Additive manufacturing method for large dispersion strengthened copper component

Abstract

The invention discloses an additive manufacturing method for a large dispersion strengthened copper component. The additive manufacturing method comprises the following steps that (1) the surface of an aluminum alloy matrix is subjected to oil removal, drying and polishing treatment; (2) dispersion strengthened copper powder for cold spraying is subjected to heat treatment; 3) three-dimensional modeling is performed, and a three-dimensional model is converted into a two-dimensional plane model; (4) a moving track of a spray gun for cold spraying is optimized; (5) the powder is loaded into a cold spraying powder feeding tank, and a composite component is obtained through cold spraying equipment controlled by a mechanical arm; (6) the composite component is machined, and the aluminum alloy matrix is removed to obtain the dispersion strengthened copper component; and (7) the dispersion strengthened copper component is put into a hydrogen reduction furnace to be treated, and finally the needed dispersion strengthened copper component is obtained. The large complicated dispersion strengthened copper alloy component can be prepared, the size and the shape of the component are not limited, the preparation process is simple, the powder utilization rate is high, the machining period of a dispersion strengthened copper alloy is greatly shortened, and the preparation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing dispersion-strengthened copper components, in particular to an additive manufacturing method for dispersion-strengthened copper components, especially suitable for oxide, tungsten carbide, nitride and boride ceramic phases (Al 2 o 3 , Y 2 o 3 , TiC, TiN, TaC, TaN, TiB 2 ) and other dispersion strengthened copper preparation. Background technique [0002] Copper and copper alloys have excellent thermal conductivity and electrical conductivity, and are widely used in machinery manufacturing, transportation, construction, electrical, electronic and other industrial sectors. However, with the continuous progress of electronic information industries such as microelectronics, computers, communications, and industrial automatic control, higher requirements have been placed on the performance of copper, which requires it to maintain high electrical conductivity and high thermal conductivity, and...

AI Technical Summary

Problems solved by technology

[0006] 1) Limited by the size of the compact or sheath and the hot isostatic pressing equipment, the shape and size of the prepared dispersion-strengthened copper components will be greatly restricted. At present, the domestic dispersed copper products are generally rods And the size is small (the general size is diameter 100mm*length 2000mm), and there are few plate products. For example, the Chinese invention application with the publication number CN 109536771A has prepared a dispersion-strengthened copper plate with a thickness of 1.0-5mm, but it is impossible to prepare a larger-sized plate. Dispersion strengthened copper components;

[0007] 2) During the reaction spray deposition process, the dispersion strengthening phase is easy to coarsen, and it is difficult to play the role of nano strengthening phase;

[0008] 3) Since the oxide has a strong inhibitory effect on the sintering of Cu powder, the material is not easy to achieve high density during sintering, thus affecting the performance of dispersion strengthened copper components;

[0009] 4) The process of mechanical alloying and internal oxidation method is complicated to operate and has a long cycle, making it difficult to realize automatic and large-scale continuous production

[0010] The above problems have greatly hindered the promotion and application of dispersion strengthened copper materials.

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