Packaging adhesive for perovskite and application method

Abstract

The invention relates to a packaging adhesive for perovskite and an application method. The packaging adhesive is composed of a polymer plastic and a non-polar solvent; 0.1-0.5g polymer plastic is added into 1ml non-polar solvent; the polymer plastic is polyethylene, polypropylene, polyvinyl chloride, polystyrene or acrylonitrile-butadiene-styrene polymer; the non-polar solvent comprises one or more of cyclohexane, hexane and kerosene. In the novel polymer packaging adhesive composed of the polymer plastic and the non-polar solvent, the polymer plastic is used as a packaging layer, so that theperovskite device can be effectively protected. The packaging adhesive and the application method have the advantages of low packaging cost, simple process flow, packaging under room temperature, andthe like. The perovskite device packaged according to the invention can be prevented from being damaged by high temperature, acid, alkali, aqueous solution, and the like, and the stability of photoelectric property of the device can be promoted.

Description

Technical field [0001] The invention relates to a packaging glue and an application method for a perovskite photocell and a photodetector, and belongs to the technical field of optoelectronic devices. Background technique [0002] Organic-inorganic hybrid perovskite crystals (CH 3 NH 3 PbX 3 , X = Cl, Br, I; hereafter referred to as MAPbX 3 , MA=CH 3 NH 3 - ) Is a cost-effective optoelectronic semiconductor material. Because hybrid perovskite crystals have high light absorption efficiency, long carrier lifetime and diffusion length, and low defect density, they are a new generation of solar energy conversion materials and have been reported for the first time since 2009 by the Miyasaka research group at Toyin Yokohama University, Japan After the hybrid perovskite solar cell has a photoelectric conversion efficiency of 3.8%, its highest conversion efficiency has rapidly increased to 22.1% in just a few years. At present, hybrid perovskite cells not only achieve the photoelectric ...

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Problems solved by technology

[0004] The currently disclosed perovskite device packaging methods include: (1) filling and packaging with epoxy, silicone, polyurethane or ultraviolet light-curing glue, but the working temperature of this kind of packaging glue is higher than 120°C, which is close to calcium The decomposition temperature of the titanium ore material is likely to cause damage to the perovskite, resulting in a decrease in the photoelectric performance; (2) AB glue packaging composed of acrylic acid, epoxy, polyurethane, etc., although the AB packaging glue can be packaged at room temperature, the glue Poor water resistance, becomes soft and degummed when exposed to water, and the applicable temperature range is narrow. When the temperature is lower than 20°C or higher than 40°C, colloidal cracking will occur and the encapsulation effect will decrease; (3) Inorganic oxide layer encapsulation, such as Chinese patent CN108539022A proposes that the perovskite surface first Thermally evaporated molybdenum oxide protective layer, and then magnetron sputtering aluminum oxide layer to complete device packaging, but this packaging method has complicated process, expensive equipment, and high cost

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