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Method for plating diamond surface with tungsten

A technology of diamond and diamond particles, applied in metal material coating process, heating inorganic powder coating, coating and other directions, can solve the problems of uneven film thickness, leakage of tungsten film, leakage of diamond particles, etc., to achieve simple equipment , Resistivity drop, easy to operate effect

Pending Publication Date: 2020-08-25
JIANGXI IONIC RARE EARTH ENG RES CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, there are also technical difficulties in coating a uniform and dense tungsten film on the diamond surface. The existing tungsten plating methods mainly include magnetron sputtering, chemical vapor deposition, salt bath plating, and powder coating sintering. All tungsten plating methods have different disadvantages and limitations
Lu Qingyu proposed the magnetron sputtering method in the "Metal Coating Method for Forming Chemical Bonding on Diamond Particles" (CN1752267A). Although this method can coat tungsten on the surface of diamond particles, the amount of single coating is small. The thickness of the obtained film is uneven, and there will be a phenomenon of missing plating on a certain crystal face of the diamond or even some diamond particles, especially when the size of the diamond particles is small. The phenomenon of missing plating is more serious; at the same time, this method requires special equipment, and the production efficiency is low. Requires special target materials and special personnel to operate
In "A Method for Plating Tungsten on the Surface of Diamond Powder" (CN 106521451A), Ma Jie et al. used the chemical deposition method to plate tungsten on the diamond surface at 550-700°C. The coating temperature of this process is low and does not cause thermal damage to the diamond, but The phase of the coating is W, and the metallurgical combination of diamond and tungsten does not form WC
In "A Method for Plating Tungsten on Diamond Surface" (CN 103388142 A), Yu Xinquan et al. used the salt bath plating method to plate tungsten on the diamond surface, but the high plating temperature (900-1000°C) easily caused thermal damage to the diamond.
Wang Xitao et al. used the diamond covering combustion method to plate tungsten in "A New Type of High Thermal Conductivity Copper Matrix Composite Material Preparation Method" (CN 104651658 A) to obtain a coating composed of W phase and WC phase, but the coating temperature is high (up to 950 ~1050℃), easy to cause thermal damage to diamond
Xiang Bo proposed a new method (Xiang Bo, Xie Zhigang, He Yuehui, etc. A new method for coating metal tungsten on the surface of diamond [J]. Chinese Journal of Nonferrous Metals, 2007, 17(9): 1511~1515.), that is, to use h 2 / H 2 O mixed gas reduces tungsten oxide containing catalyst at 750℃~900℃, uses tungsten oxide evaporation in water vapor and chemical vapor phase transport, and tungsten is plated on the diamond surface. The tungsten film obtained by this method has serious underplating phenomenon.

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  • Method for plating diamond surface with tungsten
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  • Method for plating diamond surface with tungsten

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preparation example Construction

[0039] The present invention has no special requirements on the preparation method of the colloidal palladium solution, and it can be prepared by a preparation method well known in the art. Taking the preparation of 1L colloidal palladium solution as an example, the preparation method of said colloidal palladium solution preferably comprises the following steps: 75g of tin protochloride is added in 200mL of analytically pure hydrochloric acid, stirred until fully dissolved, then 7g of sodium stannate is added, stirred, and prepared Prepare liquid B; mix 100mL of analytically pure hydrochloric acid with 200mL of distilled water, stir evenly, then add 1g of palladium chloride and stir, then add 2.53g of stannous chloride, stir to fully react and dissolve for 10-15min, and make A solution; slowly add the B solution into the A solution, place the obtained mixed solution in an aqueous solution at 40-50° C. for 3-4 hours, and add an appropriate amount of deionized water to dilute the...

Embodiment 1

[0056] Weigh 10.00g 40 / 45 mesh synthetic diamond (resistivity 5.4×10 8 Ω cm), put the diamond in 50mL 10% NaOH aqueous solution, wash it with ultrasonic vibration for 0.5h, take it out and wash it with deionized water until neutral; then place the diamond in 50mL 10% HCl solution and soak it for 0.5h, After taking it out, wash it with deionized water to neutrality; add 50mL of 30% nitric acid solution and boil for 10min to carry out roughening treatment, and wash it with deionized water to neutrality to obtain roughened diamond particles; place the diamond particles in a newly configured In the colloidal palladium solution, stir rapidly for 5 minutes, wash with deionized water until neutral; then use 25g / L sodium hydrogen hypophosphite solution to degel, stir rapidly for 3 minutes, then wash with deionized water until neutral, and then wash with ethanol for 10 minutes, Finally, wash it with deionized water, put the diamond in an oven and dry it at 100° C. for later use, and ob...

Embodiment 2

[0061] Weigh 10.00g 400 mesh artificial diamond (resistivity 1.3×10 8 Ω cm), put the diamond in 50mL 10% NaOH aqueous solution, wash it with ultrasonic vibration for 0.5h, take it out and wash it with deionized water until neutral; then place the diamond in 50mL 10% HCl solution and soak it for 0.5h, After taking it out, wash it with deionized water to neutrality; add 50mL of 30% nitric acid solution and boil for 3min to carry out coarsening treatment, and wash it with deionized water to neutrality to obtain roughened diamond particles; place the diamond particles in the newly prepared In the colloidal palladium solution, stir rapidly for 5 minutes, wash with deionized water until neutral; then use 25g / L sodium hydrogen hypophosphite solution to degel, stir rapidly for 3 minutes, then wash with deionized water until neutral, and then wash with alcohol for 10 minutes, Finally, wash it with deionized water, put the diamond in an oven and dry it at 100° C. for later use, and obta...

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Abstract

The invention relates to the technical field of coating, in particular to a method for plating a diamond surface with tungsten. The method includes the following steps that diamond particles are roughened, and roughed diamond particles are obtained; the roughened diamond particles and a colloid palladium solution are mixed, sensitization-activation are carried out, then the sensitized-activated diamond particles and peptizing liquid are mixed for peptizing, and activated diamond particles are obtained; and the activated diamond particles and a plating material are mixed, an obtained mixture issubjected to a plating reaction in a hydrogen atmosphere, and a coating is formed on the diamond surface. The coating is prepared from components of W and WC. The temperature of the plating reactionis 700-800 DEG C. The plating material is blue tungsten or purple tungsten. The coating can be formed on the diamond surface at a relatively low temperature, so that heat injuries of diamond are prevented from being caused. The coating is dense and uniform, the phenomenon of skip plating is avoided, and the cost is low.

Description

technical field [0001] The invention relates to the technical field of coating, in particular to a method for coating tungsten on a diamond surface. Background technique [0002] Diamond has the highest thermal conductivity among natural materials (1200-2000W·m -1 ·K -1 ), using it as the second phase, and the diamond-Cu composite material obtained by combining with high thermal conductivity metal copper can theoretically obtain extremely excellent thermal conductivity performance, so it is the most potential thermal management material for a new generation of electronic packaging. become a research hotspot. However, due to the poor wettability of the two phases of diamond and copper, the development or optimization of feasible interface optimization methods has become the core of related research work. [0003] In order to improve the wettability between diamond and copper, tungsten plating on the surface of diamond is an effective method. Among the carbides correspondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/08
CPCC23C24/082C23C24/085
Inventor 罗莉周强温禄潘锡翔魏世超
Owner JIANGXI IONIC RARE EARTH ENG RES CO LTD