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Ga2O3 metal oxide semiconductor field effect transistor and preparation method thereof

A technology of oxide semiconductors and field effect transistors, which is applied in the field of microelectronics, can solve the problems of difficulty in practical application, low breakdown voltage, process difficulty and high manufacturing cost, so as to suppress the peak electric field intensity of the channel, increase the threshold voltage, Effect of smoothing channel electric field distribution

Active Publication Date: 2022-01-11
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its process difficulty and manufacturing cost are high, and it is difficult to apply in practice. Compared with Ga2O3 material characteristics, its breakdown voltage is far lower than expected The breakdown voltage value of

Method used

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  • Ga2O3 metal oxide semiconductor field effect transistor and preparation method thereof
  • Ga2O3 metal oxide semiconductor field effect transistor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1, in Fe-doped β-Ga 2 o 3 The gate dielectric layer is made on the semi-insulating substrate, and the upper and lower layers are high-k dielectric layers, and the middle layer is Al 2 o 3 / Au / Al 2 o 3 Ga with three-layer structure and charge storage layer length of 10 μm 2 o 3 MOSFET devices.

[0033] Step 1, for Fe-doped β-Ga 2 o 3 Semi-insulating substrates undergo standard cleaning such as figure 2 (a).

[0034] will grow with UIDβ-Ga 2 o 3 Fe-doped β-Ga 2 o 3 Semi-insulating substrate, put it in 50ml of acetone and ultrasonically clean it for 5min at 80W power;

[0035] Then use 50ml of ethanol and deionized water to sonicate at 80W for 1min, and finally blow dry with high-purity nitrogen.

[0036] Step 2, grow n-type β-Ga on the buffer layer by molecular beam epitaxy 2 o 3 epitaxial layer, such as figure 2 (b).

[0037] Put the sample that has completed the standard cleaning into the MBE equipment, and heat and evaporate Ga metal with a...

Embodiment 2

[0057] Example 2, in Mg-doped β-Ga 2 o 3 A five-layer Al gate dielectric layer in which high-k dielectric layers and charge storage layers are alternately stacked on a semi-insulating substrate 2 o 3 / Ni / Al 2 o 3 / Ni / Al 2 o 3 , and the Ni lengths of the upper and lower charge storage layers are 5 μm and 10 μm respectively. 2 o 3 MOSFET devices.

[0058] Step 1, Mg-doped β-Ga 2 o 3 Semi-insulating substrates undergo standard cleaning such as figure 2 (a).

[0059] The specific implementation of this step is the same as step 1 of Embodiment 1.

[0060] Step 2, grow n-type β-Ga on the buffer layer by molecular beam epitaxy 2 o 3 epitaxial layer, such as figure 2 (b).

[0061] 2.1) Put the sample that has completed the standard cleaning into the MBE equipment, heat and evaporate Ga metal with a purity of 99.9999% and SnO with a purity of 99.99% in a K chamber at 760°C 2 Powder to provide Ga element and Sn element, using 5% ozone and 95% oxygen mixture as the so...

Embodiment 3

[0083] Example 3, in Fe-doped β-Ga 2 o 3 Fabricate a seven-layer structure gate dielectric layer HfO with alternately stacked high-k dielectric layers and charge storage layers on a semi-insulating substrate 2 / Pt / HfO 2 / Pt / HfO 2 / Pt / HfO 2 , and the length of the charge storage layer Pt from bottom to top is 10 μm, 5 μm and 2.5 μm Ga 2 o 3 MOSFET devices.

[0084] Step A, for Fe-doped β-Ga 2 o 3 Semi-insulating substrates undergo standard cleaning such as figure 2 (a).

[0085] The specific implementation of this step is the same as step 1 of Embodiment 1.

[0086] Step B, growing n-type β-Ga on the buffer layer by molecular beam epitaxy 2 o 3 epitaxial layer, such as figure 2 (b).

[0087] B1) Put the sample that has completed the standard cleaning into the MBE equipment, heat and evaporate Ga metal with a purity of 99.9999% and SnO with a purity of 99.99% in a K chamber at 860°C 2 Powder to provide Ga element and Sn element, using 5% ozone and 95% oxygen mi...

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Abstract

The invention discloses a Ga2O3 metal oxide semiconductor field effect transistor and a preparation method thereof. The problems that an existing MOSFET device is low in threshold voltage, small in breakdown voltage, complex in process and large in manufacturing difficulty are mainly solved. The Ga2O3 metal oxide semiconductor field effect transistor comprises a substrate, a buffer layer, an epitaxial layer and a gate dielectric layer from bottom to top, a source electrode and a drain electrode are arranged on the left side and the right side above the epitaxial layer respectively, and a gate electrode is arranged above an insulated gate dielectric layer. The gate dielectric adopts a structure in which high-k dielectric layers and charge storage layers are alternately stacked, and the lengths of the charge storage layers are gradually reduced from the side close to the source electrode to the side close to the drain electrode from bottom to top. By adopting the gate dielectric layer structure, the electrons of the gate dielectric layer deplete channel electrons to different extents, so that the threshold voltage is improved, the channel electric field distribution can be effectively smoothed, the peak electric field intensity of the channel can be inhibited, the breakdown voltage of the device is further improved, the manufacturing cost and difficulty are reduced, and the Ga2O3 metal oxide semiconductor field effect transistor can be used for power devices and high-voltage switch devices.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, in particular to a Ga 2 o 3 Semiconductor devices can be used in power devices and high-voltage switching devices. Background technique [0002] In recent years, under the background that the performance of devices made of silicon-based materials has been difficult to meet the current demand for high-power devices, Ga 2 o 3 The third-generation wide-bandgap semiconductors represented by them have become an important development field of high-power devices and have received extensive attention. Ga 2 o 3 As a wide bandgap semiconductor material, it has five isomers, of which monoclinic β-type Ga 2 o 3 The best stability, and β-Ga 2 o 3 Compared with the other two wide-bandgap semiconductors silicon carbide and gallium nitride with excellent performance, their bandgap width is about 4.8eV-4.9eV, and the theoretical breakdown electric field can reach 8MV / cm. Twice that of GaN mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/792H01L29/423H01L29/24H01L21/34C23C14/14C23C14/24C23C16/40C23C16/455C30B25/00C30B29/16
CPCH01L29/66969H01L29/792H01L29/4234H01L29/24C30B29/16C30B25/00C23C14/24C23C14/14C23C16/40C23C16/45525
Inventor 冯倩王正兴蔡云匆田旭升张春福周弘张进成
Owner XIDIAN UNIV