Double-component thermosetting epoxy glue with low water absorption rate as well as preparation method and application thereof

Abstract

The invention provides a double-component thermosetting epoxy glue with a low water absorption rate and a preparation method and application thereof. The double-component thermosetting epoxy glue comprises a component A and a component B. The component A comprises the following raw materials in parts by mass: 20-50 parts of bisphenol epoxy resin, 5-15 parts of triglycidyl isocyanurate, 10-20 parts of halogen-free flame-retardant resin, 5-10 parts of toughening resin, 30-50 parts of a reactive diluent, 3-10 parts of a liquid phosphate flame retardant, and 0.5-2 parts of a wetting agent; and the component B comprises the following raw materials in parts by mass: 10-20 parts of alicyclic diamine, 3-10 parts of fluorine-containing aromatic diamine, 2-7 parts of phosphine oxide containing two aminophenyl groups, 2-4 parts of accelerant and 10-20 parts of reactive diluent. The double-component thermosetting epoxy glue provided by the invention is halogen-free, solvent-free, free of low-molecular volatilization, high in cured product hardness, good in toughness, bending-resistant and low in water absorption rate, and basically has no obvious adverse effect on dielectric properties and dimensional stability in a double-85 test; and the UL94VO flame retardant grade is reached under the condition of low flame retardant dosage, and an adhesive film is transparent.

Description

technical field [0001] The invention relates to the field of paint adhesives, in particular to a two-component thermosetting epoxy adhesive with low water absorption and its preparation method and application. Background technique [0002] Two-component epoxy adhesives have high requirements in the fields that require adhesive insulation such as electronic devices, and require low VOC, low halogen, three-proof, aging resistance, weather resistance, insulation, flame retardant and many other requirements. standard. Bromine-based flame retardants are often added to the existing epoxy resin coating adhesives, which have high efficiency and low dosage. However, with the advancement of society and the enhancement of environmental awareness, the development of halogen-free and low-efficiency Toxic flame retardant technology is the general trend. The European Union is promoting the use of halogen-free or low-halogen flame retardants. In the "Instructions on Coating Electrical an...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the unsatisfactory performance of epoxy resin glue in the electronic industry in the prior art, especially the defect that flame retardancy, optical performance and low water absorption cannot be balanced with each other, the present invention provides a two-component adhesive with low water absorption. One-part thermosetting epoxy adhesive, no need to add inorganic flame retardant or solid organic flame retardant, halogen-free, solvent-free, no low molecular volatilization, high hardness of cured product, good toughness, bending resistance, low water absorption, double 85 In the test, there is basically no obvious adverse effect on the dielectric properties and dimensional stability; the UL94 VO flame retardant grade is achieved at a low flame retardant dosage and the film is transparent

Images