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A kind of nano-alumina reinforced copper-based composite material and preparation method thereof

A copper-based composite material and nano-alumina technology, which is applied in the field of copper-based composite material preparation, can solve the problems of easy damage to the matrix integrity, non-wetting of the copper matrix, and complicated powder making process, so as to achieve high density and improve the interface Combination, the effect of simple milling process

Active Publication Date: 2020-11-17
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most researchers use Al(NO 3 ) 3 In-situ reaction, such as the invention patent "Preparation Method of Nano-alumina Reinforced Copper Matrix Composite Material" (Chinese Patent No.: CN201110000550.X) applied by Hefei University of Technology, this process has oxygen generation, which is easy to oxidize the copper matrix and is easy Destroying the integrity of the matrix requires hydrogen reduction, the pulverization process is complicated, and this method does not solve the problem of Al 2 o 3 The interfacial bonding challenge of non-wetting to the copper substrate

Method used

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  • A kind of nano-alumina reinforced copper-based composite material and preparation method thereof
  • A kind of nano-alumina reinforced copper-based composite material and preparation method thereof

Examples

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preparation example Construction

[0034] The preparation method of the nano-alumina reinforced copper-based composite material is as follows: figure 1 Shown:

[0035] First utilize Sol-Gel method, by reaction formula (1-1), (1-2) according to Al 2 o 3 Content 0.2-2.0% Weigh an appropriate amount of Al(NO 3 ) 3 9H 2 O is the precursor, the preparation of Al(NO 3 ) 3 solution; then utilize dilute nitric acid 0.1mol / L to dissolve 0.1-0.6% La 2 o 3 And with the prepared Al(NO 3 ) 3 The solution is mixed. Add 0.2mol / L NH2 dropwise to the mixed solution under stirring condition 3 ·H 2 O adjusts PH=9, that is, La(OH) is prepared by Sol-Gel method 3 -Al(OH) 3 Mix the sol, stir for 1 hour, filter and wash the sol until PH = 7, stir and disperse the sol in absolute ethanol for 1 hour, add an appropriate amount of copper powder with a particle size range of 10-50 μm, stir and mix for 1 hour, after 70-80 After drying in a vacuum oven for 8-10 hours at ℃, La(OH) was prepared 3 -Al(OH) 3 Mixed gel-coated co...

Embodiment 1

[0041] First use the Sol-Gel method, by Al 2 o 3 Content 0.2% Weigh an appropriate amount of Al(NO 3 ) 3 9H 2 O is the precursor, the preparation of Al(NO 3 ) 3 solution, and then use dilute nitric acid 0.1mol / L to dissolve 0.1% La 2 o 3 And with the prepared Al(NO 3 ) 3 The solution is mixed. Add 0.2mol / L NH2 dropwise to the mixed solution under stirring condition 3 ·H 2 O adjusts PH=9 to prepare La(OH) 3 -Al(OH) 3 Mix the sol, stir for 1 hour, wait for the sol to fully separate out, filter and wash until PH = 7, stir and disperse the sol in absolute ethanol for 1 hour, and add 99.35% of copper powder with a particle size range of 10-50 μm and stir and mix for 1 hour. After 70 After drying in a vacuum oven at ℃ for 10 h, La(OH) was prepared 3 -Al(OH) 3 Mixed gel-coated copper powder composite powder. The composite powder is pre-pressed into a blank in a graphite abrasive tool, and then is subjected to an initial pressure of 0.5MPa, 400°C heat preservation for ...

Embodiment 2

[0044] The preparation method and process of nano-alumina reinforced copper-based composite material are the same as in Example 1, at first utilizing the Sol-Gel method, by Al 2 o 3 Content 1.0% Weigh an appropriate amount of Al(NO 3 ) 3 9H 2 O is the precursor, the preparation of Al(NO 3 ) 3 solution, and then use dilute nitric acid 0.1mol / L to dissolve 0.3% La 2 o 3 And with the prepared Al(NO 3 ) 3 The solution is mixed. Add 0.2mol / L NH2 dropwise to the mixed solution under stirring condition 3 ·H 2 O adjusts PH=9 to prepare La(OH) 3 -Al(OH) 3 Mix the sol, stir for 1 hour, wait for the sol to be fully separated, filter and wash until PH = 7, stir and disperse the sol in absolute ethanol for 1 hour, and add 98.15% of copper powder with a particle size range of 10-50 μm and stir and mix for 1 hour. After 75 After drying in a vacuum oven at ℃ for 9 hours, La(OH) was prepared 3 -Al(OH) 3 Mixed gel-coated copper powder composite powder. The composite powder is pr...

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Abstract

The invention discloses a nano-aluminium oxide reinforced copper-based composite material. The nano-aluminium oxide reinforced copper-based composite material comprises the following components including, by mass, 0.2%-2.0% of Al2O3, 0.1%-0.6% of La2O3 and the balance copper; and the sum of the mass percentages of the above components is 100%. The invention also discloses a preparing method of thenano-aluminium oxide reinforced copper-based composite material; La(OH)3-Al(OH)3 mixed sol is prepared through a Sol-Gel method, copper powder with the grain size being 10-50 microns is added to be stirred and mixed, the composite powder is charged into a graphite abrasive tool and sintered and formed in a discharge plasma sintering furnace by using a two-step pressure rising and two-step heatingmethod after drying with a vacuum drying oven, and then hot extrusion is carried out to obtain nano-aluminium oxide reinforced copper-based composite material bars. The nano-aluminium oxide reinforced copper-based composite material well maintains the good conductivity of a copper matrix, the mechanical properties such as hardness and tensile strength are significantly improved, and the characteristics of high strength and high conductivity are achieved.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper-based composite materials, and in particular relates to a nano-alumina-reinforced copper-based composite material, and also relates to a preparation method of the alumina-reinforced copper-based composite material. Background technique [0002] Copper is widely used in power electronics and other fields due to its excellent electrical conductivity. However, the annealed tensile strength of copper is 220MPa, the elastic modulus is 115GPa, the yield strength is 60MPa, the Mohs hardness is 3.0, and the thermal expansion coefficient is (25°C) 16.5 μm / m K, low strength at room temperature and high temperature, and poor wear resistance limit the application of copper materials. With the development of industry and technology, higher requirements are put forward for the strength of copper, especially when it is used in the fields of resistance welding electrodes, electronic packaging and fr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C32/00C22C9/00C22C1/05C22C1/10
CPCC22C1/05C22C9/00C22C32/001
Inventor 李树丰朱金超野萌潘登张鑫
Owner XIAN UNIV OF TECH