Preparation method of multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate)

A surface function modification and fabric flexibility technology, applied in electronic equipment, circuit substrate materials, chemical instruments and methods, etc., can solve the problem of low bending strength, poor adhesion of outer copper foil, high glass transition temperature, etc. question

Active Publication Date: 2020-11-24
无锡睿龙新材料科技有限公司
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a polyimide film (PI film) that mainly enhances flexibility, such as Chinese patent 201010621313.0, the flexible copper clad laminate made by using it has a high glass transition temperature, which is not suitable for rigid-flexible transition at room temperature. And the light transmittance a

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate)
  • Preparation method of multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate)
  • Preparation method of multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] This embodiment provides a flexible high-frequency copper-clad laminate with multi-layer polymerized surface functionally modified electronic fiber cloth, including a graphene oxide metallized reinforced nanofiber layer 1 located in the middle layer, and a graphene oxide metallized reinforced nanofiber layer located in the middle layer. The polypyrrole-polyethylene terephthalate copolymer coated electronic fiber cloth layer 2 on both sides of 1 and the two sides of the polypyrrole-polyethylene terephthalate copolymer coated electronic fiber cloth layer 2 The first copper foil layer 3-1 and the second copper foil layer 3-2.

[0055] Wherein, graphene oxide metallized reinforced nanofibers, by weight components, include the following components:

[0056]

[0057]

[0058] Wherein, the preparation method of graphene oxide metallization reinforced nanofiber comprises the following steps:

[0059] B1: 30 parts of graphene oxide powder are ultrasonically dissolved in 3...

Embodiment 2

[0091] This embodiment provides a flexible high-frequency copper-clad laminate with multi-layer polymerized surface functionally modified electronic fiber cloth, including a graphene oxide metallized reinforced nanofiber layer 1 located in the middle layer, and a graphene oxide metallized reinforced nanofiber layer located in the middle layer. 1 The poly(3-butylthiophene)-polyurethane copolymer coated electronic fiber cloth layer 2 on both sides and the first copper on both sides of the poly(3-butylthiophene)-polyurethane copolymer coated electronic fiber cloth layer 2 foil layer 3-1 and a second copper foil layer 3-2.

[0092] Wherein, graphene oxide metallized reinforced nanofibers, by weight components, include the following components:

[0093]

[0094] A method for preparing graphene oxide metallized reinforced nanofibers, comprising the following steps:

[0095] B1: 35 parts of graphene oxide powder are ultrasonically dissolved in 7.5 parts of ethylene glycol at a fr...

Embodiment 3

[0126] This embodiment provides a flexible high-frequency copper-clad laminate with multi-layer polymerized surface functionally modified electronic fiber cloth, including a graphene oxide metallized reinforced nanofiber layer 1 located in the middle layer, and a graphene oxide metallized reinforced nanofiber layer located in the middle layer. The polyacetylene-polyvinyl alcohol copolymer coated electronic fiber cloth layer 2 on both sides of 1 and the first copper foil layer 3-1 and the second copper foil layer 3-1 on both sides of the polyacetylene-polyvinyl alcohol copolymer coated electronic fiber cloth layer 2 Copper foil layer 3-2.

[0127] Wherein, graphene oxide metallized reinforced nanofibers, by weight components, include the following components:

[0128]

[0129] A method for preparing graphene oxide metallized reinforced nanofibers, comprising the following steps:

[0130] B1: 32.5 parts of graphene oxide powder were ultrasonically dissolved in 5.5 parts of e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate) and a preparation method thereof. The high-frequency CCL comprises a graphene oxide metallized reinforced nanofiber layer located in the middle layer and conductive high-molecular polymer-insulating high-molecular polymer copolymer coated electronic fiber cloth layers located on two sides. The multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL has three layers of thin films including the graphene oxide metallized reinforced nanofiber layer which is located in the middle layer and switched between a crystalline metal oxide form and an amorphous metal microform and the polymer copolymer coated electronic fiber cloth layers which are located on the two sides of the graphene oxide metallized reinforced nanofiber layer and have amorphous-state and crystal-state microstructures, the three layers of thin films are subjected to press fit with first copper foil and second copper foil located on the outer layer finally, and the high-frequency CCL which has good tensile property, elasticity modulus andbending strength, is capable of effectively resisting ultraviolet light and increasing light transmittance and has good bonding strength with the copper foil and lower stripping strength is prepared.

Description

technical field [0001] The invention belongs to the technical field of high-frequency copper-clad laminates, and in particular relates to a method for preparing a flexible high-frequency copper-clad laminate with multi-layer polymerized surface functionally modified electronic fiber cloth. Background technique [0002] With the rapid development of information science and technology, the market demand for various electronic consumer products with high-speed information processing functions is strong, and higher technical requirements are constantly put forward, such as high-speed information transmission, integrity, multi-functionality and miniaturization of products, etc. , thus promoting the continuous development of high-frequency high-speed application technology. Modern electronic products tend to be miniaturized and multi-functional, which requires high-frequency copper clad laminates (PCB boards) to achieve high density and high performance. Special structural boards...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B15/20B32B15/14B32B33/00C08L1/28C08K9/02C08K3/04C08G81/00C08G81/02H05K1/03
CPCB32B5/02B32B15/14B32B15/20B32B33/00B32B2255/02B32B2260/021B32B2307/206B32B2307/306B32B2307/51B32B2307/54B32B2307/546B32B2457/08C08G81/00C08G81/024C08K9/02C08K2201/001C08K2201/011C08K3/042H05K1/036C08L1/284
Inventor 向中荣
Owner 无锡睿龙新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap