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Continuous extrusion process of high-strength and high-conductivity copper alloy, application of continuous extrusion process and die material

An extrusion die, copper alloy technology, applied in the direction of metal extrusion die, metal extrusion forming tool, metal extrusion, etc., to achieve uniform precipitation structure, avoid stress cracking, and uniform solid solution properties.

Active Publication Date: 2020-07-10
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0027] The second technical problem to be solved by the present invention is to propose a continuous extrusion process for high-strength and high-conductivity copper alloys to solve the problem of precipitation and decomposition of supersaturated solid solutions in the continuous extrusion process and improve the uniformity and strength of the structure

Method used

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  • Continuous extrusion process of high-strength and high-conductivity copper alloy, application of continuous extrusion process and die material
  • Continuous extrusion process of high-strength and high-conductivity copper alloy, application of continuous extrusion process and die material
  • Continuous extrusion process of high-strength and high-conductivity copper alloy, application of continuous extrusion process and die material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 0

[0094] Embodiment 0: the preparation embodiment of forging high-temperature nickel-based alloy:

[0095] The alloy ingot is smelted by vacuum smelting + electroslag remelting process, the composition is: 0.05wt.%C, 15wt.%Cr, 6wt.%Mo, 5wt.%W, 2wt.%Ti, 5.5wt.%Al, the rest For you. After the alloy ingot was homogenized at 1250°C for 1h, it was formed by isothermal forging at 1000°C with a deformation of 80%. After that, it was kept at 800°C for 16 hours, quenched and tempered at 350°C for 1 hour, and the tensile properties of the alloy at room temperature to 800°C were tested. The results are shown in Table 1:

[0096] Table 1 High Temperature Mechanical Properties of Alloys

[0097] temperature / ℃ Tensile strength / MPa Yield strength / MPa Elongation / % room temperature 1200 1100 8 500 1220 1120 9 800 1280 1150 9

Embodiment 1-1

[0099] The first step: batching melting: according to the alloy composition of Cu-0.5wt.%Ag, batching is carried out, put into the melting furnace and fully melted, carry out sampling inspection and analysis of oxygen content and alloy element content, feed and fully deoxidize to within 10ppm according to the analysis results, The melt is introduced into the holding furnace through the inner guide groove of the melting furnace.

[0100] The second step: horizontal continuous casting: horizontal continuous casting is carried out under the side of the holding furnace, and two crystallizers with an interval of 400mm are arranged horizontally and installed under the side of the holding furnace. Group 1 cooling units are closest to the holding furnace. The reverse cooling method is adopted, and the temperature of the water inlet is lower than 20°C. The water flow V3 of the third group of cooling units is 2000L / min, the water flow V2 of the second group of cooling units is 2400L / mi...

Embodiment 1-2

[0103] Step 2: Horizontal continuous casting: 4 crystallizers are used with an interval of 200mm. The water flow V3 of the third cooling unit is 100L / min, and the water flow V2 of the second cooling unit is 120L / min. The water flow V1 of the unit is 150L / min, the electromagnetic stirring frequency used is 2Hz, and the cross-sectional area of ​​the blank is 50mm 2 , the extraction speed is 100mm / min, 30 atomizing nozzles are set, the distance between the nozzles is 20mm, the distance between the nozzle and the surface of the billet is 50mm, and the water pressure is 0.5MPa.

[0104] The third step: continuous extrusion: the rotation speed of the extrusion wheel is 8 rpm, the extrusion ratio is 8, and the extrusion gap is 2 mm. Set 25 atomizing nozzles, the interval between the atomizing nozzles is 20mm, the distance between the nozzle and the surface of the billet is 50mm, and the water pressure is 0.5MPa.

[0105] The remaining steps and parameters are the same as in Example ...

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Abstract

The invention discloses a continuous extrusion process of a high-strength and high-conductivity copper alloy, application of the continuous extrusion process and a die material. The die material is made of a forged high-temperature nickel-based alloy, and the alloy comprises 0.05% of C, 15% of Cr, 6% of Mo, 5% of W, 2% of Ti, 5.5% of Al and the balance Ni. The continuous extrusion process of the copper alloy comprises the following steps that (1.1) an extrusion die adopts the forged high-temperature nickel-based alloy; (1.2) the extrusion die is preheated to 500 - 600 DEG C before extrusion isstarted, a copper alloy casting blank is preheated to 700 - 750 DEG C, then the copper alloy casting blank is fed into a die cavity to be subjected to continuous extrusion to obtain a blank, whereinthe rotating speed of an extrusion wheel is controlled to be 3 - 8 rpm, the extrusion ratio is controlled to be 3-8 and the extrusion gap is controlled to be 0.6 - 2 mm; and (1.3) the blank obtained in the step (1.2) is subjected to high-strength cooling water spraying at an outlet of the extrusion die, and the blank is obtained. The invention provides the application of the continuous extrusion process in preparation of the copper alloy. The die material has very good high-temperature mechanical properties, and the continuous extrusion process solves the problem of desolvation and decomposition of a supersaturated solid solution in the continuous extrusion process and ensures the high strength and high conductivity of the copper alloy.

Description

Technical field: [0001] The invention relates to the technical field of non-ferrous metal processing, in particular to a continuous extrusion process of a high-strength and high-conductivity copper alloy, its application and a mold material. Background technique: [0002] As a typical representative of conductor materials, copper alloys are widely used in the field of electrical engineering. With the development of the 5G information age, higher performance requirements are put forward for the key copper alloy conductors used. Taking large-scale integrated circuits as an example, due to the increasingly high level of circuit integration and continuous increase in power density, this requires copper alloys as integrated circuit lead frames to have not only high strength but also high electrical and thermal conductivity, so as to ensure the generation of Lowest possible thermal effect and fast heat dissipation. At the same time, in order to meet the requirements of the semic...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C1/02C22F1/08B22D11/124B22D11/115C21D1/667B21C23/00B21C25/02B21C29/04B21C29/00B21C25/10
CPCC22C9/00C22C1/02C22F1/08C22F1/002B22D11/004B22D11/1246B22D11/124B22D11/115C21D1/667B21C23/001B21C25/025B21C29/04B21C29/003B21C25/10
Inventor 方攸同王宏涛方晓阳刘嘉斌
Owner ZHEJIANG UNIV
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