Polyether-ether-ketone/tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer/chopped quartz fiber material, preparation method and application

A technology of perfluoroalkoxy vinyl ether and tetrafluoroethylene, which is applied in the field of polymer composite materials, can solve the problems of low dielectric properties, low surface energy characteristics, poor material strength, etc., and achieves low dielectric constant, low Linear expansion coefficient, the effect of improving compatibility

Active Publication Date: 2019-11-29
JILIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the inert structure of polyether ether ketone and the low surface energy characteristics of fluorine-containing materials, the materials are mixed and prepared, and the obtained materials have poor strength and small improvement in dielectric properties.
Scientific researchers have done a lot of work on the blending and modification of polyetheretherketone resin, but there is no polyetheretherketone resin-based circuit board on the market.

Method used

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  • Polyether-ether-ketone/tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer/chopped quartz fiber material, preparation method and application
  • Polyether-ether-ketone/tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer/chopped quartz fiber material, preparation method and application
  • Polyether-ether-ketone/tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer/chopped quartz fiber material, preparation method and application

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preparation example Construction

[0067] The present invention also provides a preparation method of the polyether ether ketone / tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer / chopped quartz fiber composite material described in the above technical solution, comprising the following steps:

[0068] After mixing the polyetheretherketone block copolymer containing perfluorononenyloxy side groups with chloroform, adding chopped quartz fibers, mixing the obtained mixed solution with absolute ethanol, followed by suction filtration and drying to obtain Chopped quartz fibers coated with polyether ether ketone block copolymers with perfluorononenyloxy side groups;

[0069] After mixing the silane coupling agent, absolute ethanol, water and hexagonal boron nitride, heating in a water bath, suction filtration, washing with absolute ethanol and drying in sequence to obtain hexagonal boron nitride modified by the silane coupling agent;

[0070] Hexagonal nitrogen modified by polyetheretherketone resin, fusible ...

Embodiment 1

[0089] Preparation of chopped quartz fiber coated with 5wt% m-PEEK-b-PEEK-Ph-OPFN / 5wt% KH550 modified hexagonal boron nitride / 15wt% PFA / PEEK composite

[0090] Add 0.5g m-PEEK-b-PEEK-Ph-OPFN into 50mL of chloroform, mechanically stir at 25°C until completely dissolved, add 5g of chopped quartz fiber, continue stirring at 25°C for 6h, and then dissolve the mixture Slowly pour it into absolute ethanol while stirring, wash with absolute ethanol three times after suction filtration, and dry at 70°C to obtain chopped quartz fibers coated with m-PEEK-b-PEEK-Ph-OPFN, The mass ratio of chopped quartz fiber to m-PEEK-b-PEEK-Ph-OPFN is 10:1.

[0091] Add 0.2g KH550 to 50mL of absolute ethanol, then add 5mL of distilled water, stir mechanically for 10min, then add 5g of hexagonal boron nitride, ultrasonically disperse for 1h, heat in a water bath at 70°C for 6h, suction filter, and use absolute ethanol After washing 3 times and drying at 70°C, KH550 modified hexagonal boron nitride was ...

Embodiment 2

[0096] Preparation of chopped quartz fiber coated with 10wt% m-PEEK-b-PEEK-Ph-OPFN / 5wt% KH550 modified hexagonal boron nitride / 15wt% PFA / PEEK composite

[0097] Add 0.8g m-PEEK-b-PEEK-Ph-OPFN into 90mL chloroform, mechanically stir at 25°C until completely dissolved, add 10g of chopped quartz fiber, continue stirring at 25°C for 7h, and then dissolve the mixture Slowly pour it into absolute ethanol while stirring, wash with absolute ethanol three times after suction filtration, and dry at 70°C to obtain chopped quartz fibers coated with m-PEEK-b-PEEK-Ph-OPFN, The mass ratio of chopped quartz fiber to m-PEEK-b-PEEK-Ph-OPFN is 12.5:1.

[0098] Add 0.2g KH550 to 50mL of absolute ethanol, then add 5mL of distilled water, stir mechanically for 12min, then add 5g of hexagonal boron nitride, ultrasonically disperse for 1h, heat in a water bath at 70°C for 8h, suction filter, and use absolute ethanol After washing 3 times and drying at 70°C, KH550 modified hexagonal boron nitride was...

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Abstract

Belonging to the field of polymer composite materials, the invention provides a polyether-ether-ketone / tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer / chopped quartz fiber composite material, a preparation method and application thereof. According to the invention, a perfluorononenyloxy side group-containing polyether-ether-ketone block copolymer (m-PEEK-PEEK-Ph-OPFN) that has good compatibility with polyether-ether-ketone and a tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer, high temperature resistance and good match with a resin matrix is adopted for coating treatment onchopped quartz fiber; at the same time, a silane coupling agent is employed for surface modification treatment on hexagonal boron nitride to lower the agglomeration degree. Compared with filler without any treatment, the modified filler adopted by the invention has the characteristics of uniform dispersion in the composite material and strong interfacial interaction with the matrix.

Description

technical field [0001] The invention relates to the technical field of polymer composite materials, in particular to a polyether ether ketone / tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer / chopped quartz fiber composite material and its preparation method and application. Background technique [0002] With the gradual development of electronic products in the direction of thinner, miniaturized and multifunctional, and driven by semiconductor mounting technology, people have put forward higher requirements for circuit board technology and substrate materials. It mainly includes that the substrate must have high heat resistance, high thermal conductivity, low dielectric constant, and low thermal expansion coefficient. [0003] At present, among the base materials of circuit boards, flexible circuit boards are mainly polyimide and polyester, hard boards are composite materials of cyanate resin and epoxy resin, and UHF copper-clad laminates are generally polyimide and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/16C08L27/18C08K9/10C08K7/10C08K9/06C08K3/38
CPCC08K2003/385C08L61/16C08L2203/20C08L2205/08C08L27/18C08K9/10C08K7/10C08K9/06C08K3/38
Inventor 岳喜贵李梦竹徐攀张重阳王贵宾姜振华
Owner JILIN UNIV
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