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Binder resin and photosensitive resin composition or coating solution including same

A technology for bonding resins and photosensitive resins, applied in the field of photosensitive resin compositions or coating solutions, and bonding resins, can solve the problems of small difference in dissolution rate, poor developing properties, and difficulty in obtaining tiny patterns, etc., and achieve heat resistance Excellent, excellent heat resistance effect

Pending Publication Date: 2020-07-24
TAKOMA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the difference in solubility between the exposed part and the non-exposed part is not large, so the development characteristics are poor, and part of the binder resin that should remain during the development process is dissolved in the developing solution, so there is a problem that it is difficult to obtain a fine pattern of 10 μm or less
[0005] In addition, JP 52-13315 and JP 62-135824 disclose polyamic acid as a polyimide precursor and a naphtotquinonediazide compound as a dissolution inhibitor to improve thermal stability. It is a photosensitive photoresist composition, but there is a problem that the difference in the dissolution rate between the exposed part and the non-exposed part is not large to the extent that a high-resolution pattern can be formed

Method used

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  • Binder resin and photosensitive resin composition or coating solution including same
  • Binder resin and photosensitive resin composition or coating solution including same
  • Binder resin and photosensitive resin composition or coating solution including same

Examples

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preparation example Construction

[0117]As an example, the preparation method of the adhesive resin of the present invention may include polymerizing a monomer represented by Chemical Formula 13 or a monomer represented by Chemical Formula 13 and a monomer represented by Chemical Formula 14 with a carboxylic dianhydride represented by Chemical Formula 9 The steps of the reaction.

[0118] As an example, the monomer represented by Chemical Formula 13 and the monomer represented by Chemical Formula 14 can be charged in a molar ratio of 1:99 to 99:1.

[0119] As another example, the method for preparing the adhesive resin of the present invention may include a step of polymerizing one or more monomers represented by Chemical Formulas 5 to 8 with carboxylic dianhydride represented by Chemical Formula 9.

[0120] As another example, the method for preparing the adhesive resin of the present invention may include making R in the monomers represented by Chemical Formulas 5 to 8 3 and R' 3 One or more monomers that ...

Synthetic example 1

[0203] Synthesis of Monomer I

[0204] Step 1: 2,2'-((((9H-fluorene-9,9-diyl)bis(4,1-phenylene))bis(oxy))bis(methylene))bis (Ethylene oxide)(2,2'-((((9H-fluorene-9,9-diyl)bis(4,1-phenylene))bis(oxy))bis Synthesis of (methylene))bis(oxirane))

[0205] Step A: After installing (setting) a reflux condenser (reflux condenser) and a thermometer in a three-necked flask (3-Neck flask), add 42.5 g of 9,9-bisphenolfluorene (9,9-bisphenolfluorene), and quantify 220 mL of 2-(chloromethyl)oxirane (2-(chloromethyl)oxirane) was injected afterwards. After adding 100 mg of tetrabutylammonium bromide (Tetrabutylammonium bromide), stirring was started, and the temperature was raised to 90°C, followed by distillation under reduced pressure.

[0206] Step B: after cooling, inject dichloromethane (dichloromethane), and slowly add NaOH. After confirming the product by high performance liquid chromatography (HPLC), aqueous HCl solution was added dropwise to terminate the reaction. After e...

Synthetic example 2

[0214] Synthesis of Monomer II

[0215] Step 1: Carry out using the same synthesis method as Step 1 of Synthesis Example 1 above.

[0216] Step 2: (((9H-fluorene-9,9-diyl)bis(4,1-phenylene))bis(oxy))bis(2-hydroxypropane-3,1-diyl)diacrylate ( Synthesis of (((9H-fluorene-9,9-diyl)bis(4,1-phenylene))bis(oxy))bis(2-hydroxypropane-3,1-diyl)diacrylate)

[0217] After installing (setting) a reflux condenser (reflux condenser) and a thermometer in a three-necked flask (3-Neck flask), under 60.0 g of propylene glycol methyl ether acetate (PGMEA) solvent, add the product of step 1 at room temperature ( Epoxide) 60.0g (0.13mol), acrylic acid (acrylic acid) 20.5g (0.29mol), tetrabutylammonium bromide (Tetrabutylammonium bromide) 0.4g (1mmol). The mixture was further stirred for 4 hours under the temperature condition of a reaction temperature of 100°C to 120°C. After the product was confirmed by high performance liquid chromatography (HPLC), the reaction was terminated, and after coo...

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Abstract

The present invention relates to a binder resin or the like which as an organic material for displays such as TFT-LCD, OLED, and TSP displays is applied to photoresist compositions and coating materials, and is characterized by being highly functional and having high performance with respect to heat resistance, chemical resistance, transmissivity, a high refractivity, mechanical properties, flexibility, developability, or pattern straightness and the like.

Description

technical field [0001] The present invention relates to an adhesive resin having high functional and high-performance properties such as heat resistance, chemical resistance, transparency, high refractive index, mechanical properties, flexibility, developability, and pattern flatness, and a photosensitive resin containing the same. Resin composition or coating solution. Background technique [0002] Photosensitive resin composition suitable for display devices such as thin film transistor liquid crystal display (TFT-LCD), organic light emitting diode (OLED), touch panel (TSP), etc. The way of forming patterns can be divided into positive photosensitive material and negative photosensitive material. The positive photosensitive material is dissolved by the developer solution in the ultraviolet (UV) and ultraviolet irradiated area to form a pattern, and the negative photosensitive material causes a photocuring reaction in the ultraviolet (UV) and ultraviolet irradiated part, s...

Claims

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Application Information

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IPC IPC(8): G03F7/033G03F7/038G03F7/004G03F7/028
CPCG03F7/004G03F7/028G03F7/033G03F7/038
Inventor 柳美善金根洙郑统一林哲圭林烘圭
Owner TAKOMA TECH