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A kind of weather-resistant high thermal conductivity graphene-based epoxy resin adhesive and preparation method thereof

A technology of alkenyl epoxy resin and high thermal conductivity graphite, which is applied in the direction of epoxy resin glue, adhesive, conductive adhesive, etc., can solve the problem of reducing the weather resistance and service life of epoxy adhesive, shortening the service life of epoxy resin, reducing the Mechanical and mechanical properties and other issues, to achieve the effect of improving thermal stability and mechanical properties, improving bonding force, and increasing curing rate

Active Publication Date: 2022-07-05
常州烯奇新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The field of electronic packaging has high requirements for weather resistance. The bisphenol A resin used in traditional epoxy resins has poor weather resistance, which in turn will reduce the mechanical properties, thereby shortening the service life of epoxy resins.
In the prior art, weather resistance additives such as light stabilizers are generally added to epoxy adhesives, but since small molecule light stabilizers exist in the three-dimensional crosslinked structure of epoxy in a physically free state, it is inevitable to remove them from the epoxy system. Migrate to the surface, thereby reducing the weather resistance and service life of epoxy adhesives, and there is also the problem of migration toxicity
[0005] In addition, the existing epoxy resin conductive adhesives rely solely on filling flake silver powder to obtain electrical and thermal conductivity, and their electrical and thermal conductivity is low.

Method used

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  • A kind of weather-resistant high thermal conductivity graphene-based epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A weather-resistant high thermal conductivity graphene-based epoxy resin adhesive, comprising the following raw materials in parts by weight:

[0039] 15 parts of bisphenol A epoxy resin E51

[0040] 1,4-Butanediol diglycidyl ether 5 parts

[0041] Two-component curing agent 5 parts

[0042] 2,4,6-Tris(dimethylaminomethyl)phenol 1 part

[0043] 1 part of γ-glycidyl ether oxypropyltrimethoxysilane

[0044] Aminated graphene oxide 2 parts

[0045] Tin-bismuth alloy nanoparticles 1 part

[0046] 70 pieces of flake silver powder

[0047] Among them, the two-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 2:1; the tin-bismuth alloy nanoparticles are nano-tin-bismuth alloy spherical powders with an average particle size of 20 nm, and the molar ratio of tin and bismuth is 20 nm. The ratio was 55:45; the average particle size of the flake silver powder was 5 μm.

[0048] Aminated graphene oxide is prepared by the followi...

Embodiment 2

[0054] A weather-resistant high thermal conductivity graphene-based epoxy resin adhesive, comprising the following raw materials in parts by weight:

[0055] 16 parts of bisphenol A epoxy resin E51

[0056] 1,6-Hexanediol glycidyl ether 4 parts

[0057] Two-component curing agent 4 parts

[0058] 2,4,6-Tris(dimethylaminomethyl)phenol 1 part

[0059] γ-(methacryloyloxy)propyltrimethoxysilane 0.6 part

[0060] Aminated graphene oxide 1.5 parts

[0061] Tin-bismuth alloy nanoparticles 1 part

[0062]Flake silver powder 71.9 parts

[0063] Wherein, the two-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 1.5:1; the tin-bismuth alloy nanoparticles are nano-tin-bismuth alloy spherical powders with an average particle size of 25 nm, and the tin and bismuth particles The molar ratio was 59:41; the average particle size of the flake silver powder was 3 μm.

[0064] Aminated graphene oxide is prepared by the following steps: dispe...

Embodiment 3

[0070] A weather-resistant high thermal conductivity graphene-based epoxy resin adhesive, comprising the following raw materials in parts by weight:

[0071] Bisphenol F type epoxy resin NPEF-170 19 parts

[0072] Allyl glycidyl ether 6 parts

[0073] Two-component curing agent 6 parts

[0074] 2,4,6-Tris(dimethylaminomethyl)phenol 2 parts

[0075] 1 part of γ-glycidyl ether oxypropyltrimethoxysilane

[0076] Aminated graphene oxide 2.5 parts

[0077] Tin-bismuth alloy nanoparticles 1 part

[0078] 62.5 servings of flake silver powder

[0079] Among them, the two-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 3:1; the tin-bismuth alloy nanoparticles are nano-tin-bismuth alloy spherical powders with an average particle size of 25nm, and the moles of tin and bismuth are 25nm. The ratio was 57:43; the average particle size of the flake silver powder was 1 μm.

[0080] Aminated graphene oxide is prepared by the following s...

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Abstract

The invention relates to a weather resistance and high thermal conductivity graphene-based epoxy resin adhesive and a preparation method. The epoxy resin adhesive comprises the following raw materials in parts by weight: 8-20 parts of epoxy resin, 2-8 parts of reactive diluent, and two parts by weight. 3-8 parts of curing agent, 1-2 parts of accelerator, 0.5-1 part of coupling agent, 1-3 parts of aminated graphene oxide, 0.5-1.5 parts of tin-bismuth alloy nanoparticles, 60-80 parts of flake silver powder , wherein the two-component curing agent is a mixture of dicyandiamide curing agent and imidazole curing agent. The addition of aminated graphene oxide to the weather-resistant and high thermal conductivity graphene-based epoxy resin adhesive of the present invention not only improves the thermal conductivity of the adhesive, but also further improves the bonding force; and adding tin-bismuth alloy nanoparticles greatly increases the adhesive strength. Excellent weather resistance, especially high temperature weather resistance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a weather-resistant high thermal conductivity graphene-based epoxy resin adhesive and a preparation method. Background technique [0002] The packaging of electronic components has evolved from the simple glass shell packaging of the early vacuum tubes to today's extremely complex advanced systems, and has now developed into one of the core technologies of a new generation of integrated circuits. Due to Moore's Law followed by the semiconductor industry, the complexity of integrated circuits is increasing, the working speed is getting higher and higher, and the size of the chip is getting smaller and smaller, all of which have put forward higher requirements for packaging technology. At present, many devices need to encapsulate the chip in a vacuum environment for normal operation. The chip is connected to the packaging substrate in a certain way, and an adhesive ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/02C09J11/04C08G59/40C08G59/50
CPCC09J9/02C09J163/00C09J11/04C08G59/4021C08G59/5073C08K2003/0806C08K2201/005C08K2201/001C08K2201/011C08K13/06C08K9/04C08K3/042C08K3/08C08K7/00Y02E10/50
Inventor 汪永彬李红元查扬徐晓翔吴新成刘记林邓筱
Owner 常州烯奇新材料有限公司