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Reinforcement method of electric spark on surface of copper or copper alloy

An electric spark, copper alloy technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of high specific gravity, processing and forming, dimensional accuracy and organization uniformity are not easy to ensure, to improve the use of performance, increased penetration depth, improved surface quality effects

Inactive Publication Date: 2007-02-28
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The jet flow formed by the metal of the new liner has a high specific gravity, and its penetration performance is better than that of the copper liner. However, it is not easy to guarantee the processing, dimensional accuracy, and uniformity of the structure, and the processing and manufacturing of the liner should be reduced as much as possible. cost

Method used

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  • Reinforcement method of electric spark on surface of copper or copper alloy
  • Reinforcement method of electric spark on surface of copper or copper alloy
  • Reinforcement method of electric spark on surface of copper or copper alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The base material used in the experiment is the red copper material (the mass percentage of copper reaches 99.9%) made of the armor-piercing drug type cover, the size is 16mm × 16mm × 3mm, and the electrode uses a tungsten electrode rod (model: WCe20, dopant CeO 2 , content 1.8% to 2.2%, the rest is W), and the diameter is φ3mm.

[0047] The experimental equipment used the metal surface strengthening and repairing machine (3H-ES-X800, 3H-ES-1500, 3H-ES-3000) produced by the Institute of Metal Research, Chinese Academy of Sciences (for details, see the Chinese utility model patent, the patent number is 03214166.1). During the deposition process, the argon gas protection is introduced, the electrode material adopts self-rotation mode (axial rotation), the electrode rotation speed is 3000r / min, and the clamping mode of the electrode is mechanical mode. The parameters of EDM deposition are: output power: 420W; discharge frequency: 200Hz; output voltage: 60V; specific depo...

Embodiment 2

[0050] The difference from Example 1 is:

[0051] The electrode uses a Cu-W electrode (Cu-W75, mass percentage: Cu 25%, impurity 0.3%, and the rest is W) manufactured by powder metallurgy, with a diameter of φ3.6mm.

[0052] The experimental equipment still uses the metal surface strengthening and repairing machine (model 3H-ES-X800, 3H-ES-1500, 3H-ES-3000) produced by the Institute of Metal Research, Chinese Academy of Sciences. Argon protection is introduced during the deposition process, and the electrode material is made of Self-rotation mode (axial rotation), the electrode rotation speed is 3000r / min, and the electrode clamping method is mechanical. The parameters of EDM deposition are: output power: 420W; discharge frequency: 100Hz; output voltage: 60V; specific deposition time: 5min; protective gas flow rate: 30L / min. During the experiment, the copper substrate and electrode material were first polished with 800# water sandpaper to remove impurities such as copper rust...

Embodiment 3

[0057] The difference from Example 1 is:

[0058] The electrode uses cemented carbide YG8, its main component is WC (tungsten carbide is the main component of YG series alloys), and its diameter is φ4mm. The deposition parameters are: output power: 420W; discharge frequency: 100Hz; output voltage: 60V; specific deposition time 5min; protective gas flow rate: 30L / min.

[0059] As shown in Figure 5, the surface morphology of EDM deposited WC (YG8) on Cu surface; as shown in Figure 6, the cross-sectional structure of EDM deposited WC on Cu surface (800×). The deposition points are not very continuous, and the deposition layer is relatively thin, but the transition layer is relatively thick. Compared with the deposition with W electrode, the deposition layer is relatively similar, but the white spots are much less, and there are more black substances, and the transition layer between the deposition surface layer and the substrate is more obvious. We already know that the white s...

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Abstract

The invention relates the method for electric spark deposition treatment on the copper or copper alloy surface. The method comprises the following steps: using copper or copper alloy as raw material, and using electric spark device to carry out deposition treatment, at the protection of argon gas, argon gas and helium. The output power is 400-1300W, the transmission voltage is 60-80V, the discharge frequency is 100-700Hz, the protection gas flow is 18-30L / min, and the deposition time is 3-15 min. The invention has not many complex devices as vapor deposition and vacuum sintering; the invention can deposit reiteratively, and has simple operation; the method has narrow heat-affected zone or no heat-affected zone; the method has not preheating before deposition and annealing treatment after deposition.

Description

technical field [0001] The invention belongs to a metal surface treatment method, in particular to a method for performing electric spark deposition treatment on the surface of copper or copper alloy (mainly the material of a red copper drug-type cover). Background technique [0002] At present, red copper is used as the material of the drug-type cover. This is because the density of copper is relatively high, and it has a certain strength. It has better plasticity under super-dynamic load. [0003] The composition of the drug-type cover copper plate is an important factor affecting its quality. The presence of oxygen in the copper plate is harmful, it is Cu 2 The O form exists, and when the oxygen content is high, the cuprous oxide is distributed in a band shape, which seriously reduces the plasticity of the copper plate, increases the brittleness, and reduces the punching and spinning performance of the copper plate. The crystallographic orientation of the copper plate i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/22C23C14/14
Inventor 王茂才陈长军王东生
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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