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Resist composition

A composition and resist technology, applied in optics, instruments, optomechanical equipment, etc., can solve the problems of insufficient heat resistance and inability to obtain sufficient sensitivity, and achieve the effect of high heat resistance

Pending Publication Date: 2021-08-06
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the positive photoresist composition described in Patent Document 1 has a problem that sufficient sensitivity for thinning lines cannot be obtained.
Furthermore, since various heat treatments are performed in the manufacturing process of semiconductors and the like, high heat resistance is also sought, but there is a problem that the positive photoresist composition described in Patent Document 1 does not have sufficient heat resistance.

Method used

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Examples

Experimental program
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preparation example Construction

[0128] When cresol and phenolic compounds other than cresol are used as reaction raw materials in the preparation of alkali-soluble resin (D), the amount of the above-mentioned phenolic compound except cresol is preferably set to 0.05 with respect to 1.0 moles of cresol. ~1.0 molar range.

[0129] As for the aldehyde compound used as the raw material of the above-mentioned cresol novolac resin, for example, formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, Furfural, glyoxal, n-butyraldehyde, hexanal, allylaldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraformaldehyde, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, etc. Among these, formaldehyde is preferable. The aforementioned aldehyde compounds may be used alone or in combination of two or more.

[0130] When formaldehyde is used as the aldehyde compound used as the raw material of the cresol novolac resin, an aldehyde compound other than ...

Embodiment

[0148] Hereinafter, the present invention will be specifically described by way of examples and comparative examples.

Synthetic example 1

[0149] Synthesis Example 1 Synthesis of carboxylic acid-containing phenolic trinuclear compound

[0150] 293.2 g (2.4 mol) of 2,5-xylenol and 150 g (1 mol) of 4-formylbenzoic acid were charged into a 2000 ml four-neck flask equipped with a cooling tube, and dissolved in 500 ml of acetic acid. After adding 5 ml of sulfuric acid while cooling in an ice bath, it was heated to 100° C. with a hooded heater, and reacted while stirring for 2 hours. After the reaction was completed, water was added to the obtained solution to reprecipitate the crude product. The crude product was redissolved in acetone, and further reprecipitated with water, and the precipitate was filtered and vacuum-dried to obtain 283 g of a precursor compound (A-1) in pale pink crystals.

[0151] Carry out for gained precursor compound (A-1) 13 As a result of C-NMR measurement, it was confirmed that it was a compound represented by the following structural formula. In addition, the purity calculated from the GP...

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Abstract

The purpose of the present invention is to provide a resist composition which exhibits high heat resistance and can be used in types of lithography that use electron beams and extreme ultraviolet radiation. Specifically, the present invention uses a resist composition that contains a metal salt of a novolac type phenolic resin (C), which is obtained using (A) an aromatic compound represented by formula (1) and (B) an aliphatic aldehyde as essential reaction raw materials. (In formula (1), R1 and R2 each independently denote a hydrogen atom, an aliphatic hydrocarbon group having 1-9 carbon atoms, an alkoxy group, an aryl group, an aralkyl group or a halogen atom. m and n each independently denote an integer between 0 and 4. In cases where a plurality of R1 groups are present, the plurality of R1 groups may be the same as, or different from, each other. In cases where a plurality of R2 groups are present, the plurality of R2 groups may be the same as, or different from, each other. R3 denotes a hydrogen atom, an aliphatic hydrocarbon group having 1-9 carbon atoms, or a structural moiety having one or more substituent groups selected from among alkoxy groups, halogen groups and hydroxyl groups on a hydrocarbon group.).

Description

technical field [0001] The present invention relates to resist compositions. Background technique [0002] Alkali-soluble resins, 1,2-naphthoquinonediazide compounds, etc. A positive photoresist obtained from a photosensitizer. As the alkali-soluble resin, a positive photoresist composition using a mixture of m-cresol novolac resin and p-cresol novolac resin as the alkali-soluble resin has been proposed (for example, refer to Patent Document 1). [0003] The positive photoresist composition described in Patent Document 1 was developed in order to improve developability such as sensitivity, but in recent years, there is a tendency for higher integration of semiconductors and thinner patterns, and more excellent sensitivity is sought. However, the positive photoresist composition described in Patent Document 1 has a problem in that sufficient sensitivity for thinning lines cannot be obtained. Further, since various heat treatments are performed in the manufacturing process ...

Claims

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Application Information

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IPC IPC(8): C08G8/18C08G8/20G03F7/023G03F7/20
CPCC08G8/20G03F7/023C08G8/18G03F7/20G03F7/0236G03F7/2004
Inventor 今田知之长田裕仁
Owner DIC CORP