Carbon, ceramic-nonmetallic material and metal material connection method

A technology of non-metallic materials and connection methods, applied in the field of connection between carbon, ceramic non-metallic materials and metal materials, to achieve the effect of simple process and easy implementation

Inactive Publication Date: 2004-09-15
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to address the deficiencies in the prior art, to provide a method for connecting carbon and ceramic non-metallic materials and metal materials, which is simple in process and easy to implement, and can effectively solve the problem of non-metallic structural parts including carbon fiber reinforced carbon-based composite materials and ceram

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] After surface treatment of carbon / carbon composite material by conventional processes such as degreasing, activation, sensitization, and pre-plating, electroless nickel plating is used to deposit 10 microns of nickel-phosphorus alloy coating on the surface of the substrate, cleaned, and placed on the cathode of the power supply , Put into electroforming nickel electrolyte, the electrolyte formula is: nickel sulfamate 300g / L, nickel chloride 5g / L, boric acid 40g / L, sodium lauryl sulfate 0.1g / L, saccharin 0.8g / L, PH is 4.0. Temperature 55℃, current density 28A / dm 2 , The deposition rate is 300~350μm / hour. After 20 hours of electroforming, the thickness of the plating layer is greater than 6mm, and the surface of the plating layer has no defects or cracks. When machined, it has metal toughness and is easy to turn. The plating layer is tightly combined with the carbon / carbon composite material, and there is no gap at the interface. The airtight experiment proves that there is ...

Embodiment 2

[0021] Al 2 O 3 After the ceramic parts are treated by conventional surface treatment processes of degreasing, activation, sensitization, pre-plating, and electroless copper plating, a copper plating layer of 10 microns is deposited on the surface of the substrate, cleaned, placed on the cathode of the power supply, and put into electroforming copper electrolysis In the solution, the formula is as follows: copper sulfate 240g / L, sulfuric acid 60g / L, polyethylene glycol 0.05g / L. Temperature 30℃, current density 5.5A / dm 2 , The deposition rate is 60~70μm / hour. After 40 hours of electroforming, the thickness of the coating is greater than 2mm, there are a few burrs on the surface of the coating, no cracks, the coating is soft, the machining performance is good, and it is easy to turn and thread. Airtight test proves that the coating and substrate Al 2 O 3 The ceramic parts are tightly combined, no gaps, and no air leakage under 3Mpa pressure. The coating can be directly welded or thr...

Embodiment 3

[0023] After degreasing, activation, sensitization, pre-plating, and electroless nickel plating, the carbon / carbon composite material is treated by conventional surface treatment processes, and a nickel-phosphorus alloy plating layer of 10 microns is deposited on the surface of the substrate. After cleaning, it is placed on the cathode of the power supply. Into the compound electroforming nickel electrolyte, choose SiC p Ceramic particles are used as the reinforcing phase with an average particle size of 5μm. The formula is as follows: nickel sulfamate 300g / L, nickel chloride 5g / L, boric acid 40g / L, SiC p (5μm) 20g / L, cetyltrimethylammonium bromide 0.1g / L, pH 4.0. Temperature 55℃, mechanical stirring, current density 5A / dm 2 , The deposition rate is 60~70μm / hour. After 30 hours of electroforming, the thickness of the coating is greater than 2mm, the surface of the coating is dark, there is no metallic luster, no defects and cracks. The coating toughness is reduced, but it can stil...

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Abstract

The invention is a method to link carbon and ceramic nonmetallic materials with metallic material, firstly adopting nonmetallic material surface metalizing technique to form a layer electro-conductive metallic substrate on the nonmetallic material basal body, then electroforming to deposit a 1-10nm thick metallic or compound coat on the substrate, and for improving thermal expansion matching performance of nonmetallic and metallic materials, adding reinforcing bodies like second-phase ceramic particles or crystal tassels, etc to the electroforming solution, where the thermal expansion coefficient of compound electroformed coat is controlled at 4-12X10 to the power -6/deg.C. It uses weldable and plastic processing performances of metallic electroformed coat, to realize the effective linkage of metalized modified nonmetallic material with metallic material structural component by welding or other mechanical linking methods.

Description

Technical field: [0001] The invention relates to a method for connecting carbon and ceramic non-metallic materials and metal materials, which combines the surface metallization of non-metal materials, the principle of composite electrodeposition and electroforming technology, and prepares metal or metal composite coatings on the surface of non-metal materials, and uses metal The weldability and plastic processing performance of the electroforming coating solves the connection problem of non-metallic materials and metal structural parts, and is suitable for the connection of carbon materials, carbon-based composite materials, ceramic materials, and ceramic composite materials and metals. It belongs to the technical field of composite materials. Background technique: [0002] Carbon materials include carbon-based composite materials (such as carbon fiber-reinforced carbon-based or particle-reinforced carbon-based composite materials, etc.) and ceramic materials, including ceramic c...

Claims

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Application Information

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IPC IPC(8): C04B37/02C04B41/88C23C18/31C23C28/02C25D1/00
Inventor 刘磊胡文彬沈彬丁文江张荻
Owner SHANGHAI JIAO TONG UNIV
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