY OF TECHNOLOGY
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