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UV debonding adhesive, preparation method thereof and UV debonding film

An adhesive and debonding technology, applied in the field of debonding film, can solve the problems of limited performance, high peeling force, inconvenient peeling of wafer slices, etc., and achieve the effect of good adhesion, high peeling force and fast debonding speed

Active Publication Date: 2021-01-19
CROWN TAICANG ADHESIVE PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing UV debonding film product performance is limited on the market at present, discloses a kind of UV peelable glue as the patent of publication number CN103923572A, after processing and passing through the stripping force of ultraviolet light to reduce rapidly, but the stripping force after reducing is still too high. High, causing inconvenience to the peeling of wafer slices

Method used

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  • UV debonding adhesive, preparation method thereof and UV debonding film
  • UV debonding adhesive, preparation method thereof and UV debonding film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. Preparation of Raw Gum

[0026] Weigh 40 parts of isooctyl acrylate, 48 parts of methyl acrylate, 2 parts of acrylic acid, 2 parts of methyl methacrylate, 3 parts of carboxyethyl acrylate, 5 parts of vinyl acetate, 0.1 part of azobisisobutyronitrile, 0.15 parts of amyl peroxypivalate, 150 parts of ethyl acetate, and 65 parts of toluene. Stir each component evenly at room temperature in the reactor, and the temperature of the reactor is raised to 65-80°C to carry out the polymerization reaction. The reaction time is 8-80°C. 10h, the original gum was obtained.

[0027] 2. Preparation of Adhesive

[0028] Weigh 100 parts of the above raw rubber, 5 parts of terpene phenolic resin (softening point 120°C), 5 parts of rosin modified phenolic resin (softening point of 120°C), 4 parts of trifunctional aliphatic urethane acrylate oligomer, six-functional 12 parts of aliphatic urethane acrylate oligomer, 0.1 part of epoxy resin curing agent, 2 parts of 1-hydroxycyclohexyl phe...

Embodiment 2

[0032] 1. Preparation of Raw Gum

[0033] Weigh 40 parts of isooctyl acrylate, 48 parts of methyl acrylate, 2 parts of acrylic acid, 2 parts of methyl methacrylate, 3 parts of carboxyethyl acrylate, 5 parts of vinyl acetate, 0.1 part of azobisisobutyronitrile, 0.15 parts of amyl peroxypivalate, 150 parts of ethyl acetate, and 65 parts of toluene. Stir each component evenly at room temperature in the reactor, and the temperature of the reactor is raised to 65-80°C to carry out the polymerization reaction. The reaction time is 8-80°C. 10h, the original gum was obtained.

[0034] 2. Preparation of Adhesive

[0035] Weigh 100 parts of the above raw rubber, 2 parts of terpene phenol resin (softening point 125°C), 4 parts of three-official aliphatic urethane acrylate oligomer, 20 parts of nine-official aliphatic urethane acrylate oligomer, epoxy 0.2 parts of resin curing agent, 2 parts of 1-hydroxycyclohexyl phenyl ketone, 2 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide,...

Embodiment 3

[0039] 1. Preparation of raw gum:

[0040] Weigh 40 parts of isooctyl acrylate, 48 parts of methyl acrylate, 2 parts of acrylic acid, 2 parts of methyl methacrylate, 3 parts of carboxyethyl acrylate, 5 parts of vinyl acetate, 0.1 part of azobisisobutyronitrile, 0.15 parts of amyl peroxypivalate, 150 parts of ethyl acetate, and 65 parts of toluene. Stir each component evenly at room temperature in the reactor, and the temperature of the reactor is raised to 65-80°C to carry out the polymerization reaction. The reaction time is 8-80°C. 10h, the original gum was obtained.

[0041] 2. Preparation of Adhesive

[0042] Weigh 100 parts of the above raw rubber, 4 parts of terpene phenol resin (softening point 140°C), 4 parts of three-official aliphatic urethane acrylate oligomer, 24 parts of nine-official aliphatic urethane acrylate oligomer, epoxy 0.2 parts of resin curing agent, 2 parts of 1-hydroxycyclohexyl phenyl ketone, 2 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide...

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Abstract

The invention discloses a UV debonding adhesive, a preparation method thereof and a UV debonding film. The UV debonding adhesive is prepared from 100 parts of raw rubber, 1-20 parts of high-softening-point rosin or derivatives thereof, 1-10 parts of low-functionality aliphatic urethane acrylate oligomer, 10-30 parts of high-functionality aliphatic urethane acrylate oligomer, 0.01-1 part of epoxy resin curing agent, 1-10 parts of photoinitiator and diluent. The raw rubber is prepared from the following components in parts by weight through reaction: 40-50 parts of 2-ethylhexyl acrylate, 40-50 parts of methyl acrylate, 2-4 parts of acrylic acid, 1-3 parts of methyl methacrylate, 2-5 parts of carboxyethyl acrylate, 3-5 parts of vinyl acetate, 0.15-0.3 part of azodiisobutyronitrile, 0.15-0.3 part of amyl pivalate peroxide, 150-160 parts of ethyl acetate and 55-65 parts of methylbenzene; the weight-average molecular weight of the raw rubber is 90,000-12,000,000, and the Tg of the raw rubberis from -20 DEG C to -10 DEG C. The UV de-bonding adhesive disclosed by the invention has high cohesiveness before illumination and ultralow cohesiveness after illumination.

Description

technical field [0001] The invention relates to the technical field of demucosal membranes, in particular to a UV debonding adhesive, a preparation method thereof and a UV debonding membrane. Background technique [0002] In the manufacturing of large-scale integrated circuits and the manufacturing and processing of semiconductor devices, the essential basic material is semiconductor chips, which are processed from single crystal silicon wafers. Monocrystalline silicon wafers are referred to as wafers. When cutting and grinding wafer materials, it is necessary to use a special protective film to bond and fix the wafer to ensure that the edges of the wafer are neat, without polygons, chipping, cracks, surface scratches, and residual wafers. Slag and dirt pollution. After processing, the processed wafer slices need to be quickly and easily peeled off from the protective film without contaminating the wafer material. This kind of protective film that has high bonding strengt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J145/00C09J161/14C09J175/14C09J7/25C09J7/30C08F220/14C08F220/18C08F220/06C08F218/08C08F220/28
CPCC08F220/14C08L2205/025C08L2205/035C09J133/064C09J2203/326C09J2433/00C09J2467/006C09J7/255C09J7/30C08F220/1808C08F220/06C08F218/08C08F220/283C08L45/00C08L61/14C08L75/14
Inventor 胡鹏麦启波贺海涛周峰
Owner CROWN TAICANG ADHESIVE PROD CO LTD
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