Maleimide resin composition and application thereof

Abstract

The invention discloses a maleimide resin composition and application thereof, and belongs to the technical field of high polymer materials. The composition comprises the following components in parts by weight: 10-40 parts by mass of maleimide resin with the structure shown in the description, 30-70 parts by mass of one or a mixture of two of maleimide resin with the structures shown in the description and 10-40 parts by mass of a cross-linking agent, wherein n is an integer of 1-5, R1 is an organic group with 1-20 carbon atoms, R2 to R5 are independently hydrogen atoms or alkyl groups containing 1-4 carbon atoms, and m is an integer of 1-6. According to the invention, the maleimide resin with different structures are compounded by utilizing the trifunctional cross-linking agent containing a rigid benzene ring structure, the toughness, the electrical property and the heat resistance of the maleimide resin composition are balanced under the optimal proportion, and the maleimide resin composition is used for electronic product components such as prepregs, copper-clad laminated boards or printed circuit boards.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a maleimide resin composition and an application thereof. Background technique [0002] With the development of thinner electronic circuits, thinner lines, higher densities, multilayers, and multi-pin packaging circuits, traditional epoxy resin materials have been difficult to meet the development needs of the printed circuit board industry. Maleimide resin has short double bond distance, high cross-linking density and compact structure of cured product. It has the characteristics of high glass transition temperature, low dielectric constant and dielectric loss, and excellent resistance to heat and humidity. It has shown great promise in the field of copper clad laminate materials. application prospects. However, due to its high cross-linking density and high molecular chain rigidity, maleimide resin presents greater brittleness, manifested in defects such ...

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Problems solved by technology

[0003] Patent document CN103665864A discloses a modified maleimide resin prepolymer and its application. The prepolymer is obtained by modifying the maleimide resin with an allyl compound, and then adding a flame retardant, an accelerator and an inorganic Filler is used to prepare glue, and the glass transition temperature of the copper clad substrate prepared with this glue can reach 260°C, which has good heat resistance and toughness, but the allyl compound of the traditional structure increases the dielectric constant and dielectric loss of the copper clad laminate. , destroying the original electrical properties of maleimide resin

Patent document CN112679357A discloses a modified allyl compound, a modified bismaleimide prepolymer and its application. The modified allyl compound has a cyclopentadiene structure and contains a benzene ring or is polarized Lower linear alkyl substituted benzene ring, when the modified allyl compound is used to modify the bismaleimide, the modified resin prepared has a special structure, which can improve the bismaleimide resin The solubility of the cured product reduces the water absorption rate, dielectric constant and dielectric loss value of the cured product, but reduces the crosslinking density of the cured product and sacrifices the heat resistance of the maleimide resin

[0004] In summary, the current modification technology will affect the heat resistance or dielectric properties of maleimide resins. How to achieve both excellent heat resistance and low dielectric properties while toughening and modifying maleimide resins? Electrical performance has always been a difficult problem in this technical field

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