Environmental-friendly copper surface roughening solution and preparation method thereof

Abstract

The invention relates to an environmental-friendly copper surface roughening solution. The environmental-friendly copper surface roughening solution comprises the following components: a copper source for providing bivalent copper ions, a chlorine source for providing chloride ions, inorganic acid, fatty amine, a pyridine derivative and solvent, wherein the concentration of the bivalent copper ions is 5g / L-55g / L; the concentration of the chloride ions is 5g / L-165 g / L; the concentration of the inorganic acid is 20g / L-200g / L; the concentration of the fatty amine is 0.001g / L to 3g / L; the concentration of the pyridine derivative is 0.001g / L to 2g / L; and the solvent is water. The copper source of the bivalent copper ions is at least one of copper chloride, copper sulfate, copper oxide and basic cupric carbonate. After the surface of copper foil is treated by the roughening solution, the roughening degree of the surface of the obtained copper foil is good, the plate surface is uniform, the binding force between the copper foil and a dry film resist, a wet film resist, solder resist ink and the like is effectively improved, and the quality and yield of the manufacturing process are ensured.

Description

technical field [0001] The invention relates to a roughening liquid, in particular to an environment-friendly copper surface roughening liquid and a preparation method thereof. Background technique [0002] In many processes of the printed circuit board production process, it is necessary to roughen the surface of the copper foil of the substrate to increase the specific surface area of ​​the copper foil surface, so as to improve the copper foil surface and dry film resist, wet film resist. The bonding force between etchant, solder resist ink, etc., so as to ensure the quality and yield of the process. [0003] At present, the industry mostly uses chemical micro-etching for pre-roughening treatment. There are two types of common roughening solutions: sulfuric acid / hydrogen peroxide system and organic acid / chloride system. Among them, the microscopic appearance of the copper surface treated by the sulfuric acid / hydrogen peroxide system roughening solution is good, but there ...

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Problems solved by technology

Among them, the microscopic appearance of the copper surface treated by the sulfuric acid / hydrogen peroxide system roughening solution is good, but there is a problem of being not resistant to chloride ions. Any external chloride ion pollution will greatly change the microetching rate and roughening effect. Strict control is required, and due to the presence of hydrogen peroxide, the roughening solution of this system has potential safety risks during large-scale storage and use; the roughening effect of the widely used organic acid / chloride system roughening solution on the copper surface Excellent, but the roughening solution contains a large amount of organic compounds, and the organic compounds will continue to consume dissolved oxygen in the water during the biodegradation process, resulting in the lack of oxygen, which will destroy the ecological balance of the water environment and biological communities, and cause serious damage. Adverse effects, so the invalid working fluid of the organic acid / chloride system needs to be strictly treated before discharge, which increases the cost of treatment

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