Alkali-soluble resin, positive photosensitive resin composition, cured film and display device

A technology of positive-type photosensitive resin and alkali-soluble resin, which is applied in the field of positive-type photosensitive resin composition, cured film and display device, and alkali-soluble resin, and can solve problems such as slow dissolution rate, low image resolution, and slow development, and achieve The effect of excellent thermodynamic performance and high exposure sensitivity

Active Publication Date: 2022-04-22
武汉柔显科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For polyamic acid, polyamic acid is more soluble in alkali solution, and adding photoacid generator diazide naphthoquinone can make the photosensitive resin composition resistant to alkali solution to a certain extent, but the image resolution after exposure Low, unsatisfactory pattern
Therefore, in order to adjust the alkali solubility of polyamic acid, polyamic acid / polyimide resin composition has been developed; The proportion of polyimide in the product is closely related to the solubility and the transmittance of ultraviolet light, and has a great influence on the exposure sensitivity and image resolution. Too many ester groups may lead to slow development (slow dissolution rate) , poor contrast, or image resolution

Method used

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  • Alkali-soluble resin, positive photosensitive resin composition, cured film and display device
  • Alkali-soluble resin, positive photosensitive resin composition, cured film and display device
  • Alkali-soluble resin, positive photosensitive resin composition, cured film and display device

Examples

Experimental program
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Effect test

Embodiment

[0108] The above and other advantages of the present invention can be better understood through the following examples, but the following examples are not intended to limit the scope of the present invention.

[0109] Description of abbreviations:

[0110] ODA: 4,4'-diaminodiphenyl ether

[0111] 6FAP: 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane

[0112] SiDA: 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane

[0113] Y1:

[0114] Y2:

[0115] 6FDA: 2,2'-bis(3,4-dicarboxylic acid phenyl)hexafluoropropane dianhydride

[0116] ODPA: 3,3’,4,4’-Diphenyl ether tetracarboxylic dianhydride

[0117] BTDA: 3,3’,4,4’-Benzophenone tetracarboxylic dianhydride

[0118] CBDA: cyclobutane tetracarboxylic dianhydride

[0119] BPDA: 3,3',4,4'-Biphenyltetracarboxylic dianhydride

[0120] X1:

Synthetic example 1

[0122] Synthesis of diamine derivative A1 of 6FDA

[0123] Dissolve 0.1mol of 2-amino-4-nitrophenol in 50ml of acetone and 0.34mol of propylene oxide, cool down to -15°C, and slowly add dropwise the A3 solution synthesized in Synthesis Example 3 (0.048mol, dissolved in 150ml of propylene glycol monomethyl ether), after the dropwise reaction was continued at -15°C for 4h, then warmed up to room temperature, filtered, the filter cake was washed several times with acetone and then vacuum-dried at 50°C for 10h to obtain the nitro intermediate.

[0124] The nitro compound was dissolved in 100ml of NMP, 3g of 5% palladium-carbon was added, hydrogen gas was introduced into the autoclave, stirring was continued at room temperature for 6h, then the reaction solution was filtered to remove the catalyst, the filtrate was poured into water, and a solid product was precipitated. Filtration and vacuum drying at 50° C. for 24 h gave the diamine derivative A1 of 6FDA.

[0125]

Synthetic example 2

[0127] Synthesis of diamine derivative A2 of 6FDA

[0128] The only difference from Synthesis Example 1 is that the raw material A3 is replaced by A4 synthesized in Synthesis Example 4, and other conditions remain unchanged, and the diamine derivative A2 of 6FDA is obtained.

[0129]

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Abstract

The invention discloses alkali-soluble resin, a positive photosensitive resin composition, a cured film and a display device, and relates to the technical field of photosensitive resin materials. The alkali-soluble resin structurally comprises a structural unit with the following structural formula (a1) or/and a structural unit with the following structural formula (a2), wherein in the structural formula (a1) and the structural formula (a2), A is an acid dianhydride residue. The positive photosensitive resin composition with high exposure sensitivity and excellent thermodynamic property is obtained by adjusting the adding amount and adding time of the compound or oligomer containing the structural formula (a1) or (a2), designing the alkali-soluble resin with different structures containing the structural formula (a1) or (a2) and increasing the ratio of the dissolution rate of the exposed part to the dissolution rate of the unexposed part.

Description

technical field [0001] The invention relates to the technical field of photosensitive resin materials, in particular to an alkali-soluble resin, a positive photosensitive resin composition, a cured film and a display device. Background technique [0002] Polyimide (PI) is an ideal polymer material with excellent heat resistance, mechanical properties, electrical insulation properties and chemical stability, and is often used in the fields of aerospace, semiconductors, optoelectronics and microelectronics. Compared with ordinary polyimide, photosensitive polyimide (PSPI) can realize pattern processing without the help of other photoresists, shorten the process route, and is an ideal insulating material in the field of electronics and microelectronics. [0003] In recent years, with the miniaturization of the development of semiconductor components, the interlayer insulating film and passivation layer of semiconductor components also need finer exposure and development sensiti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10G03F7/004G03F7/039
CPCC08G73/1075C08G73/1007G03F7/004G03F7/039
Inventor 周小明王元强肖桂林鲁丽平朱双全
Owner 武汉柔显科技股份有限公司
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