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Ultraviolet curing composition glue as well as use method and application thereof

A composition and ultraviolet light technology, applied in non-polymer organic compound adhesives, adhesives, photovoltaic power generation and other directions, can solve the problems of low yield of packaged products, difficulty in taking into account light transmittance at the same time, and reducing light curing rate. , to achieve the effect of fast UV curing rate, excellent encapsulation effect, good inkjet printing and screen printing characteristics

Active Publication Date: 2021-02-05
XIAN SMART MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current UV-curable glue is difficult to simultaneously increase the curing speed and the light transmittance within 400-800 nanometers. It is well known that the greater the concentration of chemical reaction active sites, the faster the reaction speed
In order to increase the photocuring rate, it is necessary to significantly increase the number of acrylate conjugated end groups, which will lead to a sharp increase in the viscosity of the glue, and the high turbidity of the film obtained by photocuring will result in poor light transmittance; if it is necessary to obtain a cured film with high light transmittance , it is necessary to reduce the proportion of acrylate end groups, which in turn will reduce the photocuring rate
Therefore, the current difficulties faced by UV-curable glues lead to low yields of packaged products, and there is an urgent need to develop new UV-curable glues to achieve fast and high-performance packaging of electronic devices.

Method used

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  • Ultraviolet curing composition glue as well as use method and application thereof
  • Ultraviolet curing composition glue as well as use method and application thereof
  • Ultraviolet curing composition glue as well as use method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0042] The preparation method of the UV-curable composition glue is as follows:

[0043] According to the mass percentage, the photocurable monomer, the photocurable aromatic ring monomer and the photocrosslinking initiator are contained in a brown glass container, and stirred and mixed at room temperature until the photoinitiator is dissolved.

[0044] The method of using the UV-curable composition glue is as follows:

[0045] By means of inkjet printing, spin coating, screen printing or scraping coating, it is evenly attached to the surface of the electronic device to be packaged, and then irradiated by ultraviolet light to promote the formation of an organic barrier film. The present invention adopts the method of inkjet printing to print the glue of the UV-curable composition into a liquid film of a predetermined shape, and then adjust the power of the UV lamp at 10-500mW / cm 2 , irradiated for 1-300s for photocuring to obtain an organic film barrier layer with a thickness...

Embodiment 1

[0049] Synthesis of 2-(4-(4-fluorophenoxy)phenoxy)ethyl methacrylate

[0050]

[0051] In a nitrogen atmosphere, add 26.7 g of 4-bromo-2-fluoro-methoxybenzene, 6.2 g of ethylene glycol, 27.6 g of potassium carbonate, and 1.0 g of copper acetate to the reaction flask, heat to 130°C and stir for 24 hours, and the reaction mixture Cool to room temperature, wash with water and extract with dichloromethane to obtain an organic layer. Concentrate and remove dichloromethane after drying the organic layer with anhydrous sodium sulfate, and the residue is purified with a silica gel column to obtain 14.5 grams of 2-(4-(4-fluorophenoxy)phenoxy)ethan-1-alcohol; The resulting 2-(4-(4-fluorophenoxy)phenoxy)ethan-1-ol and 9.8 g of methacryloyl chloride were dissolved in 200 mL of pyridine, stirred at room temperature for 24 h in a nitrogen atmosphere, and then concentrated. The residue was washed with silica gel After column purification, 10.5 g of 2-(4-(4-fluorophenoxy)phenoxy)ethyl met...

Embodiment 2

[0055] Synthesis of 2-(3-fluoro-4-methoxyphenoxy)ethyl methacrylate

[0056]

[0057] In a nitrogen atmosphere, add 20.3 g of 4-bromo-2-fluoro-methoxybenzene, 6.2 g of ethylene glycol, 27.6 g of potassium carbonate, and 1.0 g of copper acetate into the reaction flask, heat to 130°C and stir for 24 hours, and the reaction mixture Cool to room temperature, wash with water and extract with dichloromethane to obtain an organic layer. The organic layer was dried over anhydrous sodium sulfate, concentrated to remove dichloromethane, and the residue was purified with a silica gel column to obtain 12.5 g of 2-(3-fluoro-4-methoxyphenoxy)ethyl-1-ol. Then, the obtained 2-(3-fluoro-4-methoxyphenoxy)ethyl-1-ol and 7.8 g of methacryloyl chloride were dissolved in 200 mL of pyridine, stirred at room temperature in a nitrogen atmosphere for 24 h, concentrated, and the residue was washed with silica gel After column purification, 11.5 g of 2-(3-fluoro-4-methoxyphenoxy)ethyl methacrylate wa...

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Abstract

The invention discloses an ultraviolet-curable composition glue as well as a use method and an application thereof. The ultraviolet curing composition glue comprises a photocurable monomer, a photocurable aromatic ring-based monomer and a photocrosslinking initiator, and the photocurable aromatic ring-based monomer contains an aromatic ring group and is a photocurable crosslinked compound. The ultraviolet-curable composition glue has proper physical performance parameters, controllability of ink drops in the ink-jet printing process can be achieved, and a printing pattern with regular boundaries is formed; and the ultraviolet-curable composition glue has the advantages of high curing speed, high cured film light transmittance and the like.

Description

technical field [0001] The invention belongs to the technical field of organic thin films, and in particular relates to an ultraviolet light-curable composition glue for encapsulating electronic devices and its use method and application. Background technique [0002] In recent years, flexible electronics has been booming. Display-related electronic devices such as organic light-emitting diodes, solar cells, etc. are also developing in the direction of flexibility, light weight, foldable bending, and wearable. Compared with rigid devices, the working stability of flexible display devices needs more attention. The lifespan of a display device is related to the stability of the material making up the device and the external packaging of the device. Traditional rigid devices can be packaged using rigid materials (glass, acrylic, ceramics), etc. For example, the traditional cover plate package uses epoxy resin to bond the substrate and cover plate together in a nitrogen glove...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02H01L51/52H01L51/44
CPCC09J4/00H10K30/88H10K50/84Y02E10/549
Inventor 吴朝新雷霆杨晓龙周桂江刘育红
Owner XIAN SMART MATERIALS CO LTD
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