Manufacturing method of printed circuit conductive circuit

Abstract

The invention discloses a manufacturing method of a printed circuit conductive circuit, and relates to the technical field of printed circuit board manufacturing. The method comprises the following steps: (1) growing a tin seed layer on the surface of a printed circuit insulating substrate; (2) covering the tin seed layer with a patterned dry film; (3) electroplating copper to form a copper conductive circuit; (4) removing the dry film; (5) carrying out heat treatment on the substrate obtained after the treatment in the previous step, so that the copper conductive circuit and the tin seed layer are co-melted into a whole; and 6) etching the tin seed layer to obtain a printed circuit conductive circuit. According to the method, the tin layer etching speed is high, the precision is high, thecircuit is complete and free of side etching, and manufacturing of a high-precision circuit board is facilitated; meanwhile, the copper and the tin are eutectic to form a uniform alloy layer, so thatthe stress between the metals is released, the local defect caused by inconsistent etching speeds of the tin seed layer and the copper conductive wire is prevented, the binding force of the conductive circuit and a bottom layer insulating medium is ensured, and the circuit pattern is good in heat resistance, high in stability and high in reliability.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a conductive circuit of a printed circuit. Background technique [0002] As a "bridge" for carrying electronic components and connecting circuits, printed circuit boards are widely used in communication electronics, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense and aerospace and other fields. indispensable existence. In recent years, under the accelerated evolution of cloud technology, 5G network construction, big data, artificial intelligence, sharing economy, industry 4.0, Internet of Things, etc., the market has put forward higher requirements for PCB manufacturing technology. Density, high precision, and miniaturization require that its manufacturing technology and process urgently need reform and innovation, and the first thing to bear the brunt is the p...

AI Technical Summary

Problems solved by technology

Compared with the traditional printed circuit board circuit pattern production process, the present invention avoids a large number of copper layer etching processes and the side erosion problem caused by etching the copper layer; compared with the circuit pattern production process of thin copper as the seed layer, it avoids The poor bonding force between the electroless copper plating layer and the base material leads to the problems of easy peeling of the circuit and poor thermal stability, avoiding the formation of side corrosion and the reduction of the contact area of ​​the circuit, and also avoiding the failure of the circuit pattern due to uneven and rough corrosion. The problem of meeting the requirements of high-frequency and high-speed signal transmission also avoids the problem that mass production cannot be realized due to high production cost and low efficiency; compared with the circuit pattern production process with thin nickel layer as the seed layer, it avoids The passivation of the nickel plating layer and the reduction of circuit reliability caused by the excessive thickness of the nickel layer avoid the oxidation of the copper surface caused by high temperature heat treatment and the difficulty in realizing the integration of copper and nickel metal

Images