High-temperature three-dimensional Hall sensor with real-time working temperature monitoring function and manufacturing method thereof
A Hall sensor and real-time monitoring technology, which is applied in the manufacture/processing of Hall effect devices, devices applying electro-magnetic effects, and electromagnetic devices, and can solve the problem of being unable to simultaneously monitor the temperature of the environment and sensor devices in real time, and cannot simultaneously realize Real-time monitoring of working temperature, lower sensitivity of vertical Hall sensor, etc., to achieve the effect of small channel electron confinement, large band gap, and low lattice mismatch
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Embodiment 1
[0040] The application of the present invention proposes a high-temperature three-dimensional Hall sensor that integrates SiC vertical type on the back and horizontal GaN heterojunction type on the front, which can realize real-time monitoring of working temperature. figure 1 It is a schematic diagram of the back structure of the device structure. The substrate of SiC material is used to make the vertical Hall sensor, which is used to sense the magnetic fields By and Bx parallel to the surface of the device. The electrode C0 is the signal input terminal, which inputs current or voltage, and the electrodes C1, C2 and C1', C2' are used as the common terminal to be grounded. If there is a magnetic field By parallel to the y direction, the current of the electrodes C0→C1, C0→C2 is perpendicular to the direction of the magnetic field, and the moving carriers are deflected by the Lorentz force, and the potential difference is felt on both sides of the electrodes S1 and S2 , which i...
Embodiment 2
[0054] The production process of the specific embodiment of the application target device of the present invention is described as follows:
[0055] 1) Substrate preparation: prepare the SiC material substrate, and wash the substrate material sequentially with acetone, ethanol, and deionized water to remove pollutants on the surface of the SiC substrate.
[0056] 2) Epitaxial growth: use MOCVD equipment to epitaxially grow the AlGaN / GaN heterojunction structure. The buffer layer is AlN with a thickness of 45nm; the resulting GaN epitaxial layer is unintentionally doped with a thickness of 5μm, and the background electron concentration is less than 3.5×10 16 cm-3; the thickness of the AlGaN barrier layer on the epitaxial layer is 30nm, and the Al composition is 0.25.
[0057] 3) Mesa etching: After the epitaxially grown samples are coated (using AZ6130 positive photoresist) and uniform (forward rotation 600rpm-3s, back rotation 1500rpm-20s, the final photoresist thickness is 1...
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