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Preparation method of polyether imide flexible printed circuit substrate material

A polyetherimide flexible and circuit substrate technology, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of poor adhesion between biphenyl polyimide and copper foil, and achieve improved flexibility, Effect of Adhesive Improvement

Inactive Publication Date: 2003-04-16
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem of poor adhesion between biphenyl type polyimide and copper foil with rigid structure, the present invention adopts a monomer containing ether bond, triphenyl ether tetraacid dianhydride, to modify biphenyl type polyimide , due to the existence of ether bonds, the flexibility of the polymer is improved, and the adhesion between the resin and the copper foil is greatly improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] At room temperature, add 4.023 grams (0.01mol) of triphenylene tetracarboxylic acid dianhydride and 11.768 grams (0.04mol) of biphenyl tetracarboxylic acid dianhydride in a 500-milliliter three-necked flask, add 210 milliliters of N-methylpyrrolidone, and Add 3.244 g (0.03 mol) of p-phenylenediamine and 4.246 g (0.02 mol) of 3,3'-dimethyl-4,4'-diaminobiphenyl under a nitrogen atmosphere and react for 6 hours, the solid raw materials are all dissolved and form Polyether amic acid varnish with a viscosity of 15 Pa.S (25°C), press-filtered with a filter membrane with a pore size of 5 microns to obtain a clean paint solution.

[0011] The above varnish is coated on a clean glass plate to form a film, and the thickness of the coating is controlled to be 20-30 microns after the solvent evaporates completely. After heat treatment at 60° C. for 30 minutes, 100° C. for 10 minutes, 140° C. for 10 minutes, 180° C. for 10 minutes, and 300° C. for 10 minutes, a polyetherimide film w...

Embodiment 2

[0014] At room temperature, add 6.034 grams (0.015mol) of triphenylenediyl ether tetra-acid dianhydride and 10.297 grams (0.035 mol) of biphenyl tetra-acid dianhydride into a 500-ml three-necked flask, and add 220 ml of N,N-dimethyl Acetamide, add 3.244 grams (0.03mol) p-phenylenediamine, 4.246 grams (0.02mol) 3,3'-dimethyl-4,4'-diaminobiphenyl under nitrogen atmosphere and react for 6 hours, the solid raw material All dissolved to form a polyether amic acid varnish with a viscosity of 12 Pa.S (25°C), press-filtered with a filter membrane with a pore size of 5 microns to obtain a clean paint solution.

[0015] Adopt the method identical with embodiment 1 above-mentioned varnish to be coated on clean glass plate and copper foil and form film, measure the coefficient of linear expansion (CTE) of film after heat treatment to be 24 * 10 -6 (1 / K). The peel strength of the polyetherimide copper foil composite film is 1.43Kg / cm.

Embodiment 3

[0017] At room temperature, 8.046 grams (0.02mol) of triphenylene tetracarboxylic dianhydride and 8.826 grams (0.03mol) of biphenyltetracarboxylic dianhydride were added to a 500-milliliter three-necked bottle, and 220 milliliters of N-methylpyrrolidone was added. Add 3.244 g (0.03 mol) of p-phenylenediamine and 4.246 g (0.02 mol) of 3,3'-dimethyl-4,4'-diaminobiphenyl under a nitrogen atmosphere and react for 6 hours, the solid raw materials are all dissolved and form Polyether amic acid varnish with a viscosity of 10 Pa.S (25°C), press-filtered with a filter membrane with a pore size of 5 microns to obtain a clean paint solution.

[0018] Adopt the method identical with embodiment 1 above-mentioned varnish to be coated on clean glass plate and copper foil and form film, measure the coefficient of linear expansion (CTE) of film after heat treatment to be 30 * 10 -6 (1 / K). The peel strength of the polyetherimide copper foil composite film is 1.52Kg / cm.

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Abstract

A process for preparing the polyether imide material as the base material of flexible printed circuit includes such steps as polycondensation between triphenyldiether tetrabasic acid bianhydride, biphenyl tetrabasic acid bianhydride, p-phenyldiamine and 3,3'-dimethyl-4,4'-diaminobibenzene, synthesizing polyamide, varnish, coating it on copper foil and high-temp. imidating. Its advantages are low expansibility and no curling.

Description

technical field [0001] The invention belongs to a preparation method of polyetherimide flexible printed circuit substrate. Background technique [0002] Flexible circuits are key components to realize multi-function, integration, miniaturization and low cost of electronic information products. A conventional flexible printed circuit substrate consists of three layers, namely a metal foil conductive layer, a polyimide film layer and an adhesive layer. The production process of the flexible printed circuit is first to laminate the polyimide film as the base film and the copper foil to form a laminate, and then form a circuit pattern on the copper foil by etching; then, laminate the cover film to the circuit on the graphic surface. Adhesives used for bonding between base film and copper foil, circuit pattern and cover film mainly use acrylic series and epoxy series. Due to the low heat resistance and high water absorption of these adhesives, the excellent performance of poly...

Claims

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Application Information

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IPC IPC(8): C08G73/10H05K1/03
Inventor 杨正华张春华王彤彭波魏玉兰
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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