A kind of low-temperature aluminum soldering solder paste and preparation method thereof

A technology of aluminum solder and solder paste, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as weak solder joints, reduced solder joint life, sticky solder paste, etc., to achieve good printing performance and anti-collapse Excellent performance, good resistance to electrochemical corrosion, full and bright solder joints

Active Publication Date: 2021-10-26
浙江强力控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the aluminum brazing technology using solder paste is mainly faced with the following problems: there is a dense and firm oxide film on the aluminum surface, which not only makes it difficult to braze smoothly, but also easily causes weak solder joints, so that after several times of welding aluminum components After one month, the phenomenon of solder joint loosening and component detachment occurred
However, the above three methods still have certain defects: increasing the metal coating will increase the process and cost; increasing the brazing temperature will damage electronic components, especially not suitable for welding heat-sensitive electronic components; using highly active flux can easily lead to Corrosion of solder joints after soldering significantly reduces the service life of solder joints, and too high activity is easy to corrode solder alloy powder, causing dryness or sanding of solder paste and affecting printing performance
[0003] The Chinese patent application with the publication number CN 102922162 A discloses "a solder paste for aluminum soldering and its preparation method". The flux used is composed of hydroxylamine fluoride, metal active salt, activator, and corrosion inhibitor. The hydroxylamine fluoride in it will release a large amount of highly active hydrofluoric acid, which is highly corrosive to the solder alloy powder and can easily cause the solder paste to become sticky, and the content of the metal active salt used is high, which intensifies the impact of the flux on the solder alloy powder. Corrosion, reducing the storage stability of solder paste
[0004] The Chinese patent application with the publication number CN103317260A discloses "a solder paste for aluminum and aluminum alloy soldering and its preparation method". Composed of salt and ethylene glycol, the solder paste will produce a lot of bubbles and irritating gas during welding, and there will be many residues after welding, which will easily cause corrosion to solder joints and affect the service life of solder joints

Method used

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  • A kind of low-temperature aluminum soldering solder paste and preparation method thereof
  • A kind of low-temperature aluminum soldering solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A low-temperature aluminum soldering solder paste, which consists of the following components by mass percentage: 85% of Sn64Bi35Ag1 alloy powder and 15% of flux, and the flux includes the following components by mass percentage: 30% of fully hydrogenated rosin , Indium Fluoride 10%, Zinc Tartrate 2%, Triethanolamine Borate 4%, Polyaniline 2%, Hydrogenated Castor Oil 7%, and Solvent 45%.

[0028] Preparation steps:

[0029] (1) Add fully hydrogenated rosin and ethylene glycol monobutyl ether into the reaction kettle, stir fully at 100°C, cool to 70°C after the fully hydrogenated rosin is completely melted, add triethanolamine borate, polyaniline, hydrogenated Castor oil, continue to stir until the material dissolves, after cooling to 40°C, add indium fluoride and zinc tartrate, stir evenly, and obtain flux;

[0030] (2) Refrigerate the flux at 2°C for 12 hours, return to temperature at room temperature, grind it with a three-roll mill until the particle size of the flu...

Embodiment 2

[0032] A low-temperature aluminum soldering solder paste is composed of the following components by mass percentage: 90% of Sn3Ag0.5Cu96.5 alloy powder and 10% of flux, and the flux includes the following components by mass percentage: Rosin 25%, indium chloride 5%, zinc citrate 3%, triethanolamine borate 5%, polyaniline 3%, ethylene bis-stearamide 10%, and diethylene glycol butyl ether 49%.

[0033] Preparation steps:

[0034] (1) Add polymerized rosin and diethylene glycol butyl ether into the reaction kettle, stir fully at 120°C, cool to 80°C after the polymerized rosin is completely melted, add triethanolamine borate, polyaniline, ethylene glycol Distearic acid amide, continue to stir until the material dissolves, after cooling to 50°C, add indium chloride and zinc citrate, stir evenly, and obtain flux;

[0035] (2) Refrigerate the flux at 10°C for 24 hours, return to normal temperature, and grind it with a three-roll mill until the particle size of the flux is 10-20 μm, ...

Embodiment 3

[0037]A low-temperature aluminum soldering solder paste, which consists of the following components by mass percentage: 80% of Sn58Bi42 alloy powder and 20% of flux, and the flux includes the following components by mass percentage: 30% of disproportionated rosin, Indium Bromide 8%, Zinc Salicylate 1%, Triethanolamine Borate 2%, Polyaniline 2%, Polyamide Modified Hydrogenated Castor Oil 7%, and Dipropylene Glycol Dimethyl Ether 50%.

[0038] Refer to Example 1 for the preparation steps.

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Abstract

The invention discloses a low-temperature aluminum solder paste and a preparation method thereof. The low-temperature aluminum soldering paste is composed of the following components by mass percentage: 80-90% of solder alloy powder and 10-20% of flux, and the flux includes the following components by mass percentage: Modified rosin 25-35%, metal indium halide 5-10%, hydroxy acid zinc salt 1-3%, triethanolamine borate 2-5%, polyaniline 1-3%, thixotropic agent 3-10% % and solvent 45-55%. The low-temperature aluminum soldering solder paste of the present invention can effectively remove the oxide film on the aluminum surface, realize the strong combination of the solder and the aluminum base material, and form an aluminum soldering joint that is firm and has good electrochemical corrosion resistance, and the tin The ointment has good storage properties and is not dry or sandy.

Description

technical field [0001] The invention relates to the technical field of electronic packaging welding materials, in particular to a low-temperature aluminum soldering solder paste and a preparation method thereof. Background technique [0002] Aluminum brazing technology is widely used in the electronics manufacturing industry. Aluminum not only has good electrical and thermal conductivity, but also has suitable strength, good corrosion resistance and low cost. It has been widely used in the preparation of related devices of electronic appliances, LED lighting components, and intelligent hardware radiators. The use of aluminum solder paste for aluminum brazing to connect devices and substrates is a common technical means in the industry. At present, the aluminum brazing technology using solder paste is mainly faced with the following problems: there is a dense and firm oxide film on the aluminum surface, which not only makes it difficult to braze smoothly, but also easily cau...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/3613B23K35/362B23K35/40
Inventor 何雪连
Owner 浙江强力控股有限公司
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