Nano-regulation-based multi-scale insulating and heat-conducting PC composite material and preparation method thereof

Abstract

The invention relates to the technical field of high polymer materials, and discloses a nano-regulation-based multi-scale insulating and heat-conducting PC composite material and a preparation method thereof.The nano-regulation-based multi-scale insulating and heat-conducting PC composite material comprises 5-10 parts of PC, 1-4 parts of modified hexagonal boron nitride and 0.5-2 parts of multi-scale heat-conducting filler; the multi-scale heat-conducting filler is obtained by grafting aminated CF and PEI to obtain an intermediate and grafting the intermediate with carboxylated CNT, and the mass ratio of the aminated CF to the PEI to the carboxylated CNT is (1-4): 2: 1. According to the PC composite material, the carbon-series material and the BN material are combined, and BN is combined through the carbon-series material to form a heat-conducting bridge, so that heat transfer is accelerated, and continuity of a heat-conducting network and discontinuity of a conductive network are guaranteed.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a multi-scale insulating and heat-conducting PC composite material based on nanometer regulation and a preparation method thereof. Background technique [0002] From the birth to the development of integrated circuits, the size and volume of electronic equipment have been continuously reduced, and the power density has been continuously increased. The resulting heat dissipation problem has become increasingly prominent, which has seriously affected the reliability of equipment operation and the service life of equipment. In the 5G era, the integrated functions of a single electronic device are gradually increasing and becoming more complex, and the volume of the device itself is gradually shrinking. Therefore, higher requirements are placed on the thermal management technology of electronic devices. The polymer composite materials with high thermal conductivity and excel...

AI Technical Summary

Problems solved by technology

In this technical solution, BN is grown on the surface of carbon nanotubes by high-temperature nitriding or carbonization after the solution impregnation process, which has the problem of complex reaction and long time consumption.

For example, the patent with the publication number CN104830044B discloses a high thermal conductivity and antistatic PC / ABS alloy and its preparation method. On carboxylated carbon nanotubes, nano-boron nitride and aluminum nitride are simply grafted, and there is a grafting rate. Low, poor thermal conductivity

For example, the patent with the publication number CN106380630B discloses a preparation method and application of a chemically bonded thermally conductive and insulating composite filler. Since the functional group content on the surface of the carbon material is small, it is only treated with a coupling agent, so that the carbon material is introduced into the carbon material. The introduction of nanoparticles is low, the controllability is poor, and the effect is often not ideal

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