Capillary pump cooler with micro-groove wing structure and its manufacturing method

A cooling device and micro-groove technology, applied in cooling/ventilation/heating renovation, lighting and heating equipment, indirect heat exchangers, etc. It can solve the problems of chemical and other problems, and achieve the effect of thin heat sink, no mechanical moving parts, and simple structure.
CN1801483AInactive Publication Date: 2006-07-12SOUTH CHINA UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SOUTH CHINA UNIV OF TECH
Publication Date
2006-07-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a capillary pumping cooling device with micro-groove wing structure, which comprises: an evaporator connected to a condensator by a steam union pipe and a liquid union pipe to form a system for operating means circulation; arranging a plurality of crossed-intercommunicating boiling strengthened plates with micro-groove wing structure on both sides. This invention is used mainly for heat dissipation of micro-electron chip. Wherein, this invention uses plough cutting-extrusion molding technology for micro-groove wing structure and planing forming technology for integrated wing cooling fin with low cost and high efficiency, which benefits to reinforce boiling, promote condensation and speed up convective dissipating heat.
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Description

technical field

[0001] The invention relates to a cooling technology, especially a cooling technology for electronic chips. Specifically, it adopts the principle of phase change for heat transfer, and is mainly used for heat dissipation of microelectronic chips to solve the problem of thermal diffusion of microelectronic chips under the condition of high heat flux density. A capillary pump cooling device with a micro-groove fin structure and a manufacturing method thereof. Background technique

[0002] With the rapid development of microelectronics technology, electronic products tend to develop in the direction of high performance, portability and miniaturization. The improvement of main frequency and integration of microprocessor chips has led to the problem of high heat flux, which has become the primary problem restricting the development of high-integration chip technology. For chips with high heat flux density, if the generated heat cannot be exported in time, the hea...

Claims

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