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Epoxy modified aliphatic amine curing agent and application thereof in fixing glue for silicon ingot cutting

A technology of epoxy modification and aliphatic amines, which is applied in the preparation of epoxy resin glue, organic compounds, adhesives, etc., can solve the problems of poisoning, poor impact resistance, weather resistance, and difficult curing, and reduce the risk of falling boards Probability, strong heat resistance, the effect of increasing colloidal hardness and bonding strength

Pending Publication Date: 2020-05-19
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an epoxy-modified fatty amine curing agent and its application in silicon ingot cutting and fixing glue, so as to solve the poor impact resistance and weather resistance of the amine curing agent in the prior art, and it is not easy to operate at room temperature. Under-curing and technical problems with toxic effects

Method used

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  • Epoxy modified aliphatic amine curing agent and application thereof in fixing glue for silicon ingot cutting
  • Epoxy modified aliphatic amine curing agent and application thereof in fixing glue for silicon ingot cutting

Examples

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Embodiment 1

[0035] An epoxy-modified aliphatic amine curing agent, its raw materials include the following components by mass percentage: 10% of epoxy resin, 25% of active diluent, and 65% of polyamine.

[0036] The polyamine is triethylenetetramine.

[0037] The preparation method of epoxy modified fatty amine curing agent comprises the following steps: hydrogenated bisphenol A epoxy resin 2,2-bis(4-hydroxycyclohexyl) propane and reactive diluent AGE (C12-14 fatty glycidyl ether) Put it into the reaction kettle, raise the temperature to 40°C, then gradually add triethylenetetramine dropwise while stirring, continue to stir and raise the temperature to 60°C to keep the constant temperature for 2h, keep it under vacuum -0.1MPa for 1h to remove small molecules, and then check Product viscosity, amine value, reaction speed, hardness, bonding strength and other technical indicators.

[0038] An epoxy fixing glue, including A component and B component, A component includes: epoxy resin 55%, r...

Embodiment 2

[0047] An epoxy-modified aliphatic amine curing agent, its raw materials include the following components by mass percentage: 5% of epoxy resin, 15% of active diluent, and 50% of polyamine.

[0048] The polyamine is triethylenetetramine.

[0049] The preparation method of epoxy modified fatty amine curing agent comprises the following steps: hydrogenated bisphenol A epoxy resin 2,2-bis(4-hydroxycyclohexyl) propane and 690 (phenyl glycidyl ether) are dropped into the reactor, Raise the temperature to 40°C, then gradually add triethylenetetramine dropwise while stirring. After the dropwise addition, continue to stir and raise the temperature to 60°C and keep the constant temperature for 2h. Keep it under vacuum -0.1MPa for 0.5h to remove small molecules, and then check the viscosity of the product. Value, reaction speed, hardness, bonding strength and other technical indicators.

[0050] An epoxy fixing glue, including A component and B component, A component includes: epoxy re...

Embodiment 3

[0059] An epoxy-modified aliphatic amine curing agent, its raw materials include the following components by mass percentage: 15% of epoxy resin, 30% of reactive diluent, and 70% of polyamine.

[0060] The polyamine is triethylenetetramine.

[0061] The preparation method of epoxy modified fatty amine curing agent comprises the following steps: hydrogenated bisphenol A epoxy resin 4,4'-(1-methylethylene) bicyclohexanol and D-691 propylene oxide o-tolyl ether Put it into the reaction kettle, raise the temperature to 40°C, then gradually add triethylenetetramine dropwise while stirring, continue to stir and raise the temperature to 60°C for 2 hours at a constant temperature, keep it under vacuum -0.1MPa for 2 hours to remove small molecules, and then check Product viscosity, amine value, reaction speed, hardness, bonding strength and other technical indicators.

[0062] An epoxy fixing adhesive, including A component and B component, A component includes: 80% epoxy resin, 10% r...

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Abstract

The invention discloses an epoxy modified fatty amine curing agent and application thereof in fixing glue for silicon ingot cutting, belonging to the field of photovoltaic material adhesives. The epoxy modified aliphatic amine curing agent comprises the following raw materials in percentage by mass: epoxy resin, an active diluent and polyamine. The epoxy fixing glue comprises a component A and a component B, wherein the component A comprises epoxy resin, an active diluent, a filler, a pigment, an anti-settling agent, an accelerant, a defoaming agent, a foaming agent and an adhesion promoter; and the component B comprises polymercaptan, the epoxy modified aliphatic amine curing agent, an active diluent, a plasticizer, an accelerant, a filler, a pigment, a defoaming agent and an anti-settling agent. The epoxy modified aliphatic amine curing agent provided by the invention is applied to the epoxy fixing glue used for temporarily bonding and fixing a metal workpiece plate and a plastic plate during silicon ingot diamond wire cutting. The fixing glue has the advantages of good flexibility, high bonding strength, low conductivity, high degumming speed and the like, has good temperature resistance, and can be cured at room temperature.

Description

technical field [0001] The invention relates to the field of curing agents, in particular to an epoxy-modified aliphatic amine curing agent and its application in silicon ingot cutting and fixing glue. Background technique [0002] Photovoltaic power generation is one of the most important clean energy sources with great development potential. Photovoltaic silicon wafers are the basic material for the production of solar cells and components. The purity of polysilicon used to produce photovoltaic silicon wafers must be above 6N level, otherwise the performance of photovoltaic cells will be greatly negatively affected. In recent years, the production technology of polycrystalline silicon wafers has made remarkable progress, and the technology of polycrystalline ingot casting has progressed from G4 to G6. Moreover, the unit volume of the produced polysilicon ingot is gradually increased, the yield is increased, and the manufacturing cost of the polysilicon ingot per unit volu...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/66C08G59/56C09J163/00C09J11/04C09J11/08C09J11/06C07C213/08C07C215/42
CPCC08G59/5026C08G59/66C08G59/56C09J163/00C09J11/04C09J11/08C09J11/06C07C213/08C08K2003/265C07C2601/14C08L83/04C08L23/02C08K3/36C08K3/26C08K5/54C08K5/12C08K13/02C07C215/42
Inventor 宋宁苏泽苏光临陈韬吴世炆黄世文
Owner 广西珀源新材料有限公司
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