Powder metallurgy preparation method of fine-particle diamond copper-based composite heat dissipation material

A powder metallurgy, copper-based composite technology, applied in the field of powder metallurgy, can solve the problems of large number of pores, reduced thermal conductivity of heat sinks, insufficient density of heat sinks, etc., and achieves the effect of improving sintering compactness and solving engineering application problems.

Active Publication Date: 2021-06-11
JILIN UNIV
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  • Application Information

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Problems solved by technology

At present, the technical achievements (such as discharge plasma sintering method, SPS method) of diamond/copper heat dissipation materials prepared by powder metallurgy method and fine particle coating diamond (120/140 mesh, 325/400 mesh) have also been reported (thermal Conductivity is about 650W/mK), but it is currently limited to the preparation of test samples and cannot be applied to mass device production
At the same time, when the diamond/copper composite heat dissipation material is prepared by powder metallurgy technology, fine-grained diamonds are easy to aggregate during the mixing and sintering process, resulting in the failure or insufficient filling of the metal material between the diamond

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0026] A powder metallurgy preparation method for a fine-grained diamond-copper-based composite heat dissipation material, comprising the following steps:

[0027] S1: Weighing according to weight percentage: 4.2-11.6% by weight of fine-grained diamond, 1-5% by weight of water atomized ultrafine CuSn15 bronze powder, 0.1-0.5% by weight of composite nickel / copper carbon fiber / silicon carbide whisker, 1.5-3.0% by weight polyvinylpyrrolidone alcohol solution, and the balance is electrolytic copper powder;

[0028] S2: Cold compacting: the raw material powder is mixed and granulated with K90 alcohol solution as a granulation binder, and then cold pressed into a sheet-shaped green body in a steel mold;

[0029] S3: High-temperature reduction pre-sintering: put the cold-pressed tablet into a hydrogen reduction furnace for high-temperature reduction pre-sintering;

[0030] S4: High-temperature and high-pressure densification sintering: put the pre-reduced sintered body into a graphi...

Embodiment 1

[0041] A four-column hot-press sintering machine was used to prepare a sheet-shaped diamond / copper composite heat dissipation substrate with a specification of 15mm (length) × 15mm (width) × 1mm (thickness), a total of 160 pieces, 16 pieces / mold (4 layers of material / mold, Single charge 4 slices). Wherein, the design addition amount of diamond is described by volume concentration (adding 4.4 carat diamond in 1 cubic centimeter volume, is defined as 100% volume concentration), when actually dropping into diamond, convert to weight after conversion according to the design volume concentration. In the present embodiment, composite titanium / nickel plating (titanium plating weight gain is 0.3%, nickel coating weight gain is 20%) diamond mass ratio is 7.7% (corresponding design volume concentration is 60%), The mass proportion of ultrafine CuSn15 powder is 1%, the weight proportion of composite nickel / copper-coated carbon fiber (length 74 μm) is 0.5%, and the balance is electrolytic...

Embodiment 2

[0065] Densification sintering was carried out using a six-sided top press to prepare a diamond / copper heat dissipation substrate with the same specifications and proportions as in Example 1.

[0066] Take steps (1) to (4) in Example 1 to prepare a pre-reduced sintered diamond / copper heat sink;

[0067] Place the above-mentioned pre-reduced sintered sheets in the pyrophyllite assembly block, 10 pieces / group, and use graphite with a thickness of 2mm as the spacer between the sheets, and sinter and densify at high temperature and high pressure in a six-sided top press, at a temperature of 950°C , Keep warm for 3 minutes at a pressure of 4.5GPa, remove the mold and pick up the parts after natural cooling;

[0068] The workpiece is fixed on the rotary polishing device, and the soft polishing cloth with short-pile fiber and the polishing liquid are used for polishing with water as the medium, and then the polished workpiece is ultrasonically cleaned in industrial alcohol solution a...

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Abstract

The invention discloses a powder metallurgy preparation method of a fine-particle diamond copper-based composite heat dissipation material. The method comprises the following step that S1, 4.2%-11.6% of fine-particle diamonds, 1%-5% of water-atomized superfine CuSn15 bronze powder, 0.1%-0.5% of composite nickel/copper plated carbon fibers/silicon carbide whiskers and the balance electrolytic copper powder are weighed according to weight percent. The powder metallurgy production technology that after the fine-particle diamonds and the copper powder are mixed, a composite heat dissipation substrate with the heat conductivity larger than 550 W/mK is prepared through two times of sintering is adopted, the method has the advantages of being low in cost, stable in process and capable of achieving quantitative production, and the engineering application difficulty that heat dissipation substrates with the thickness smaller than or equal to 2 mm are difficult to produce in a quantitative manner in the prior art can be solved.

Description

technical field [0001] The invention relates to the technical field of powder metallurgy, in particular to a powder metallurgy preparation method of a fine-grain diamond-copper-based composite heat dissipation material. Background technique [0002] With the rapid development of electronic technology, modern electronic and optoelectronic devices are increasingly miniaturized, highly integrated, and high-powered, and the heat dissipation performance requirements of electronic devices are getting higher and higher. Copper is a metal with good thermal conductivity, while diamond conducts heat by phonons, and its thermal conductivity can reach 1500-2600W / mK at room temperature, which is about 5 times that of copper. Therefore, diamond / copper composite heat dissipation material is an ideal new type of electronic Packaging materials have received extensive attention in recent years. [0003] At present, the preparation of diamond / copper composite materials mainly includes solid-p...

Claims

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Application Information

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IPC IPC(8): C22C47/14C22C47/04C22C49/02C22C49/14C22C101/10C22C101/14
CPCC22C47/14C22C47/04C22C49/02C22C49/14
Inventor 董书山徐航董欣然孙贵乾姜丽娜陶强朱品文
Owner JILIN UNIV
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