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Diamine compound as well as preparation method and application thereof

A technology of amine compounds and compounds, which is applied in the preparation of organic compounds, cyanide reaction preparation, chemical instruments and methods, etc., can solve the problem of prolonging the film forming time, reducing the film thickness of slurry, and vitrification of polyimide flexible substrates. Problems such as transition temperature, heat resistance, dimensional stability and mechanical properties decrease, to achieve the effect of improving stability and ensuring heat resistance

Inactive Publication Date: 2020-04-28
FUYANG XINYIHUA MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Usually, the polyamic acid solution prepared by polymerization has a relatively high viscosity, reaching tens of thousands to hundreds of thousands of centipoises, which cannot meet the coating requirements of the panel production line process
Most of the prior art reduces the viscosity of the resin solution by reducing the molecular weight or solid content of the polyamic acid resin, but reducing the molecular weight will affect the glass transition temperature, heat resistance, dimensional stability and mechanical properties of the polyimide flexible substrate. Significantly reduce the impact; reducing the solid content will lead to a decrease in the film thickness of the slurry, a longer film forming time, and an increase in the amount of organic solvents

Method used

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  • Diamine compound as well as preparation method and application thereof
  • Diamine compound as well as preparation method and application thereof
  • Diamine compound as well as preparation method and application thereof

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preparation example Construction

[0053] Based on the same inventive concept, the embodiment of the present invention also provides a preparation method of the above-mentioned diamine compound, comprising: the following steps represented by [chemical reaction formula 1] to [chemical reaction formula 4]:

[0054] Will Carry out oxidation, obtain intermediate A1; Intermediate A1 and Carry out coupling, obtain intermediate A2; Intermediate A2 and or Z-Y-Z coupling to obtain intermediate A3; reduction of intermediate A3 to obtain a diamine compound;

[0055] [Chemical Reaction Formula 1]

[0056]

[0057] Optionally, The specific process of oxidation is: And chromium trioxide, add concentrated sulfuric acid solvent to react.

[0058] [Chemical Reaction Formula 2]

[0059]

[0060] Optionally, intermediate A1 is combined with The specific process of coupling is: intermediate A1 and Pinacol diboronic acid, potassium acetate and 1,1'-bis(diphenylphosphino)ferrocene]palladium dichloride are added i...

Embodiment 1

[0163] Add 5.33g of diamine compound B-1 and 95g of N-methylpyrrolidone into a 1L reaction flask, turn on the mechanical stirring, replace the air in the flask with nitrogen, and place the system in an ice-water bath after all the monomers are dissolved , add A-2 13.97g in batches to the above mixed solution, control the reaction temperature not to exceed 15°C, after the addition is complete, the whole reaction is stirred at room temperature for 3h, then continue to add A-2 0.73g and C-10.71g in turn, at room temperature Stirring was continued for 18 hours to obtain a polyamic acid solution (PAA-1) with a mass concentration of 18%. The viscosity of the polyamic acid solution at 25° C. was tested to be 5100 mPa·s.

Embodiment 2

[0165] Add 5.39g of diamine compound B-1 and 94g of N-methylpyrrolidone into a 1L reaction flask, turn on the mechanical stirring, replace the air in the flask with nitrogen, and place the system in an ice-water bath after all the monomers are dissolved , add A-2 14.26g in batches to the above mixed solution, control the reaction temperature not to exceed 15°C, after the addition is complete, the whole reaction is stirred at room temperature for 3h, then continue to add A-2 0.44g and C-20.54g in turn, at room temperature Stirring was continued for 18 hours to obtain a polyamic acid solution (PAA-2) with a mass concentration of 18%. The viscosity of the polyamic acid solution at 25° C. was tested to be 6550 mPa·s.

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Abstract

The invention discloses a diamine compound as well as a preparation method and application thereof. A diamine compound monomer containing a carboxyl structure is designed and is introduced into a mainchain of a polyamide acid molecule, and therefore, in a process of curing a polyamic acid solution to form a film, carboxyl groups in the molecular main chain and amino groups at the tail end of themolecular chain are subjected to an imidization reaction, a cross-linking reaction occurs between free molecular chains, the movement of the molecular chain is limited by the cross-linking reaction among molecules, the molecular structure stability is improved, heat resistance, dimensional stability and the mechanical property of a flexible substrate material are guaranteed, and the problem that the viscosity and the solid content of polyimide precursor polyamide acid slurry and heat resistance stability, thermal expansion property and the mechanical property of a polyimide film cannot meet the process conditions of a flexible display process at the same time is solved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a diamine compound, its preparation method and application. Background technique [0002] With the rapid development of intelligent display terminals in the direction of thinning, high-definition, bendable, curly, and foldable, flexible display has gradually become an important mainstream display technology for intelligent display terminals, and is widely used in smartphones, wearable devices, In the field of display such as large-size TV. In flexible display devices, flexible substrates are the key materials for realizing flexible displays. Flexible substrates are used to replace traditional rigid glass substrates to realize display forms such as bending, folding and curling of display terminals. Among various flexible display substrate materials, polyimide has become an important class of display substrate materials due to its good heat resistance, low linear thermal expansio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D213/80C07C229/60C07C227/04C08G73/10C08L79/08C08J5/18
CPCC07C229/60C07D213/80C08G73/1007C08G73/1067C08J5/18C08J2379/08C07C2603/24
Inventor 吴京玮王占奇王雪岚李琳
Owner FUYANG XINYIHUA MATERIAL TECH
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