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Nano-regulation-based multi-scale insulating and heat-conducting PC composite material and preparation method thereof

A composite material, insulation and heat conduction technology, applied in the field of multi-scale insulation and heat conduction PC composite materials and its preparation, can solve the problems of long time consumption, complex reaction, poor controllability, etc., to improve the specific surface area and roughness, and overcome the thermal resistance effect , the effect of inhibiting reunion behavior

Active Publication Date: 2022-03-18
XIHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this technical solution, BN is grown on the surface of carbon nanotubes by high-temperature nitriding or carbonization after the solution impregnation process, which has the problem of complex reaction and long time consumption.
For example, the patent with the publication number CN104830044B discloses a high thermal conductivity and antistatic PC / ABS alloy and its preparation method. On carboxylated carbon nanotubes, nano-boron nitride and aluminum nitride are simply grafted, and there is a grafting rate. Low, poor thermal conductivity
For example, the patent with the publication number CN106380630B discloses a preparation method and application of a chemically bonded thermally conductive and insulating composite filler. Since the functional group content on the surface of the carbon material is small, it is only treated with a coupling agent, so that the carbon material is introduced into the carbon material. The introduction of nanoparticles is low, the controllability is poor, and the effect is often not ideal

Method used

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  • Nano-regulation-based multi-scale insulating and heat-conducting PC composite material and preparation method thereof
  • Nano-regulation-based multi-scale insulating and heat-conducting PC composite material and preparation method thereof
  • Nano-regulation-based multi-scale insulating and heat-conducting PC composite material and preparation method thereof

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preparation example Construction

[0030] In the present invention, the preparation method of multi-scale thermally conductive filler (see the schematic diagram of the preparation method figure 1 ), including the following steps:

[0031] The aminated CF was put into PEI aqueous solution, and the intermediate was obtained by step-by-step ultrasonic treatment. The first ultrasonic stage was treated at 170-210W for 8-15min, and the second ultrasonic stage was treated at 45-80W for 5-8h; the intermediate and the carboxylated The chemically treated CNTs were ultrasonically treated at 15-45W for 5-10 hours, and then dried to obtain multi-scale thermally conductive fillers.

[0032] In the present invention, the amination process of CF is as follows: add Tris buffer solution to CF, then add ethanol for blending, add dopamine hydrochloride and stir to obtain a reaction dispersion; the reaction dispersion can be filtered, washed and dried ; The mass ratio of CF to dopamine hydrochloride is 1:0.05~0.3.

[0033]Dopamin...

Embodiment 1

[0047] A method for preparing a multi-scale insulating and heat-conducting PC composite material based on nanometer regulation, comprising the following steps:

[0048] Preparation of S1 multiscale thermally conductive filler

[0049] (1) Packing drying treatment

[0050] The multi-walled carbon nanotubes CNT, carbon fibers CF, and hexagonal boron nitride (h-BN) were all placed in a vacuum drying oven at 90°C for 8 hours.

[0051] (2) Preparation of Tris buffer solution

[0052] Weigh 1.2g of tris (Tris) into a 1L beaker, add deionized water to dissolve to obtain a 10mM Tris solution, then add concentrated hydrochloric acid dropwise to adjust the pH to about 8.5.

[0053] (3) Carboxylation treatment of CNT

[0054] CNTs were soaked in acetone for 24 hours to remove the surface sizing agent, cleaned with deionized water and dried in a vacuum oven at 80°C / 4h, and then mixed acid (concentrated sulfuric acid and concentrated nitric acid at a volume ratio of 3:1) at 60°C ) solu...

Embodiment 2

[0064] The difference between this embodiment and embodiment 1 is that in (5), the mass ratio of CF-PDA, PEI, and CNT-COOH is 2:2:1.

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Abstract

The invention relates to the technical field of high polymer materials, and discloses a nano-regulation-based multi-scale insulating and heat-conducting PC composite material and a preparation method thereof.The nano-regulation-based multi-scale insulating and heat-conducting PC composite material comprises 5-10 parts of PC, 1-4 parts of modified hexagonal boron nitride and 0.5-2 parts of multi-scale heat-conducting filler; the multi-scale heat-conducting filler is obtained by grafting aminated CF and PEI to obtain an intermediate and grafting the intermediate with carboxylated CNT, and the mass ratio of the aminated CF to the PEI to the carboxylated CNT is (1-4): 2: 1. According to the PC composite material, the carbon-series material and the BN material are combined, and BN is combined through the carbon-series material to form a heat-conducting bridge, so that heat transfer is accelerated, and continuity of a heat-conducting network and discontinuity of a conductive network are guaranteed.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a multi-scale insulating and heat-conducting PC composite material based on nanometer regulation and a preparation method thereof. Background technique [0002] From the birth to the development of integrated circuits, the size and volume of electronic equipment have been continuously reduced, and the power density has been continuously increased. The resulting heat dissipation problem has become increasingly prominent, which has seriously affected the reliability of equipment operation and the service life of equipment. In the 5G era, the integrated functions of a single electronic device are gradually increasing and becoming more complex, and the volume of the device itself is gradually shrinking. Therefore, higher requirements are placed on the thermal management technology of electronic devices. The polymer composite materials with high thermal conductivity and excel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08K3/38C08K9/04C08K9/02C08K7/06C08K3/04
CPCC08K9/04C08K9/08C08K9/02C08K3/38C08K7/06C08K3/041C08K2003/385C08K2201/011C08L69/00Y02P20/10
Inventor 赵天宝杨如意顾琳陈宝书毛家容
Owner XIHUA UNIV
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