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Epoxy molding compound as well as preparation method and application thereof

A technology of epoxy molding compound and epoxy resin, which is applied in the field of semiconductor packaging, can solve the problems of device temperature rise and large heat generation, and achieve the effects of reducing thermal expansion coefficient, increasing glass transition temperature, and facilitating melting and mixing

Inactive Publication Date: 2020-12-29
湖南国芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the third generation of power semiconductors is moving towards a small-profile, high-density packaging structure, the device generates a lot of heat during operation, which leads to an increase in device temperature

Method used

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  • Epoxy molding compound as well as preparation method and application thereof
  • Epoxy molding compound as well as preparation method and application thereof
  • Epoxy molding compound as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] Raw materials and proportioning that adopt in the present embodiment are:

[0083] 4.0 parts of o-cresol novolac epoxy resin (EOCN6650, Hunan Jiashengde Material Technology Co., Ltd.), 1.0 parts of hyperbranched epoxy resin (HyPer DE1050, Wuhan Hyperbranched Resin Technology Co., Ltd.), 3.5 parts of curing agent (PFNH9880L, Hunan Jiashengde Shengde Material Technology Co., Ltd.), 0.8 parts of flame retardant (ammonium polyphosphate), 70.0 parts of inorganic filler (fusible silica powder with an average particle size of 80 μm), 0.2 parts of palm wax, 0.3 parts of accelerator (2-methyl imidazole), 0.5 part of coupling agent (as shown in formula (a)) and 0.5 part of carbon black.

[0084]

[0085] Utilize above-mentioned raw material to prepare epoxy molding compound, comprise the steps:

[0086] S1. Pulverize the o-cresol novolac epoxy resin and curing agent respectively, and pass through a 100 mesh sieve for subsequent use;

[0087] S2. Take the sieved o-cresol novo...

Embodiment 2

[0092] Raw materials and proportioning that adopt in the present embodiment are:

[0093] 8.0 parts of o-cresol novolac epoxy resin (EOCN6700, Hunan Jiashengde Material Technology Co., Ltd.), 3.0 parts of hyperbranched epoxy resin (HyPer DE1045, Wuhan Hyperbranched Resin Technology Co., Ltd.), 6.0 parts of curing agent (PNH9780M, Hunan Jiashengde Shengde Material Technology Co., Ltd.), 2.0 parts of flame retardant (zinc borate), 80.0 parts of inorganic filler (fusible silica powder with an average particle size of 200 μm), 1.0 part of palm wax, 0.8 parts of accelerator (2-ethyl- 4-methylimidazole), 2.0 parts of coupling agent (as shown in formula (b)) and 0.8 parts of carbon black.

[0094]

[0095] Utilize above-mentioned raw material to prepare epoxy molding compound, comprise the steps:

[0096] S1. Pulverize the o-cresol novolac epoxy resin and curing agent respectively, and pass through a 100 mesh sieve for subsequent use;

[0097] S2. Take the sieved o-cresol novola...

Embodiment 3

[0102] Raw materials and proportioning that adopt in the present embodiment are:

[0103] 6.0 parts of o-cresol novolac epoxy resin (EOCN6850, Hunan Jiashengde Material Technology Co., Ltd.), 2.0 parts of hyperbranched epoxy resin (HyPer ME1050, Wuhan Hyperbranched Resin Technology Co., Ltd.), 5.0 parts of curing agent (PNH9780H, Hunan Jiashengde Shengde Material Technology Co., Ltd.), 1.2 parts of flame retardant (melamine), 75.0 parts of inorganic filler (fusible silica powder with an average particle size of 150 μm), 0.6 part of palm wax, 0.6 part of accelerator (2-methylimidazole) , 1.4 parts of coupling agent (as shown in formula (c)) and 0.6 parts of carbon black.

[0104]

[0105] Utilize above-mentioned raw material to prepare epoxy molding compound, comprise the steps:

[0106] S1. Pulverize the o-cresol novolac epoxy resin and curing agent respectively, and pass through a 100 mesh sieve for subsequent use;

[0107] S2. Take the sieved o-cresol novolac epoxy resi...

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Abstract

The invention provides an epoxy molding compound which takes o-cresol formaldehyde epoxy resin and hyperbranched epoxy resin as base resins, and the hyperbranched epoxy resin is selected from one or more of compounds shown in a formula (1) and a formula (2). Meanwhile, when the epoxy molding compound is prepared, a curing agent, an accelerant, an inorganic filler and a coupling agent are also added. The epoxy resin, the curing agent, the accelerant, the inorganic filler and the coupling agent influence each other and have a synergistic effect. The epoxy resin and the curing agent are used forguaranteeing the high glass transition temperature of the epoxy molding compound, the hyperbranched epoxy is used for improving the fluidity of the resin and achieving a toughening effect, the accelerant is used for influencing the reaction gelling time, the filler and the coupling agent are used for reducing the shrinkage rate in the curing process, and reducing the internal stress. Through the synergistic effect of the components, the epoxy molding compound prepared by the invention has a very low CTE value.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an epoxy molding compound and its preparation method and application. Background technique [0002] Power semiconductor devices prepared by third-generation semiconductors (SiC and GaN, etc.) have excellent properties such as large band gap, high breakdown electric field, and strong radiation resistance, and are widely used in high-speed rail transit, new energy vehicles, and consumer electronics. It has a very broad application market prospect. However, because the third-generation power semiconductor devices have higher operating temperature, higher withstand voltage requirements, and higher requirements for power density, traditional epoxy resin packaging materials have gradually been unable to meet their performance requirements. Oxygen molding plastics as packaging materials and rotary molding packaging technology packaging has become an important developmen...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08L63/00C08K13/02C08K3/36C08K3/32C08K3/04C08K5/5435C08K3/38C08K5/3492
CPCC08L63/04C08L2203/206C08L2205/02C08L2201/08C08K2201/005C08K2003/323C08K2003/387C08L63/00C08K13/02C08K3/36C08K3/32C08K3/04C08K5/5435C08K3/38C08K5/34922
Inventor 曾亮齐放刘洋柯攀戴小平
Owner 湖南国芯半导体科技有限公司