A kind of weather-resistant high thermal conductivity graphene-based epoxy resin adhesive and preparation method thereof
A technology of alkenyl epoxy resin and high thermal conductivity graphite, which is applied in the direction of epoxy resin glue, adhesive, conductive adhesive, etc., can solve the problem of reducing the weather resistance and service life of epoxy adhesive, shortening the service life of epoxy resin, reducing the Mechanical and mechanical properties and other issues, to achieve the effect of improving thermal stability and mechanical properties, improving bonding force, and increasing curing rate
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Embodiment 1
[0038] A weather-resistant high thermal conductivity graphene-based epoxy resin adhesive, comprising the following raw materials in parts by weight:
[0039] 15 parts of bisphenol A epoxy resin E51
[0040] 1,4-Butanediol diglycidyl ether 5 parts
[0041] Two-component curing agent 5 parts
[0042] 2,4,6-Tris(dimethylaminomethyl)phenol 1 part
[0043] 1 part of γ-glycidyl ether oxypropyltrimethoxysilane
[0044] Aminated graphene oxide 2 parts
[0045] Tin-bismuth alloy nanoparticles 1 part
[0046] 70 pieces of flake silver powder
[0047] Among them, the two-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 2:1; the tin-bismuth alloy nanoparticles are nano-tin-bismuth alloy spherical powders with an average particle size of 20 nm, and the molar ratio of tin and bismuth is 20 nm. The ratio was 55:45; the average particle size of the flake silver powder was 5 μm.
[0048] Aminated graphene oxide is prepared by the followi...
Embodiment 2
[0054] A weather-resistant high thermal conductivity graphene-based epoxy resin adhesive, comprising the following raw materials in parts by weight:
[0055] 16 parts of bisphenol A epoxy resin E51
[0056] 1,6-Hexanediol glycidyl ether 4 parts
[0057] Two-component curing agent 4 parts
[0058] 2,4,6-Tris(dimethylaminomethyl)phenol 1 part
[0059] γ-(methacryloyloxy)propyltrimethoxysilane 0.6 part
[0060] Aminated graphene oxide 1.5 parts
[0061] Tin-bismuth alloy nanoparticles 1 part
[0062]Flake silver powder 71.9 parts
[0063] Wherein, the two-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 1.5:1; the tin-bismuth alloy nanoparticles are nano-tin-bismuth alloy spherical powders with an average particle size of 25 nm, and the tin and bismuth particles The molar ratio was 59:41; the average particle size of the flake silver powder was 3 μm.
[0064] Aminated graphene oxide is prepared by the following steps: dispe...
Embodiment 3
[0070] A weather-resistant high thermal conductivity graphene-based epoxy resin adhesive, comprising the following raw materials in parts by weight:
[0071] Bisphenol F type epoxy resin NPEF-170 19 parts
[0072] Allyl glycidyl ether 6 parts
[0073] Two-component curing agent 6 parts
[0074] 2,4,6-Tris(dimethylaminomethyl)phenol 2 parts
[0075] 1 part of γ-glycidyl ether oxypropyltrimethoxysilane
[0076] Aminated graphene oxide 2.5 parts
[0077] Tin-bismuth alloy nanoparticles 1 part
[0078] 62.5 servings of flake silver powder
[0079] Among them, the two-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 3:1; the tin-bismuth alloy nanoparticles are nano-tin-bismuth alloy spherical powders with an average particle size of 25nm, and the moles of tin and bismuth are 25nm. The ratio was 57:43; the average particle size of the flake silver powder was 1 μm.
[0080] Aminated graphene oxide is prepared by the following s...
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