Manufacturing method of metal grid type transparent electrode
A technology of transparent electrodes and metal meshes, which is applied to equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, circuits, etc. Effect
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Embodiment 1
[0020] Dissolve 0.5 g of PVB with a weight average molecular weight of 90,000 and 0.5 g of PVP with a weight average molecular weight of 1.3 million in 20 mL of absolute ethanol, and obtain a uniform solution by magnetic stirring and ultrasonic dispersion. The above solution was spin-coated onto the surface of the copper film (the copper film was attached to polyethylene terephthalate, PET), at a rotational speed of 3000 rpm for 30 s to obtain a phase-separated film. The PVP was selectively removed with deionized water to obtain a PVB network pattern. The unshielded copper is etched away with a ferric chloride solution to obtain a transparent copper grid electrode.
Embodiment 2
[0022] Dissolve 0.3 g of PVB with a weight average molecular weight of 90,000 and 0.5 g of PS with a weight average molecular weight of 200,000 in 20 mL of ethyl acetate, and obtain a uniform solution by magnetic stirring and ultrasonic dispersion. The above solution was spin-coated onto the surface of the copper film (the copper film was attached to the PET) at a rotational speed of 1000 rpm for 90 s to obtain a phase-separated film. Selective removal of PS with toluene yielded a PVB network pattern. The unshielded copper is etched away with an ammonium persulfate solution to obtain a copper grid transparent electrode.
Embodiment 3
[0024] 0.5 g of PAN with a weight average molecular weight of 200,000 and 0.3 g of PMMA with a weight average molecular weight of 100,000 were dissolved in 20 mL of chloroform, and a uniform solution was obtained by magnetic stirring and ultrasonic dispersion. The above solution was spin-coated onto the surface of the copper film (the copper film was attached to the PET) at a rotation speed of 2000 rpm for 60 s to obtain a phase-separated film. Selective removal of PAN with DMF yielded PMMA mesh patterns. The unshielded copper is etched away with a hydrogen peroxide solution to obtain a copper grid transparent electrode.
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