Powder metallurgy preparation method of fine-particle diamond copper-based composite heat dissipation material

Abstract

The invention discloses a powder metallurgy preparation method of a fine-particle diamond copper-based composite heat dissipation material. The method comprises the following step that S1, 4.2%-11.6% of fine-particle diamonds, 1%-5% of water-atomized superfine CuSn15 bronze powder, 0.1%-0.5% of composite nickel / copper plated carbon fibers / silicon carbide whiskers and the balance electrolytic copper powder are weighed according to weight percent. The powder metallurgy production technology that after the fine-particle diamonds and the copper powder are mixed, a composite heat dissipation substrate with the heat conductivity larger than 550 W / mK is prepared through two times of sintering is adopted, the method has the advantages of being low in cost, stable in process and capable of achieving quantitative production, and the engineering application difficulty that heat dissipation substrates with the thickness smaller than or equal to 2 mm are difficult to produce in a quantitative manner in the prior art can be solved.

Description

technical field [0001] The invention relates to the technical field of powder metallurgy, in particular to a powder metallurgy preparation method of a fine-grain diamond-copper-based composite heat dissipation material. Background technique [0002] With the rapid development of electronic technology, modern electronic and optoelectronic devices are increasingly miniaturized, highly integrated, and high-powered, and the heat dissipation performance requirements of electronic devices are getting higher and higher. Copper is a metal with good thermal conductivity, while diamond conducts heat by phonons, and its thermal conductivity can reach 1500-2600W / mK at room temperature, which is about 5 times that of copper. Therefore, diamond / copper composite heat dissipation material is an ideal new type of electronic Packaging materials have received extensive attention in recent years. [0003] At present, the preparation of diamond / copper composite materials mainly includes solid-p...

AI Technical Summary

Problems solved by technology

At present, the technical achievements (such as discharge plasma sintering method, SPS method) of diamond / copper heat dissipation materials prepared by powder metallurgy method and fine particle coating diamond (120 / 140 mesh, 325 / 400 mesh) have also been reported (thermal Conductivity is about 650W / mK), but it is currently limited to the preparation of test samples and cannot be applied to mass device production

At the same time, when the diamond / copper composite heat dissipation material is prepared by powder metallurgy technology, fine-grained diamonds are easy to aggregate during the mixing and sintering process, resulting in the failure or insufficient filling of the metal material between the diamond particles in the aggregation area. The density of the body is insufficient, which greatly reduces the thermal conductivity of the heat sink; therefore, when using fine-grained diamond, it must be considered that it can be effectively dispersed to prevent aggregation, and the existing technology is difficult to effectively solve this problem

[0005] In summary, the existing preparation methods are difficult to prepare thin sheet heat dissipation materials at low cost and in batches. In order to overcome the shortcomings of the existing technology, it is urgent to develop a thin diamond / copper heat dissipation substrate that uses fine-grained diamond and can be mass-produced in batches. preparation technology