Reinforcement method of electric spark on surface of copper or copper alloy

An electric spark, copper alloy technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of high specific gravity, processing and forming, dimensional accuracy and organization uniformity are not easy to ensure, to improve the use of performance, increased penetration depth, improved surface quality effects
CN1920090AInactive Publication Date: 2007-02-28INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
Publication Date
2007-02-28
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates the method for electric spark deposition treatment on the copper or copper alloy surface. The method comprises the following steps: using copper or copper alloy as raw material, and using electric spark device to carry out deposition treatment, at the protection of argon gas, argon gas and helium. The output power is 400-1300W, the transmission voltage is 60-80V, the discharge frequency is 100-700Hz, the protection gas flow is 18-30L / min, and the deposition time is 3-15 min. The invention has not many complex devices as vapor deposition and vacuum sintering; the invention can deposit reiteratively, and has simple operation; the method has narrow heat-affected zone or no heat-affected zone; the method has not preheating before deposition and annealing treatment after deposition.
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Description

technical field

[0001] The invention belongs to a metal surface treatment method, in particular to a method for performing electric spark deposition treatment on the surface of copper or copper alloy (mainly the material of a red copper drug-type cover). Background technique

[0002] At present, red copper is used as the material of the drug-type cover. This is because the density of copper is relatively high, and it has a certain strength. It has better plasticity under super-dynamic load.

[0003] The composition of the drug-type cover copper plate is an important factor affecting its quality. The presence of oxygen in the copper plate is harmful, it is Cu 2 The O form exists, and when the oxygen content is high, the cuprous oxide is distributed in a band shape, which seriously reduces the plasticity of the copper plate, increases the brittleness, and reduces the punching and spinning performance of the copper plate. The crystallographic orientation of the copper plate i...

Claims

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